Patents by Inventor Michael Judy
Michael Judy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240300808Abstract: Described herein are manufacturing techniques for achieving stress isolation in microelectromechanical systems (MEMS) devices that involve isolation trenches formed from the backside of the substrate. The techniques described herein involve etching a trench in the bottom side of the substrate subsequent to forming a MEMS platform, and processing the MEMS platform to form a MEMS device on the top side of the substrate subsequent to etching the trench.Type: ApplicationFiled: March 5, 2024Publication date: September 12, 2024Applicant: Analog Devices, Inc.Inventors: Kemiao Jia, Gaurav Vohra, Xin Zhang, Christine H. Tsau, Chen Yang, Andrew Proudman, Matthew Kent Emsley, George M. Molnar, II, Nikolay Pokrovskiy, Ali Mohammed Shakir, Michael Judy
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Patent number: 11981560Abstract: A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.Type: GrantFiled: June 8, 2021Date of Patent: May 14, 2024Assignee: Analog Devices, Inc.Inventors: Xin Zhang, Christopher Needham, Andrew Proudman, Nikolay Pokrovskiy, George M. Molnar, II, Laura Cornelia Popa, Michael Judy
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Patent number: 11892467Abstract: A microelectromechanical systems (MEMS) accelerometer is provided, comprising a substrate disposed in a plane defined by a first axis and a second axis perpendicular to the first axis; a first proof mass and a second proof mass coupled to the substrate and configured to translate in opposite directions of each other along a third axis perpendicular to the first and second axes; and at least one lever coupling the first proof mass to the second proof mass, wherein, the MEMS accelerometer is configured to detect acceleration along the third axis via detection of translation of the first and second proof masses along the third axis; and the MEMS accelerometer exhibits symmetry about the first and second axes.Type: GrantFiled: December 17, 2021Date of Patent: February 6, 2024Assignee: Analog Devices, Inc.Inventors: Kemiao Jia, Xin Zhang, Michael Judy
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Patent number: 11805396Abstract: Described herein are techniques for improving the signal-to-noise ratio of a wireless sensor platform. The device that interrogates a wireless sensor node (an interrogator) may be configured to determine the quantity to be measured by extracting information from multiple echoes produced in response to multiple interrogation pulses or produced due to multi-path propagation. Although different echoes may have been transformed to different extents, the echoes may share unique characteristics that are specific to the wireless sensor node that produced them. Accordingly, the SNR may be improved by keeping only portions of the received signal that exhibit such characteristics. The SNR may be further improved by summing the echoes together. In some embodiments, the echoes may be summed together in a coherent fashion, thereby producing an echo having an amplitude greater than the amplitude of each of the received echoes.Type: GrantFiled: March 26, 2020Date of Patent: October 31, 2023Assignee: Analog Devices, Inc.Inventors: Eugene Oh Hwang, Tao Yu, Phillip Nadeau, Michael Judy, Rui Zhang
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Publication number: 20230234835Abstract: Packaging of microfabricated devices, such as integrated circuits, microelectromechanical systems (MEMS), or sensor devices is described. The packaging is 3D heterogeneous packaging in at least some embodiments. The 3D heterogeneous packaging includes an interposer. The interposer includes stress relief platforms. Thus, stresses originating in the packaging do not propagate to the packaged device. A stress isolation platform is an example of a stress relief feature. A stress isolation platform includes a portion of an interposer coupled to the remainder of the interposer via stress isolation suspensions. Stress isolation suspensions can be formed by etching trenches through the interposer.Type: ApplicationFiled: January 24, 2023Publication date: July 27, 2023Applicant: Analog Devices, Inc.Inventors: Xin Zhang, Jianglong Zhang, Li Chen, John C. Cowles, Michael Judy, Shafi Saiyed
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Patent number: 11656077Abstract: An extensional mode electrostatic microelectromechanical systems (MEMS) gyroscope is described. The MEMS gyroscope operates in an extensional mode. The MEMS gyroscope comprises a vibrating ring structure that is electrostatically excited in the extensional mode.Type: GrantFiled: December 16, 2019Date of Patent: May 23, 2023Assignee: Analog Devices, Inc.Inventors: Igor P. Prikhodko, Michael Judy
