Abstract: A heat sink for cooling an electronic component includes a substrate comprising an electrically non-conductive material and an inlet port and an outlet port extending outward from the substrate. The inlet and outlet ports are fluidically coupled to a fluid flow surface of the heat sink by passages that extend through a portion of the substrate. The heat sink also includes a shield comprising an electrically conductive material. The shield is disposed atop or within the substrate and is configured to suppress electromagnetic interference generated by an electronic component coupled to the heat sink.

Abstract: A device for cooling an electronic component includes a substrate having a component mounting surface and a fluid flow surface recessed relative to the component mounting surface. The device also includes an inlet orifice positioned proximate a first end of the fluid flow surface and an outlet orifice positioned proximate a second end of the fluid flow surface. A pattern of surface features is arranged on the fluid flow surface. The pattern of surface features is configured to entrain a coolant flowing across the fluid flow surface and redirect the coolant upward and away from the fluid flow surface.

Abstract: A power module includes an input bus, a switching device, and an output bus. The input bus includes a first coating of a high permeability magnetic conductive material and is configured to receive input direct current (DC) electrical power from an electrical power source. The switching device is electrically coupled to the first input bus, and is configured to selectively connect and disconnect to facilitate converting the input DC electrical power into output alternating current (AC) electrical power. The output bus includes a second coating of the high permeability magnetic conductive material, and is electrically coupled to the first switching device. The output bus is configured to supply the output AC electrical power to an electrical load.

Abstract: A feedthrough includes a flange comprising an inner cylindrical surface and a planar mounting surface. The inner cylindrical surface defines a cylindrical passage within the flange. The feedthrough further includes a printed circuit board (“PCB”) mounted on the planar mounting surface of the flange, and an electrically conductive element that extends through the cylindrical passage of the flange.

Abstract: A feedthrough includes a flange comprising an inner cylindrical surface and a planar mounting surface. The inner cylindrical surface defines a cylindrical passage within the flange. The feedthrough further includes a printed circuit board (“PCB”) mounted on the planar mounting surface of the flange, and an electrically conductive element that extends through the cylindrical passage of the flange.

Abstract: A power module includes an input bus, a switching device, and an output bus. The input bus includes a first coating of a high permeability magnetic conductive material and is configured to receive input direct current (DC) electrical power from an electrical power source. The switching device is electrically coupled to the first input bus, and is configured to selectively connect and disconnect to facilitate converting the input DC electrical power into output alternating current (AC) electrical power. The output bus includes a second coating of the high permeability magnetic conductive material, and is electrically coupled to the first switching device. The output bus is configured to supply the output AC electrical power to an electrical load.

Abstract: A system includes a SiC semiconductor power device; a power supply board that is configured to provide power to a first gate driver board via a connector; the first gate driver board that is coupled and configured to provide current to the SiC semiconductor power device, wherein the first gate driver board is coupled to the power supply board via the connector, and wherein the first gate driver board is separated from the power supply board; and an interconnect board that is coupled to the first gate driver board, wherein the interconnect board is configured to couple the first gate driver board a second gate driver board.

Abstract: A system includes a SiC semiconductor power device; a power supply board that is configured to provide power to a first gate driver board via a connector; the first gate driver board that is coupled and configured to provide current to the SiC semiconductor power device, wherein the first gate driver board is coupled to the power supply board via the connector, and wherein the first gate driver board is separated from the power supply board; and an interconnect board that is coupled to the first gate driver board, wherein the interconnect board is configured to couple the first gate driver board a second gate driver board.

Abstract: An electric motor is configured with a stator core assembly that includes a stator core having a plurality of winding slots. A plurality of stator windings pass through the plurality of winding slots that include slot liners configured to provide electrostatic shields surrounding the plurality of stator windings. The electrostatic shields are referenced to an electrical location to reduce common mode currents associated with the electric motor.

Abstract: A power conversion system is presented. The system includes a power source coupled to a power converter and a controller. The controller is configured to determine a value of at least one parameter corresponding to the power source. Additionally, the controller is configured to provide a first portion of the at least one parameter to the power converter and modify an operating frequency of the power converter, duty ratio of the power converter, or a combination thereof. Furthermore, the controller is configured to obtain an electrical quantity at an output of the power converter based on the modified operating frequency, the modified duty ratio, or a combination thereof. Also, the controller is configured to deliver a combination of the electrical quantity obtained at the output of the power converter and a second portion of the at least one parameter to a load. Method for converting power is also presented.

