Abstract: A microelectromechanical systems (MEMS) accelerometer is provided, comprising a substrate disposed in a plane defined by a first axis and a second axis perpendicular to the first axis; a first proof mass and a second proof mass coupled to the substrate and configured to translate in opposite directions of each other along a third axis perpendicular to the first and second axes; and at least one lever coupling the first proof mass to the second proof mass, wherein, the MEMS accelerometer is configured to detect acceleration along the third axis via detection of translation of the first and second proof masses along the third axis; and the MEMS accelerometer exhibits symmetry about the first and second axes.

Abstract: Described herein are techniques for improving the signal-to-noise ratio of a wireless sensor platform. The device that interrogates a wireless sensor node (an interrogator) may be configured to determine the quantity to be measured by extracting information from multiple echoes produced in response to multiple interrogation pulses or produced due to multi-path propagation. Although different echoes may have been transformed to different extents, the echoes may share unique characteristics that are specific to the wireless sensor node that produced them. Accordingly, the SNR may be improved by keeping only portions of the received signal that exhibit such characteristics. The SNR may be further improved by summing the echoes together. In some embodiments, the echoes may be summed together in a coherent fashion, thereby producing an echo having an amplitude greater than the amplitude of each of the received echoes.

Abstract: Packaging of microfabricated devices, such as integrated circuits, microelectromechanical systems (MEMS), or sensor devices is described. The packaging is 3D heterogeneous packaging in at least some embodiments. The 3D heterogeneous packaging includes an interposer. The interposer includes stress relief platforms. Thus, stresses originating in the packaging do not propagate to the packaged device. A stress isolation platform is an example of a stress relief feature. A stress isolation platform includes a portion of an interposer coupled to the remainder of the interposer via stress isolation suspensions. Stress isolation suspensions can be formed by etching trenches through the interposer.

Abstract: An extensional mode electrostatic microelectromechanical systems (MEMS) gyroscope is described. The MEMS gyroscope operates in an extensional mode. The MEMS gyroscope comprises a vibrating ring structure that is electrostatically excited in the extensional mode.

Abstract: Single-axis teeter-totter accelerometers having a plurality of anchors are disclosed. The plurality of anchors may be arranged about a rotation axis of the teeter-totter proof mass. Each of the plurality of anchors may be coupled to the proof mass by two torsional springs each extending along the rotation axis. The plurality of anchors allows an increased number of torsional springs to be coupled to the proof mass and thus greater torsional stiffness for the proof mass may be achieved. Due to the higher torsional stiffness, the disclosed single-axis teeter-totter accelerometers may be deployed in high-frequency environments where such increased torsional stiffness is required, for example, around 20 kHz and above.

Abstract: A microelectromechanical systems (MEMS) accelerometer is provided, comprising a substrate disposed in a plane defined by a first axis and a second axis perpendicular to the first axis; a first proof mass and a second proof mass coupled to the substrate and configured to translate in opposite directions of each other along a third axis perpendicular to the first and second axes; and at least one lever coupling the first proof mass to the second proof mass, wherein, the MEMS accelerometer is configured to detect acceleration along the third axis via detection of translation of the first and second proof masses along the third axis; and the MEMS accelerometer exhibits symmetry about the first and second axes.

Abstract: Z-axis teeter-totter accelerometers with embedded movable structures are disclosed. The teeter-totter accelerometer may include an embedded mass which pivots or translates out-of-plane from the teeter-totter beam. The pivoting or translating embedded mass may be positioned to increase the sensitivity of the z-axis accelerometer by providing greater z-axis displacement than the teeter-totter beam itself exhibits.

Abstract: A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.