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Patent number: 11415595Abstract: Single-axis teeter-totter accelerometers having a plurality of anchors are disclosed. The plurality of anchors may be arranged about a rotation axis of the teeter-totter proof mass. Each of the plurality of anchors may be coupled to the proof mass by two torsional springs each extending along the rotation axis. The plurality of anchors allows an increased number of torsional springs to be coupled to the proof mass and thus greater torsional stiffness for the proof mass may be achieved. Due to the higher torsional stiffness, the disclosed single-axis teeter-totter accelerometers may be deployed in high-frequency environments where such increased torsional stiffness is required, for example, around 20 kHz and above.Type: GrantFiled: June 28, 2019Date of Patent: August 16, 2022Assignee: Analog Devices, Inc.Inventors: Gaurav Vohra, Xin Zhang, Michael Judy
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Publication number: 20220196699Abstract: A microelectromechanical systems (MEMS) accelerometer is provided, comprising a substrate disposed in a plane defined by a first axis and a second axis perpendicular to the first axis; a first proof mass and a second proof mass coupled to the substrate and configured to translate in opposite directions of each other along a third axis perpendicular to the first and second axes; and at least one lever coupling the first proof mass to the second proof mass, wherein, the MEMS accelerometer is configured to detect acceleration along the third axis via detection of translation of the first and second proof masses along the third axis; and the MEMS accelerometer exhibits symmetry about the first and second axes.Type: ApplicationFiled: December 17, 2021Publication date: June 23, 2022Applicant: Analog Devices, Inc.Inventors: Kemiao Jia, Xin Zhang, Michael Judy
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Patent number: 11255873Abstract: Z-axis teeter-totter accelerometers with embedded movable structures are disclosed. The teeter-totter accelerometer may include an embedded mass which pivots or translates out-of-plane from the teeter-totter beam. The pivoting or translating embedded mass may be positioned to increase the sensitivity of the z-axis accelerometer by providing greater z-axis displacement than the teeter-totter beam itself exhibits.Type: GrantFiled: September 12, 2018Date of Patent: February 22, 2022Assignee: Analog Devices, Inc.Inventors: Xin Zhang, Gaurav Vohra, Michael Judy
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Publication number: 20210380403Abstract: A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.Type: ApplicationFiled: June 8, 2021Publication date: December 9, 2021Applicant: Analog Devices, Inc.Inventors: Xin Zhang, Christopher Needham, Andrew Proudman, Nikolay Pokrovskiy, George M. Molnar, II, Laura Cornelia Popa, Michael Judy
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Publication number: 20200408801Abstract: Single-axis teeter-totter accelerometers having a plurality of anchors are disclosed. The plurality of anchors may be arranged about a rotation axis of the teeter-totter proof mass. Each of the plurality of anchors may be coupled to the proof mass by two torsional springs each extending along the rotation axis. The plurality of anchors allows an increased number of torsional springs to be coupled to the proof mass and thus greater torsional stiffness for the proof mass may be achieved. Due to the higher torsional stiffness, the disclosed single-axis teeter-totter accelerometers may be deployed in high-frequency environments where such increased torsional stiffness is required, for example, around 20 kHz and above.Type: ApplicationFiled: June 28, 2019Publication date: December 31, 2020Applicant: Analog Devices, Inc.Inventors: Gaurav Vohra, Xin Zhang, Michael Judy
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Publication number: 20200314607Abstract: Described herein are techniques for improving the signal-to-noise ratio of a wireless sensor platform. The device that interrogates a wireless sensor node (an interrogator) may be configured to determine the quantity to be measured by extracting information from multiple echoes produced in response to multiple interrogation pulses or produced due to multi-path propagation. Although different echoes may have been transformed to different extents, the echoes may share unique characteristics that are specific to the wireless sensor node that produced them. Accordingly, the SNR may be improved by keeping only portions of the received signal that exhibit such characteristics. The SNR may be further improved by summing the echoes together. In some embodiments, the echoes may be summed together in a coherent fashion, thereby producing an echo having an amplitude greater than the amplitude of each of the received echoes.Type: ApplicationFiled: March 26, 2020Publication date: October 1, 2020Applicant: Analog Devices, Inc.Inventors: Eugene Oh Hwang, Tao Yu, Phillip Nadeau, Michael Judy, Rui Zhang
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Patent number: 10759659Abstract: A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.Type: GrantFiled: October 15, 2018Date of Patent: September 1, 2020Assignee: Analog Devices, Inc.Inventors: Xin Zhang, Michael Judy, George M. Molnar, Christopher Needham, Kemiao Jia
