Patents by Inventor Michael K. Balck

Michael K. Balck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12156328
    Abstract: A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.
    Type: Grant
    Filed: July 7, 2023
    Date of Patent: November 26, 2024
    Assignee: Eaton Intelligent Power Limited
    Inventors: Kaijam M. Woodley, Michael K. Balck, Matthew J. Koebert
  • Publication number: 20240063727
    Abstract: A rectifier assembly includes: a mounting base; and one or more rectification modules configured to be received in the mounting base, each rectification module including: an electronic network including one or more electronic elements configured to convert alternating current (AC) electrical power at an input of the rectification module to direct current (DC) electrical power at an output of the rectification module. Each of the one or more rectification modules is configured to be electrically connected to a DC bus of a driving apparatus that is separate from and independent of the rectifier assembly.
    Type: Application
    Filed: November 1, 2023
    Publication date: February 22, 2024
    Inventors: Peter J. Fanduzzi, Paul J. Siebenlist, Mayur Kothari, Michael K. Balck, Sudershan Gawali, Derek Baxter, Craig H. DePas
  • Patent number: 11863083
    Abstract: A rectifier assembly includes: a mounting base; and one or more rectification modules configured to be received in the mounting base, each rectification module including: an electronic network including one or more electronic elements configured to convert alternating current (AC) electrical power at an input of the rectification module to direct current (DC) electrical power at an output of the rectification module. Each of the one or more rectification modules is configured to be electrically connected to a DC bus of a driving apparatus that is separate from and independent of the rectifier assembly.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: January 2, 2024
    Assignee: Eaton Intelligent Power Limited
    Inventors: Peter J. Fanduzzi, Paul J. Siebenlist, Mayur Kothari, Michael K. Balck, Sudershan Gawali, Derek Baxter, Craig H. DePas
  • Publication number: 20230354512
    Abstract: A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.
    Type: Application
    Filed: July 7, 2023
    Publication date: November 2, 2023
    Inventors: Kaijam M. Woodley, Michael K. Balck, Matthew J. Koebert
  • Patent number: 11729906
    Abstract: A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: August 15, 2023
    Assignee: Eaton Intelligent Power Limited
    Inventors: Kaijam M. Woodley, Michael K. Balck, Matthew J. Koebert
  • Publication number: 20230209782
    Abstract: An apparatus includes: a power converter including a plurality of electronic switches, the electronic switches being controllable to produce a driver signal having a variable amplitude, frequency, and/or phase; and a single-piece base made of a thermally conductive polymer material. The single-piece base includes: a first side configured to hold the power converter; a second side; and one or more heat dissipating elements that extend from the second side. The heat dissipating elements are configured to dissipate heat generated by the electronic switches, and each of the one or more heat dissipating elements is made of the thermally conductive polymer material.
    Type: Application
    Filed: November 15, 2022
    Publication date: June 29, 2023
    Inventors: Jayakrishnan S. S, Vipin Bokade, Chinmaya Rajiv Dandekar, Michael K. Balck
  • Publication number: 20210328522
    Abstract: A rectifier assembly includes: a mounting base; and one or more rectification modules configured to be received in the mounting base, each rectification module including: an electronic network including one or more electronic elements configured to convert alternating current (AC) electrical power at an input of the rectification module to direct current (DC) electrical power at an output of the rectification module. Each of the one or more rectification modules is configured to be electrically connected to a DC bus of a driving apparatus that is separate from and independent of the rectifier assembly.
    Type: Application
    Filed: March 15, 2021
    Publication date: October 21, 2021
    Inventors: Peter J. Fanduzzi, Paul J. Siebenlist, Mayur Kothari, Michael K. Balck, Sudershan Gawali, Derek Baxter, Craig H. DePas
  • Publication number: 20200196442
    Abstract: A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.
    Type: Application
    Filed: December 4, 2019
    Publication date: June 18, 2020
    Inventors: Kaijam M. Woodley, Michael K. Balck, Matthew J. Koebert