Abstract: This invention describes a triangular heat sink and circuit enclosure for high power dissipation electronic circuits. The heat sink uses a number of cooling fins to provide cooling of the circuitry and equipment contained in the circuit enclosure and can handle power dissipation levels of up to 15 kilowatts. The circuit enclosure uses air moving devices and triangular heat sinks to provide both conduction cooling and heat transfer to a stream of air. The cooling fins of the heat sink are sealed away from the electronic components when the circuit enclosure is assembled.

Abstract: This invention provides a means to maintain the rotational speed and the relationship of the electromagnetic fields of a three phase induction motor and to determine the minimum voltage to excite the motor without it stalling. The three phase induction motor is driven by an inverter bridge circuit which converts DC input power into three phase AC output power. Feedback of the current provided to the inverter bridge circuit is split into positive and negative current flow periods which are used to determine appropriate changes to the three phase AC power magnitudes and phase angles. The inverter bridge circuit uses six insulated gate bipolar transistors to control the three phase AC power magnitude and phase angles.