Abstract: A device to attenuate EMI between a source and a load is provided. The device includes a first cable to electrically couple the source and the load and a second cable positioned adjacent to the first cable and configured to attenuate a common-mode current.

Abstract: An electric motor is configured with a stator core assembly that includes a stator core having a plurality of winding slots. A plurality of stator windings pass through the plurality of winding slots that include slot liners configured to provide electrostatic shields surrounding the plurality of stator windings.

Abstract: An alternating current to direct current (AC to DC) power conversion system is provided. The system includes a rectifier configured to convert an input AC voltage to an initial pulsating DC voltage. The system also includes an inverter configured to convert the initial pulsating DC voltage to a converted AC voltage. The system further includes a plurality of transformers, each transformer including a primary winding paired to a secondary winding, wherein each of the primary windings is coupled in series with the other primary windings, wherein the series coupled primary windings are coupled to the inverter to receive respective portions of the converted AC voltage. The system also includes a plurality of bridges, each bridge coupled to a respective secondary winding configured to receive a respective portion of a transformed AC voltage from the respective secondary windings, and coupled in parallel to the other bridges to provide a combined DC output voltage.

Abstract: An alternating current to direct current (AC to DC) power conversion system is provided. The system includes a rectifier configured to convert an input AC voltage to an initial pulsating DC voltage. The system also includes an inverter configured to convert the initial pulsating DC voltage to a converted AC voltage. The system further includes a plurality of transformers, each transformer including a primary winding paired to a secondary winding, wherein each of the primary windings is coupled in series with the other primary windings, wherein the series coupled primary windings are coupled to the inverter to receive respective portions of the converted AC voltage. The system also includes a plurality of bridges, each bridge coupled to a respective secondary winding configured to receive a respective portion of a transformed AC voltage from the respective secondary windings, and coupled in parallel to the other bridges to provide a combined DC output voltage.

Abstract: A circuit board assembly is configured to attenuate and prevent electro-magnetic fields from interfering with operation below a desired cutoff frequency, of electro-magnetic interference (EMI) susceptible circuit board electronics disposed within a shielded enclosure, while allowing signals to be transmitted between the EMI susceptible circuit board electronics at frequencies below the desired cutoff frequency, and circuits or devices external to the shielded enclosure.

Abstract: A device to attenuate EMI between a source and a load is provided. The device includes a first cable to electrically couple the source and the load and a second cable positioned adjacent to the first cable and configured to attenuate a common-mode current.

Abstract: An optically powered drive circuit and a method for controlling a first semiconductor switch are provided. The optically powered drive circuit includes a photovoltaic cell configured to receive a first light signal from a fiber optic cable and to output a first voltage in response to the first light signal. The optically powered drive circuit further includes an energy storage device electrically coupled to the photovoltaic cell configured to store electrical energy received from the first voltage and to output a second voltage. The optically powered drive circuit further includes an electrical circuit electrically coupled to both the photovoltaic cell and the energy storage device. The electrical circuit is energized by the second voltage. The electrical circuit is configured to receive the first voltage and to output a third voltage in response to the first voltage for controlling operation of the first semiconductor switch.

Abstract: A circuit board assembly is configured to attenuate and prevent electromagnetic fields from interfering with operation below a desired cutoff frequency, of electromagnetic interference (EMI) susceptible circuit board electronics disposed within a shielded enclosure, while allowing signals to be transmitted between the EMI susceptible circuit board electronics at frequencies below the desired cutoff frequency, and circuits or devices external to the shielded enclosure.

Abstract: A power converter includes an output filter circuit including first and second inductive elements; a voltage source coupled to the output filter circuit, the voltage source for generating a voltage across the output filter circuit, the voltage including an alternating voltage component, the alternating voltage component causing the application of an alternating current to the first inductive element of the output filter circuit; and an attenuation filtering circuit.

Abstract: A dc-to-dc pulse-width-modulated phase-shifted full bridge defines two taps, and the bridge switches are operated to produce alternating voltage between the taps. A switchable inductor is connected between each tap and a reference potential. The inductors are switched into circuit during low-load conditions to provide additional energy storage for zero-volt switching (ZVS) of the bridge switches. The switching of the inductors may be by mechanical, solid-state, optical, or magnetic switches. The magnetic switch may be a transformer winding. The switched inductor may be transformer-coupled.