Abstract: A patterning apparatus, including: a substrate holder constructed to support a substrate; a particle generator configured to generate particles in the patterning apparatus, the particle generator configured to deposit the particles onto the substrate to form a layer of particles on the substrate; and a pattern generator in the patterning apparatus, the pattern generator configured to applying a pattern in the patterning apparatus to the deposited layer of particles.

Abstract: A patterning apparatus, including: a substrate holder constructed to support a substrate; a particle generator configured to generate particles in the patterning apparatus, the particle generator configured to deposit the particles onto the substrate to form a layer of particles on the substrate; and a pattern generator in the patterning apparatus, the pattern generator configured to applying a pattern in the patterning apparatus to the deposited layer of particles.

Abstract: A method of calibrating a front to backside alignment capable lithographic apparatus. The method includes attaching a substrate having a plurality of alignment marks to a carrier, the substrate being arranged such that the alignment marks face towards the carrier; reducing the thickness of the substrate; using an alignment system of the apparatus to measure the positions of images of alignment marks formed by optics in a substrate table of the apparatus; projecting a pattern onto the substrate, the position of the pattern being determined according to the measured positions of the alignment marks; measuring the positions of the projected pattern and the alignment marks provided on the opposite side of the substrate, the position of the alignment marks provided on the opposite side of the substrate being measured by the alignment system directing radiation through the substrate; and comparing the measured positions in order to determine an overlay error.

Abstract: A lithographic apparatus includes a substrate table constructed to hold a first substrate of a first type, the first substrate having a polished surface; and a projection system configured to project a patterned radiation beam onto a target portion of a substrate. The polished surface supports a second substrate of a second type and the projection system is configured to project the patterned radiation beam onto the second substrate.

Abstract: To print layers of extended devices, that is devices extending over more than one target portion or die, a projection field is selected to minimize stitching errors. The selection of the projection field is based on data characterizing the projection lens to be used and the projection field is selected so as minimize the difference between positional errors in the projected image on opposite sides of the field.