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Publication number: 20200249020Abstract: An extensional mode electrostatic microelectromechanical systems (MEMS) gyroscope is described. The MEMS gyroscope operates in an extensional mode. The MEMS gyroscope comprises a vibrating ring structure that is electrostatically excited in the extensional mode.Type: ApplicationFiled: December 16, 2019Publication date: August 6, 2020Applicant: Analog Devices, Inc.Inventors: Igor P. Prikhodko, Michael Judy
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Publication number: 20200081029Abstract: Z-axis teeter-totter accelerometers with embedded movable structures are disclosed. The teeter-totter accelerometer may include an embedded mass which pivots or translates out-of-plane from the teeter-totter beam. The pivoting or translating embedded mass may be positioned to increase the sensitivity of the z-axis accelerometer by providing greater z-axis displacement than the teeter-totter beam itself exhibits.Type: ApplicationFiled: September 12, 2018Publication date: March 12, 2020Applicant: Analog Devices, Inc.Inventors: Xin Zhang, Gaurav Vohra, Michael Judy
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Publication number: 20190047846Abstract: A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.Type: ApplicationFiled: October 15, 2018Publication date: February 14, 2019Applicant: Analog Devices, Inc.Inventors: Xin Zhang, Michael Judy, George M. Molnar, Christopher Needham, Kemiao Jia
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Patent number: 10203352Abstract: A microelectromechanical systems (MEMS) accelerometer is described. The MEMS accelerometer may comprise a proof mass configured to sense accelerations in a direction parallel the plane of the proof mass, and a plurality of compensation structures. The proof mass may be connected to one or more anchors through springs. The compensation structures may be coupled to the substrate of the MEMS accelerometer through a rigid connection to respective anchors. A compensation structure may comprise at least one compensation electrode forming one or more lateral compensation capacitors. The compensation capacitor(s) may be configured to sense displacement of the anchor to which the compensation structures is connected.Type: GrantFiled: August 4, 2016Date of Patent: February 12, 2019Assignee: Analog Devices, Inc.Inventors: Xin Zhang, William A. Clark, Michael Judy
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Patent number: 10073113Abstract: In one aspect, the disclosure is directed to a MEMS device. The MEMS device includes a silicon-based movable MEMS sensor element. The MEMS device also includes a plurality of wells formed into at least one surface of the movable MEMS sensor element. Each well is filled with at least one metal so as to increase the effective mass of the movable MEMS sensor element. The metal may be tungsten or tantalum, or an alloy with tungsten or tantalum.Type: GrantFiled: April 24, 2015Date of Patent: September 11, 2018Assignee: Analog Devices, Inc.Inventors: Xin Zhang, Michael Judy
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Publication number: 20180038887Abstract: A microelectromechanical systems (MEMS) accelerometer is described. The MEMS accelerometer may comprise a proof mass configured to sense accelerations in a direction parallel the plane of the proof mass, and a plurality of compensation structures. The proof mass may be connected to one or more anchors through springs. The compensation structures may be coupled to the substrate of the MEMS accelerometer through a rigid connection to respective anchors. A compensation structure may comprise at least one compensation electrode forming one or more lateral compensation capacitors. The compensation capacitor(s) may be configured to sense displacement of the anchor to which the compensation structures is connected.Type: ApplicationFiled: August 4, 2016Publication date: February 8, 2018Applicant: Analog Devices, Inc.Inventors: Xin Zhang, William A. Clark, Michael Judy
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Patent number: 8464571Abstract: A calibration system for a MEMS system having at least one overdamped motion axis includes a measurement module for determining a location of a pole of a MEMS device in the overdamped motion axis, a closed-loop feedback system configured to change a first location of the pole to a second location of the pole, and a computation module for calculating a resonant frequency and/or a quality factor using the first and the second location of the pole as determined by the measurement module. The calibration system further includes a calibration module for calibrating the MEMS system based on the calculated resonant frequency and/or the calculated quality factor.Type: GrantFiled: March 22, 2010Date of Patent: June 18, 2013Assignee: Analog Devices, Inc.Inventors: Andrew Sparks, Michael Judy