Abstract: In an embodiment, a semiconductor device is provided that includes a semiconductor substrate having a first major surface, one or more trenches formed in the first major surface and having a base and a side wall extending from the base to the first major surface, an anchoring layer, and a conductive member arranged in the one or more trenches and spaced apart from the side wall of the one or more trenches by a cavity formed in the one or more trenches . The anchoring layer extends from the first major surface of the semiconductor substrate over the cavity and onto an upper surface of the conductive member.

Abstract: Certain aspects of the present disclosure provide a method for optimizing process parameters for additive manufacturing, including: determining a change to at least one process parameter of a plurality of process parameters while additively manufacturing a first part using an additive manufacturing apparatus according to a build file comprising machine code defining the plurality of process parameters; modifying the build file based on the determined change to the at least one process parameter to generate a modified build file; additively manufacturing a second part using the additive manufacturing apparatus according to the modified build file, wherein: additively manufacturing the first part is performed in a closed-loop control mode, and additively manufacturing the second part is performed in an open-loop control mode.

Abstract: Certain aspects of the present disclosure provide a method for optimizing process parameters for additive manufacturing, including: determining a change to at least one process parameter of a plurality of process parameters while additively manufacturing a first part using an additive manufacturing apparatus according to a build file comprising machine code defining the plurality of process parameters; modifying the build file based on the determined change to the at least one process parameter to generate a modified build file; additively manufacturing a second part using the additive manufacturing apparatus according to the modified build file, wherein: additively manufacturing the first part is performed in a closed-loop control mode, and additively manufacturing the second part is performed in an open-loop control mode.

Abstract: A torque sensing assembly includes an axially fixed sheave having an axis of rotation, and an axially movable sheave movable along the axis in relation to the axially fixed sheave. A compression spring has a first end and a second end, with the first end being positioned to engage the axially movable sheave. A dual stage spring compression mechanism has a spring retainer that engages the second end of the compression spring. The dual stage spring compression mechanism is connected to the axially fixed sheave. The dual stage spring compression mechanism has a first stage compression device that compresses the compression spring by a first preload amount and a second stage compression device that compresses the compression spring by a second preload amount.