Abstract: In a general aspect, parametric amplification is performed in a quantum computing system. In some cases, a traveling wave parametric amplifier (TWPA) includes a plurality of Josephson junctions connected in series. The plurality of Josephson junctions includes a first Josephson junction, which includes a first superconducting electrode on a surface of a substrate, a second superconducting electrode that overlaps the first superconducting electrode, and a barrier sandwiched between overlapping sections of the first and second superconducting electrodes. The barrier defines a footprint with a tapered shape over the surface of the substrate.

Abstract: A method of manufacturing a travelling wave parametric amplifier (TWPA) includes forming a superconducting junction on a substrate. Trenches are etched away through a metal surface and into a layer of dielectric material. The trenches define a plurality of fingers positioned in an interdigitated arrangement of capacitors defined by a metal and a dielectric material that remains from the etched away metal surface and the layer of dielectric material.

Abstract: One or more systems, devices, methods of use and/or methods of fabrication herein relate to superconducting monolithic microwave integrated circuits. According to an embodiment, a device comprises a monolithic microwave integrated circuit comprising a superconducting layer coupled to a first circuit element and to a second circuit element, wherein a material of the superconducting layer comprises Tantalum Nitride.

Abstract: One or more systems, devices, methods of use and/or methods of fabrication provided herein relate to a device that can facilitate qubit measurement with isolation imposed between a quantum processor and a respective qubit measurement circuit and/or which respective qubit measurement circuit can have a small footprint, such as within a respective cryogenic chamber of a quantum system. According to one embodiment, a device comprises an isolator circuit having a bandpass filter configuration coupled between a pair of ports and the bandpass filter configuration comprising two or more poles. Two or more shunt resonators can be realized as the two or more poles, wherein the two or more shunt resonators can comprise DC SQUIDs and can be coupled together with one or more admittance inverters. A non-reciprocal signal transmission can be generated between the two ports by RF pumping the DC SQUIDs.

Abstract: A quantum computing system includes a cryostat to support a low-temperature vacuum environment during operation of the quantum computing system; a quantum processor positioned in the cryostat; a first electronic control module external to the cryostat; a second electronic control module within the cryostat; at least one optical transmission line connecting the first electronic control module external to the cryostat with the second electronic control module internal to the cryostat, the optical transmission line being configured to transmit optical signals to and from the second electronic control module during operation of the quantum computing system; and a plurality of signal lines connecting the second electronic control module with the quantum processor, a first subset of the signal lines being configured to transmit microwave signals to and from the quantum processor during operation of the quantum computing system.

Abstract: In a general aspect, a microwave quantum circuit includes an on-chip impedance matching circuit. In some cases, a microwave quantum circuit includes a dielectric substrate, a quantum circuit device on the substrate, and an impedance matching circuit device on the substrate. The quantum circuit device includes a Josephson junction, and the impedance matching circuit device is coupled to the quantum circuit device on the substrate.

Abstract: In a general aspect, a microwave quantum circuit includes an on-chip impedance matching circuit. In some cases, a microwave quantum circuit includes a dielectric substrate, a quantum circuit device on the substrate, and an impedance matching circuit device on the substrate. The quantum circuit device includes a Josephson junction, and the impedance matching circuit device is coupled to the quantum circuit device on the substrate.