Patents by Inventor Michael K. Knight

Michael K. Knight has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Socket for multi-lead integrated circuit packages
    Patent number: 5527189
    Abstract: A socket and a method for making a socket for securing an integrated circuit package to a supporting structure. The integrated circuit package has a plurality of leads positioned in a geometric pattern and each lead has a predetermined impedance. The socket comprises a substrate or body having a first and second surface opposed to each other and formed of an insulative material. The socket further comprises a plurality signal path members extending from at least the first surface to the second surface. Each signal path includes a first and second end. One end of each signal path member includes a means positioned to secure a lead of an integrated circuit package and the other end is adapted to be coupled to a conductor on a printed circuit board.
    Type: Grant
    Filed: June 20, 1995
    Date of Patent: June 18, 1996
    Assignee: Berg Technology, Inc.
    Inventors: Richard J. Middlehurst, Michael K. Knight
  • Socket for multi-lead integrated circuit packages
    Patent number: 5399104
    Abstract: A socket and a method for making a socket for securing an integrated circuit package to a supporting structure. The integrated circuit package has a plurality of leads positioned in a geometric pattern and each lead has a predetermined impedance. The socket comprises a substrate or body having a first and second surface opposed to each other and formed of an insulative material. The socket further comprises a plurality signal path members extending from at least the first surface to the second surface. Each signal path member includes a first and second end. One end of each signal path member includes a means positioned to secure a lead of an integrated circuit package and the other end is adapted to be coupled to a conductor on a printed circuit board.
    Type: Grant
    Filed: September 28, 1992
    Date of Patent: March 21, 1995
    Assignee: McKenzie Socket Technology, Inc.
    Inventors: Richard J. Middlehurst, Michael K. Knight