Patents by Inventor Michael John Van Riet

Michael John Van Riet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Scanner performance comparison and matching using design and defect data
    Patent number: 8594823
    Abstract: A system and method of matching multiple scanners using design and defect data are described. A golden wafer is processed using a golden tool. A second wafer is processed using a second tool. Both tools provide focus/exposure modulation. Wafer-level spatial signatures of critical structures for both wafers can be compared to evaluate the behavior of the scanners. Critical structures can be identified by binning defects on the golden wafer having similar patterns. In one embodiment, the signatures must match within a certain percentage or the second tool is characterized as a “no match”. Reticles can be compared in a similar manner, wherein the golden and second wafers are processed using a golden reticle and a second reticle, respectively.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: November 26, 2013
    Assignee: KLA—Tencor Corporation
    Inventors: Allen Park, Ellis Chang, Masami Aoki, Chris Chih-Chien Young, Martin Plihal, Michael John Van Riet
  • Scanner Performance Comparison And Matching Using Design And Defect Data
    Publication number: 20110172804
    Abstract: A system and method of matching multiple scanners using design and defect data are described. A golden wafer is processed using a golden tool. A second wafer is processed using a second tool. Both tools provide focus/exposure modulation. Wafer-level spatial signatures of critical structures for both wafers can be compared to evaluate the behavior of the scanners. Critical structures can be identified by binning defects on the golden wafer having similar patterns. In one embodiment, the signatures must match within a certain percentage or the second tool is characterized as a “no match”. Reticles can be compared in a similar manner, wherein the golden and second wafers are processed using a golden reticle and a second reticle, respectively.
    Type: Application
    Filed: July 12, 2010
    Publication date: July 14, 2011
    Applicant: KLA-Tencor Corporation
    Inventors: Allen Park, Ellis Chang, Masami Aoki, Chris Chih-Chien Young, Martin Plihal, Michael John Van Riet