Abstract: An optical connector comprising: (a) a lens; (b) a ferrule assembly comprising a ferrule with an endface and at least one fiber in the ferrule having a fiber end presented at the endface; (c) a housing for holding the ferrule assembly and the lens in a certain axial and radial relationship; and (d) a glass element having a first and second surface, the first surface affixed to the endface such that it is in physical contact with the fiber end, the second surface having an AR coating and defining a space between it and the lens.

Abstract: This description is not intended to limit the scope of the claims herein. An exercise device comprising a base that can be oriented at any angle and that defines a plurality of connection interfaces, each of which is designed to carry and restrain one end of a cantilevered resilient member. Said connection interfaces can be positioned at or adjusted to a widely varying range of locations and angular orientations with respect to the base. The resilient members can be affixed to any of the connection interfaces that the user desires, so that the resilient members can be positioned in a correspondingly wide range of locations and angular orientations relative to the base to enable the user to perform a wide range of exercises on the apparatus by gripping and exerting a force on the resilient members or other handles attached to the resilient members.

Abstract: An optical package (40) suitable for use in a moist environment, the assembly comprising: (a) an optical component (41); (b) a housing (42) defining at least a main compartment containing the optic al component (41) and at least one access route along which ambient moisture must travel to reach the optical component (41); and (c) a desiccant material (50) disposed along the access route such that moisture entering the housing (42) contacts the desiccant material (50) before reaching the optical component (41).

Abstract: A system for controlling inclination and depth of ablation of a polymer planar waveguide or semiconductor wafer substrate utilizes a laser which directs the beam at the substrate to ablate portions of the surface thereof and a translatable stage for moving the substrate relative to the beam to create a path of ablated material from the surface. The velocity of the substrate is controlled relative to ablation rate of material from the surface or the dimension of the beam is controlled along the path of ablated material to create a desired inclination and depth of ablated material in the path. The depth of ablated material is a function of the beam width along the path of ablated material, workpiece velocity and ablation rate and is substantially controlled by the formula: D=R(W/V) where D is the depth of ablated material, R is ablation rate, W is beam dimension along the path of ablated material, and V is workpiece velocity.

Abstract: An optical connector system comprises mating first and second fiber ferrules (1, 11). Each ferrule (1, 11) has an endface (4, 14) polished at an angle to minimize backreflections. A holographic optical element (6) disposed on the first ferrule endface (4) receives a transmitted beam and expands the beam to an expanded beam (21) of collimated light. The expanded beam (21) is launched into an air gap (22) for receipt by a holographic optical element (16) disposed on the second ferrule (11). The holographic optical element (16) on the second ferrule (11) receives the expanded beam (21) and focuses it to be received by the fiber held in the second ferrule (11).

Abstract: An optical bidirectional link comprising: a module having a lower surface and an upper surface. The upper surface having disposed thereon a submodule having an optical transmitter and detector mounted thereon. Circuitry mounted on the upper surface. The circuitry having electronic components for effecting bidirectional communication via the optical transmitter and detector. A cover disposed over the upper surface of the module, wherein the submodule further comprises a silicon substrate having an optical fiber disposed in v-groove, a laser, reflective surfaces, and a holographic plate disposed on an upper surface of the silicon substrate.

Abstract: The present invention relates to a novel, accurate, passive alignment of optical and optoelectronic elements using silicon waferboard technology. The invention particularly relates to the use of etched v-grooves on monocrystalline materials in conjunction with alignment spheres to effect the passive alignment.