Abstract: A transparent article, such as a transparent cover, for use as a cover glass for an electronic device, as well as methods for producing transparent articles, are disclosed. The transparent article can form a part of a housing of the portable electronic device and can provide an outer surface for a portion of the housing. The transparent article can be provided over a display of portable electronic device to provide a protective outer cover over the display. In one embodiment, the transparent article can be formed with a laminate structure. In another embodiment, the transparent article can be formed with a ribbed structure. In still another embodiment, a sapphire coating can be deposited on the transparent article to improve it strength. Advantageously, the transparent article is able to be not only thin and lightweight but also provide sufficient stiffness for use as a cover glass.

Abstract: A surface of an electronic device includes a reduced friction surface that comprises a glass beaded film. The glass beaded film includes glass beads disposed in a polymer layer or in an adhesive layer, where a portion of the glass beads protrude from a surface of the polymer or adhesive layer. The reduced friction surface is disposed over at least a portion of the surface of the electronic device.

Abstract: An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.

Abstract: An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.

Abstract: A method for forming a relatively transparent fiber composite is disclosed. In one embodiment, the relatively transparent fiber composite can include glass fibers with a relatively low amount of iron oxide. In another embodiment, the transparent fiber composite can include a selected resin, a sizing and glass fibers where the index of refraction of the glass fibers, the sizing and the resin can be similar, within a tolerance amount. In yet another embodiment, the resin can be relatively clear and free from pigments and tints. In one embodiment, the glass fibers can be formed into a mat. In another embodiment, glass fibers can be chopped or milled and a relatively transparent part can be formed through injection molding.

Abstract: A metal matrix composite using as one of the components a precious metal is described. In one embodiment, the precious metal takes the form of gold and the metal matrix composite has a gold mass fraction in accordance with 18 k. The metal matrix composite can be formed by blending a precious metal (e.g., gold) powder and a ceramic powder, forming a mixture that is then compressed within a die having a near net shape of the metal matrix composite. The compressed mixture in the die is then heated to sinter the precious metal and ceramic powder. Other techniques for forming the precious metal matrix composite using HIP, and a diamond powder are also disclosed.

Abstract: A protective film configured to protect a substrate such as a glass panel for a display is provided. The protective film may include a discontinuous outer layer including a multitude of panels and gaps positioned therebetween. Further, the protective film may include a flexible layer positioned between the discontinuous outer layer and the substrate. When panels of the discontinuous outer layer are impacted by a foreign object, the force may be transferred to the flexible layer, rather than propagating through the outer layer. In this regard, the gaps between the panels of the discontinuous outer layer may prevent the formation of cracks that may otherwise occur. Related assemblies and methods are also provided.

Abstract: An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.

Abstract: A transparent article, such as a transparent cover, for use as a cover glass for an electronic device, as well as methods for producing transparent articles, are disclosed. The transparent article can form a part of a housing of the portable electronic device and can provide an outer surface for a portion of the housing. The transparent article can be provided over a display of portable electronic device to provide a protective outer cover over the display. In one embodiment, the transparent article can be formed with a laminate structure. In another embodiment, the transparent article can be formed with a ribbed structure. In still another embodiment, a sapphire coating can be deposited on the transparent article to improve it strength. Advantageously, the transparent article is able to be not only thin and lightweight but also provide sufficient stiffness for use as a cover glass.

Abstract: An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.

Abstract: Materials, apparatus and methods of forming structural components for consumer electronics devices are described. In one embodiment, ceramic fibers, such as alumina, are mixed with a thermoplastic, such as nylon, to form a composite material usable in an injection molding process. The volume percent of ceramic fibers used with the thermoplastic can be selected to improve the strength properties of the composite material. Pigments can be added to the composite material to affect its aesthetic appeal. In one embodiment, the composite material including the ceramic fibers can be used to form frame components usable in a consumer electronic device. The frame components can be load bearing structures that are externally visible or used within the interior of the device.

Abstract: A method for manufacturing a compound part comprises preparing a cavity in a receiving part, selecting a resin for application in the receiving part, applying the resin into the cavity, curing the applied resin, and simultaneously finishing the receiving part and the cured resin.

Abstract: A protective film configured to protect a substrate such as a glass panel for a display is provided. The protective film may include a discontinuous outer layer including a multitude of panels and gaps positioned therebetween. Further, the protective film may include a flexible layer positioned between the discontinuous outer layer and the substrate. When panels of the discontinuous outer layer are impacted by a foreign object, the force may be transferred to the flexible layer, rather than propagating through the outer layer. In this regard, the gaps between the panels of the discontinuous outer layer may prevent the formation of cracks that may otherwise occur. Related assemblies and methods are also provided.

Abstract: A surface of an electronic device includes a reduced friction surface that comprises a glass beaded film. The glass beaded film includes glass beads disposed in a polymer layer or in an adhesive layer, where a portion of the glass beads protrude from a surface of the polymer or adhesive layer. The reduced friction surface is disposed over at least a portion of the surface of the electronic device.

Abstract: A metal matrix composite using as one of the components a precious metal is described. In one embodiment, the precious metal takes the form of gold and the metal matrix composite has a gold mass fraction in accordance with 18 k. The metal matrix composite can be formed by blending a precious metal (e.g., gold) powder and a ceramic powder, forming a mixture that is then compressed within a die having a near net shape of the metal matrix composite. The compressed mixture in the die is then heated to sinter the precious metal and ceramic powder. Other techniques for forming the precious metal matrix composite using HIP, and a diamond powder are also disclosed.

Abstract: A method and apparatus for bonding a first substrate to a second substrate can include an intermediate layer disposed between the substrates. In one embodiment, the intermediate layer can be disposed to a bonding area of the first substrate and only one adhesive layer can be disposed between the intermediate layer and the second substrate. In other embodiments, a plurality of intermediate layers can be used.

Abstract: An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.

Abstract: An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.

Abstract: A method for manufacturing a compound part comprises preparing a cavity in a receiving part, selecting a resin for application in the receiving part, applying the resin into the cavity, curing the applied resin, and simultaneously finishing the receiving part and the cured resin.

Abstract: A method for bonding two substrates can use a laser to ablate a bonding surface of at least one of the two substrates. In one embodiment, the laser can be used to produce a predetermined average surface roughness in a bonding surface region of one of the substrates. In another embodiment, the substrate can comprise a resin filled polymer. Ablating the surface of the bonding surface can increase the bond strength in the ablation region.