Abstract: Footwear, such as slides, are shown and disclosed. In some embodiments, the footwear may include an insole having an insole base and at least one strap formed with the insole base. The footwear may additionally include a midsole having an elongate midsole base. The midsole may be separate and distinct from the insole. The midsole base may have an elongate cavity that receives the insole base.

Abstract: Golf tool devices and golf clubs having those devices attached to, or incorporated with, their grips are disclosed. In some embodiments, the golf tool device includes a housing and a tool assembly attached to the housing. The tool assembly includes a base jaw and a gripper jaw pivotably connected to the base jaw. The tool assembly additionally includes a spring connected to the gripper jaw and configured to urge the gripper jaw toward the base jaw. The golf tool device additionally includes a mode selector assembly configured to selectively switch operation of the gripper jaw between at least two modes. The at least two modes include a first mode in which the gripper jaw moves in response to urging of the spring, and a second mode in which the gripper jaw is secured in a first position that is spaced away from the base jaw against urging of the spring.

Abstract: Golf tool devices and golf clubs having those devices attached to, or incorporated with, their grips are disclosed. In some embodiments, the golf tool device includes a housing and a tool assembly attached to the housing. The tool assembly includes a base jaw and a gripper jaw pivotably connected to the base jaw. The tool assembly additionally includes a spring connected to the gripper jaw and configured to urge the gripper jaw toward the base jaw. The golf tool device additionally includes a mode selector assembly configured to selectively switch operation of the gripper jaw between at least two modes. The at least two modes include a first mode in which the gripper jaw moves in response to urging of the spring, and a second mode in which the gripper jaw is secured in a first position that is spaced away from the base jaw against urging of the spring.

Abstract: Golf tool devices and golf clubs having those devices attached to, or incorporated with, their grips are disclosed. In some embodiments, the golf tool device includes a housing and a tool assembly attached to the housing. The tool assembly includes a base jaw and a gripper jaw pivotably connected to the base jaw. The tool assembly additionally includes a spring connected to the gripper jaw and configured to urge the gripper jaw toward the base jaw. The golf tool device additionally includes a mode selector assembly configured to selectively switch operation of the gripper jaw between at least two modes. The at least two modes include a first mode in which the gripper jaw moves in response to urging of the spring, and a second mode in which the gripper jaw is secured in a first position that is spaced away from the base jaw against urging of the spring.

Abstract: Golf tool devices and golf clubs having those devices attached to, or incorporated with, their grips are disclosed. In some embodiments, the golf tool device includes a housing and a tool assembly attached to the housing. The tool assembly includes a base jaw and a gripper jaw pivotably connected to the base jaw. The tool assembly additionally includes a spring connected to the gripper jaw and configured to urge the gripper jaw toward the base jaw. The golf tool device additionally includes a mode selector assembly configured to selectively switch operation of the gripper jaw between at least two modes. The at least two modes include a first mode in which the gripper jaw moves in response to urging of the spring, and a second mode in which the gripper jaw is secured in a first position that is spaced away from the base jaw against urging of the spring.

Abstract: Golf tool devices and golf clubs having those devices attached to, or incorporated with, their grips are disclosed. In some embodiments, the golf tool device includes a housing and a tool assembly attached to the housing. The tool assembly includes a base jaw and a gripper jaw pivotably connected to the base jaw. The tool assembly additionally includes a spring connected to the gripper jaw and configured to urge the gripper jaw toward the base jaw. The golf tool device additionally includes a mode selector assembly configured to selectively switch operation of the gripper jaw between at least two modes. The at least two modes include a first mode in which the gripper jaw moves in response to urging of the spring, and a second mode in which the gripper jaw is secured in a first position that is spaced away from the base jaw against urging of the spring.

Abstract: A probe head including an elastic membrane capable of exerting a restoring force when one of the surfaces of the elastic membrane is distorted. A conductive probe includes a beam having a first end and a second end, with a probe tip proximate the first end for contacting a device under test. A beam contact proximate the second end of the beam. The beam being movable to deform at least one surface of the elastic membrane.

Abstract: A method for rinsing and drying a workpiece includes placing the workpiece into a chamber and spinning the workpiece. A rinsing fluid, such as water, is applied onto the workpiece through a first outlet in the chamber, with the rinsing fluid moving outwardly towards the edge of the workpiece via centrifugal force, to rinse the workpiece. A drying fluid, such as an alcohol vapor, is applied onto the workpiece through the first outlet, with the drying fluid moving outwardly towards the edge of the workpiece via centrifugal force, to dry the workpiece. The drying fluid advantageously follows a meniscus of the rinsing fluid across the workpiece surface. The rinsing fluid, or the drying fluid, or both fluids, may be applied near or at a central area of the workpiece.

Abstract: This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece and corresponding reactor are spinning about an axis of rotation that is generally orthogonal to the center of the face of the workpiece being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract: A probe head with membrane suspended probes.

Abstract: A probe head including an elastic membrane capable of exerting a restoring force when one of the surfaces of the elastic membrane is distorted. A conductive probe includes a beam having a first end and a second end, with a probe tip proximate the first end for contacting a device under test. A beam contact proximate the second end of the beam. The beam being movable to deform at least one surface of the elastic membrane.

Abstract: A method for rinsing and drying a workpiece includes placing the workpiece into a chamber and spinning the workpiece. A rinsing fluid, such as water, is applied onto the workpiece through a first outlet in the chamber, with the rinsing fluid moving outwardly towards the edge of the workpiece via centrifugal force, to rinse the workpiece. A drying fluid, such as an alcohol vapor, is applied onto the workpiece through the first outlet, with the drying fluid moving outwardly towards the edge of the workpiece via centrifugal force, to dry the workpiece. The drying fluid advantageously follows a meniscus of the rinsing fluid across the workpiece surface. The rinsing fluid, or the drying fluid, or both fluids, may be applied near or at a central area of the workpiece.

Abstract: A probe head with membrane suspended probes.

Abstract: In a process for removing etch residue, liquid including an acid and an oxidizer is applied to the back side and peripheral edge of a wafer. The front or device side of the wafer is left unprocessed, or may be exposed to an inert fluid such as a purge gas (e.g., nitrogen or helium), to a rinse such as deionized water, or to another processing fluid such as a more highly diluted etchant. The front side of the wafer is either left unprocessed, or is processed to a lesser degree without damage to the underlying devices, metal interconnects or semiconductor layers.

Abstract: A processing fluid is selectively applied or excluded from an outer peripheral margin of the front side, back side, or both sides of a workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece is spinning. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract: In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral-margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract: This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece and corresponding reactor are spinning about an axis of rotation that is generally orthogonal to the center of the face of the workpiece being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract: This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece and corresponding reactor are spinning about an axis of rotation that is generally orthogonal to the center of the face of the workpiece being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract: This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece and corresponding reactor are spinning about an axis of rotation that is generally orthogonal to the center of the face of the workpiece being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract: In a method for cleaning a copper surface of a semiconductor wafer or article, nitrogen gas is bubbled or dissolved into a strong alkaline solution, displacing dissolved oxygen from the solution. A nitrogen gas environment is provided over the copper surface. The alkaline solution is then applied to the copper surface. The copper etch rate is greatly reduced. The method is useful in removing residual polishing slurry after a chemical-mechanical polishing step, and for removing residues left in via holes after plasma etching.