Abstract: Single-axis teeter-totter accelerometers having a plurality of anchors are disclosed. The plurality of anchors may be arranged about a rotation axis of the teeter-totter proof mass. Each of the plurality of anchors may be coupled to the proof mass by two torsional springs each extending along the rotation axis. The plurality of anchors allows an increased number of torsional springs to be coupled to the proof mass and thus greater torsional stiffness for the proof mass may be achieved. Due to the higher torsional stiffness, the disclosed single-axis teeter-totter accelerometers may be deployed in high-frequency environments where such increased torsional stiffness is required, for example, around 20 kHz and above.

Abstract: Described herein are techniques for improving the signal-to-noise ratio of a wireless sensor platform. The device that interrogates a wireless sensor node (an interrogator) may be configured to determine the quantity to be measured by extracting information from multiple echoes produced in response to multiple interrogation pulses or produced due to multi-path propagation. Although different echoes may have been transformed to different extents, the echoes may share unique characteristics that are specific to the wireless sensor node that produced them. Accordingly, the SNR may be improved by keeping only portions of the received signal that exhibit such characteristics. The SNR may be further improved by summing the echoes together. In some embodiments, the echoes may be summed together in a coherent fashion, thereby producing an echo having an amplitude greater than the amplitude of each of the received echoes.

Abstract: A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.

Abstract: An extensional mode electrostatic microelectromechanical systems (MEMS) gyroscope is described. The MEMS gyroscope operates in an extensional mode. The MEMS gyroscope comprises a vibrating ring structure that is electrostatically excited in the extensional mode.

Abstract: Z-axis teeter-totter accelerometers with embedded movable structures are disclosed. The teeter-totter accelerometer may include an embedded mass which pivots or translates out-of-plane from the teeter-totter beam. The pivoting or translating embedded mass may be positioned to increase the sensitivity of the z-axis accelerometer by providing greater z-axis displacement than the teeter-totter beam itself exhibits.

Abstract: A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.

Abstract: A microelectromechanical systems (MEMS) accelerometer is described. The MEMS accelerometer may comprise a proof mass configured to sense accelerations in a direction parallel the plane of the proof mass, and a plurality of compensation structures. The proof mass may be connected to one or more anchors through springs. The compensation structures may be coupled to the substrate of the MEMS accelerometer through a rigid connection to respective anchors. A compensation structure may comprise at least one compensation electrode forming one or more lateral compensation capacitors. The compensation capacitor(s) may be configured to sense displacement of the anchor to which the compensation structures is connected.

Abstract: In one aspect, the disclosure is directed to a MEMS device. The MEMS device includes a silicon-based movable MEMS sensor element. The MEMS device also includes a plurality of wells formed into at least one surface of the movable MEMS sensor element. Each well is filled with at least one metal so as to increase the effective mass of the movable MEMS sensor element. The metal may be tungsten or tantalum, or an alloy with tungsten or tantalum.

Abstract: A microelectromechanical systems (MEMS) accelerometer is described. The MEMS accelerometer may comprise a proof mass configured to sense accelerations in a direction parallel the plane of the proof mass, and a plurality of compensation structures. The proof mass may be connected to one or more anchors through springs. The compensation structures may be coupled to the substrate of the MEMS accelerometer through a rigid connection to respective anchors. A compensation structure may comprise at least one compensation electrode forming one or more lateral compensation capacitors. The compensation capacitor(s) may be configured to sense displacement of the anchor to which the compensation structures is connected.

Abstract: A calibration system for a MEMS system having at least one overdamped motion axis includes a measurement module for determining a location of a pole of a MEMS device in the overdamped motion axis, a closed-loop feedback system configured to change a first location of the pole to a second location of the pole, and a computation module for calculating a resonant frequency and/or a quality factor using the first and the second location of the pole as determined by the measurement module. The calibration system further includes a calibration module for calibrating the MEMS system based on the calculated resonant frequency and/or the calculated quality factor.

Abstract: A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.

Abstract: A MEMS microphone has a backplate, a diaphragm movable relative to the backplate, and a backside cavity adjacent to the backplate or the diaphragm. The backside cavity has sidewalls with at least one rib protruding inward toward a center of the backside cavity.