Abstract: A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.

Abstract: A method for manufacturing an arrestor for an electrostatic chuck includes printing first layers of an arrestor for an electrostatic chuck using a 3-D printer and an electrically non-conductive material. The first layers of the arrestor at least partially define a first opening to a gas flow channel. The method includes printing intermediate layers of the arrestor using the 3-D printer and the electrically non-conductive material. The intermediate layers of the arrestor at least partially define the gas flow channel. The method includes printing second layers of the arrestor using the 3-D printer and the electrically non-conductive material. The second layers of the arrestor at least partially define a second opening of the gas flow channel. At least one of the first opening, the second opening and/or the gas flow channel of the arrestor is arranged to prevent a direct line of sight between the first opening and the second opening of the arrestor.

Abstract: A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.

Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.

Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.

Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.

Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.

Abstract: A method for manufacturing an arrestor for an electrostatic chuck includes printing first layers of an arrestor for an electrostatic chuck using a 3-D printer and an electrically non-conductive material. The first layers of the arrestor at least partially define a first opening to a gas flow channel. The method includes printing intermediate layers of the arrestor using the 3-D printer and the electrically non-conductive material. The intermediate layers of the arrestor at least partially define the gas flow channel. The method includes printing second layers of the arrestor using the 3-D printer and the electrically non-conductive material. The second layers of the arrestor at least partially define a second opening of the gas flow channel. At least one of the first opening, the second opening and/or the gas flow channel of the arrestor is arranged to prevent a direct line of sight between the first opening and the second opening of the arrestor.

Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.

Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.

Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.

Abstract: The disclosure presents an innovative apparatus for use in instructing hitters how to focus one's field of vision into a preselected angular field; the invention is also a method of providing this instruction. The apparatus includes a helmet and a shroud configured to engage the helmet. An elongate opening is formed on the shroud to restrict a wearer's field of vision to a preselected angle.

Abstract: A system and method for enticing pet play includes a pet amusement device having an arch-shaped rocking platform and a member attached to the rocking platform that has a track formed therein. The track, which is not a closed loop, extends from a first end of the member to a second end of the member. Engaged with the member is a moveable object that may move along the track that is formed therein.

Abstract: The disclosure presents an innovative apparatus for use in instructing hitters how to focus one's field of vision into a preselected angular field; the invention is also a method of providing this instruction. The apparatus includes a helmet and a shroud configured to engage the helmet. An elongate opening is formed on the shroud to restrict a wearer's field of vision to a preselected angle.

Abstract: A collapsible birdhouse or feeder having a bottom panel, a back panel having a foldable frame member, a front panel having a foldable frame member, and a top panel. A strap or suction cups are used to secure the structure to a support or window. The front panel has an opening to allow the ingress and egress of birds.

Abstract: An ironing pad having a relatively flexible laminate structure including among its layers an integrally formed, independent layer supporting hollow core units which are disposed adjacent to one another and being received in an individual pocket formed in overlying layers of a closed-sided envelope, and in which hollow core is formed of a plurality of contiguous adjacent open-cell cavities which provide a heat barrier in addition to a layer of relatively high-compressive strength for supporting the weight of steam or flat iron pressing of fabric materials. The pad assembly may include three separate hollow core heat barrier units in hinged relationship with one another to provide a relatively shortened lengthwise dimension to the entire assembly when the end units are folded.

Abstract: A brushless DC motor apparatus includes a housing and a stator assembly coupled to the housing. The apparatus further includes a magnetic rotor assembly rotatably coupled to the housing. The magnetic rotor assembly is configured to rotate within the housing in response to electric currents through windings of the stator assembly. The apparatus further includes position sensors which are configured to provide position signals identifying angular position of the magnetic rotor assembly relative to the stator assembly. Each position sensor includes (i) a Hall-effect sensor disposed distally from the windings, and (ii) magnetic circuit members having first end portions adjacent the windings and proximate rotor magnets and second end portions adjacent the Hall-effect sensor. Use of such magnetic circuit members enables the Hall-effect sensors to reside a greater distance from the windings vis-à-vis conventional brushless DC motors which position sensors adjacent to stator coils within motor casings.

Abstract: A collapsible structure having a top panel, bottom panel, side panels, a front panel, and a rear panel releasibly attached and forming an enclosure having a door. Each top, bottom, and side panel comprises a two-ply web of material and a removably seated continuous loop frame. One or more handles may be attached to the structure or formed within one or more of the panels. A method of making and collapsing the structure is also disclosed.

Abstract: A safety interlock apparatus which prevents a machine from operating whenever any of the interlocking conditions are not satisfied. The apparatus provides two levels of protection, where both levels must be satisfied before permitting power to be supplied to the device. The first level is provided by a novel fiber optic switch which cannot be defeated or bypassed in normal operating situations. The switch includes a fiber optic "lock" that must be mated with an infrared "key". The second level of protection involves the monitoring of the AC voltage at the load. For interlock system to be satisfied no voltage can exist without the first level of protection also being satisfied.