Patents by Inventor Michael K. Patterson

Michael K. Patterson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10295283
    Abstract: Generally discussed herein are devices and methods for thermal management of a component. An apparatus can include a phase change material substantially at a phase transition temperature of the phase change material, a component near, on, or at least partially in the phase change material, and a heat removal device to transfer heat energy away from the phase change material and maintain the phase change material substantially at the phase transition temperature.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: May 21, 2019
    Assignee: Intel Corporation
    Inventors: Michael K. Patterson, Andrew C. Alduino
  • Patent number: 9939834
    Abstract: A system and method for computing at a facility having systems of multiple compute nodes to execute jobs of computing. Power consumption of the facility is managed to within a power band. The power consumption may be adjusted by implementing (e.g., by a power balloon) activities having little or no computational output.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: April 10, 2018
    Assignee: Intel Corporation
    Inventors: Devadatta V. Bodas, Muralidhar Rajappa, Justin J. Song, Andy Hoffman, Michael K. Patterson
  • Publication number: 20170176118
    Abstract: Generally discussed herein are devices and methods for thermal management of a component. An apparatus can include a phase change material substantially at a phase transition temperature of the phase change material, a component near, on, or at least partially in the phase change material, and a heat removal device to transfer heat energy away from the phase change material and maintain the phase change material substantially at the phase transition temperature.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Inventors: Michael K. Patterson, Andrew C. Alduino
  • Publication number: 20160187906
    Abstract: A system and method for computing at a facility having systems of multiple compute nodes to execute jobs of computing. Power consumption of the facility is managed to within a power band. The power consumption may be adjusted by implementing (e.g., by a power balloon) activities having little or no computational output.
    Type: Application
    Filed: December 24, 2014
    Publication date: June 30, 2016
    Applicant: INTEL CORPORATION
    Inventors: Devadatta V. Bodas, Muralidhar Rajappa, Justin J. Song, Andy Hoffman, Michael K. Patterson
  • Patent number: 7414843
    Abstract: Embodiments of the present invention include an apparatus, method, and system for providing a layered thermal management arrangement. Embodiments of the present invention provide a layered thermal management arrangement, including a plurality of first channels, one or more flow-regulation features having a first and second manifold to provide and regulate at least a portion of a first fluid flow to the plurality of first channels and to drain at least the portion of the first fluid flow from the plurality of first channels. Other embodiments may be described and claimed.
    Type: Grant
    Filed: March 9, 2005
    Date of Patent: August 19, 2008
    Assignee: Intel Corporation
    Inventors: Yogendra Joshi, Xiaojin Wei, Michael K. Patterson