Patents by Inventor Michael Kessler

Michael Kessler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200343695
    Abstract: Examples herein relate to optical modules. In particular, implementations herein relate to optical modules that include top-emitting VCSELs and/or top-entry photodetectors. The optical modules include a substrate having opposing first and second sides. The optical modules further includes a first interposer having opposing first and second sides and a plurality of top-emitting vertical-cavity surface-emitting lasers (VCSELs). The VCSELs are flip-chipped to the second side of the first interposer such that they are disposed between the substrate and the first interposer. The VCSELs are configured to emit optical signals having different wavelengths. The optical signals are configured to be combined and transmitted over a single optical fiber. The optical modules include a plurality of electrical conductors forming electrical paths between electrical contacts of the top-emitting VCSELs and the substrate.
    Type: Application
    Filed: April 29, 2019
    Publication date: October 29, 2020
    Inventors: Sagi Varghese Mathai, Paul Kessler Rosenberg, Wayne Victor Sorin, Michael Renne Ty Tan
  • Publication number: 20200335951
    Abstract: An inner compartment for medium voltage gas insulated switchgears includes: at least one inner compartment; and a housing. The inner compartment, or in case of several inner compartments, an inner of the inner compartment, or one of the inner compartments, is provided on an inner wall surface thereof at least partially with an insulating layer.
    Type: Application
    Filed: June 17, 2020
    Publication date: October 22, 2020
    Inventors: Dietmar Gentsch, Michael Kessler, Dalibor Kopp, Christian Reuber
  • Patent number: 10795103
    Abstract: Optoelectronic devices with a support member and methods of manufacturing or assembling the same are provided. An example of an optoelectronic device according to the present disclosure includes a substrate and an optical component and an electronic component disposed thereon or therein. The optoelectronic device further includes a ferrule coupled to the optical fiber and an optical socket receiving the ferrule therein. The optoelectronic device includes a support member disposed between the substrate and the optical socket such that the optical socket is spaced from the substrate by the support member.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: October 6, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Paul Kessler Rosenberg, Sagi Mathai, Michael Renne Ty Tan
  • Patent number: 10795091
    Abstract: An example adaptor for passively aligning an optical component of an optical connector with a ferrule of the optical connector. The adaptor may include first alignment feature and second alignment features. The first alignment features may be to, when the adaptor is connected to the ferrule, cooperate with alignment features of the ferrule to passively force the adaptor into a first configuration relative to the ferrule. The second alignment features may be arranged such that, when the optical component is held in contact with the second alignment features and the adaptor is in the first configuration relative to the ferrule, the optical component is in an aligned position relative to the ferrule.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: October 6, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Paul Kessler Rosenberg, Sagi Mathai, Michael Tan
  • Publication number: 20200306829
    Abstract: The present invention relates to a method for producing a treated object, comprising the steps of: applying a layer of particles to a target area; applying a liquid binder to a selected portion of the layer in accordance with a cross-section of the object, so that the particles in the selected portion are bonded; repeating the steps of applying a layer of particles and applying a binder for a plurality of layers so that the bonded portions of the adjacent layers are bonded to form an object, wherein at least a part of the particles comprises a meltable polymer. A binder which cures by cross-linking is preferably selected as the binder. The obtained object is at least partially contacted with a liquid heated to ?T or with a powder bed heated to ?T in order to obtain the treated object. T represents a temperature of ?25° C.
    Type: Application
    Filed: December 18, 2018
    Publication date: October 1, 2020
    Inventors: Dirk Achten, Thomas Buesgen, Roland Wagner, Jonas Kuenzel, Michael Kessler, Bettina Mettmann
  • Publication number: 20200307073
    Abstract: The invention relates to an additive manufacturing process (3D printing) using particles having a meltable polymer. The meltable polymer comprises a thermoplastic polyurethane polymer which has a melting range (DSC, Differential Scanning calorimetry; second heating at heating rate 5 K/min) of 160 to 270° C. and a Shore D hardness according to DIN ISO 7619-1 of 50 or more and which, at a temperature T, has a melt volume rate (melt volume rate (MVR)) according to ISO 1133 of 5 to 15 cm/10 min and a change of the MVR, when this temperature T increases by 20° C., of greater than or equal to 90 cm3/10 min. The invention also relates to an item which can be obtained by means of the method.
    Type: Application
    Filed: December 13, 2018
    Publication date: October 1, 2020
    Inventors: Dirk Achten, Thomas Buesgen, Michael Kessler, Peter Reichert, Bettina Mettmann
  • Publication number: 20200307076
    Abstract: The invention relates to an additive manufacturing process (3D printing) using particles having a meltable polymer. The meltable polymer comprises a thermoplastic polyurethane polymer which has a flowing temperature (intersection of E? and E? in the DMA) of ?80° C. to <180° C. and a Shore A hardness according to DIN ISO 7619-1 of ?50 Shore A and <85 Shore A and which, at a temperature T, has a melt volume rate (melt volume rate (MVR)) according to ISO 1133 of ?5 to <15 cm3/10 min. The invention also relates to an item which can be obtained by means of the method.
    Type: Application
    Filed: December 13, 2018
    Publication date: October 1, 2020
    Inventors: Dirk Achten, Thomas Buesgen, Michael Kessler, Peter Reichert, Bettina Mettmann
  • Patent number: 10788633
    Abstract: In example implementations, an apparatus is provided. The apparatus includes an optical transmission component and an optical reception component. The optical transmission component includes a plurality of lasers and a transmit filter. The plurality of lasers each emit a different wavelength of light. The transmit filter includes a plurality of different regions that correspond to one of the different wavelengths of light emitted by the plurality of lasers. The optical reception component includes a plurality of photodiodes and a complementary reverse order (CRO) filter. The CRO filter includes a same plurality of different regions as the transmit filter in a reverse order.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: September 29, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, Paul Kessler Rosenberg, Sagi Mathai, Wayne Victor Sorin, Michael Renne Ty Tan, Georgios Panotopoulos
  • Patent number: 10717622
    Abstract: A delivery device for a sheet-processing machine, comprises at least one deposition station and a conveyer station, by the use of which, upstream-processed sheets of printed material can be picked up in a transfer location, and can be conveyed through the deposition station via a first conveying system, where they can be deposited optionally to form a stack, or can be conveyed beyond that stack. A holding device, which holds down the uppermost sheet of the stack during the transfer of a sheet to be conveyed against an entrainment or a lifting, is provided with one or with a plurality of holding assemblies which are spaced apart from each other transversely to the transport direction. A sheet-guiding element may be provided, which adjoins the deposition station and which is variable in its vertical position with at least its upstream end by the use of an actuating drive.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: July 21, 2020
    Assignee: KOENIG & BAUER AG
    Inventors: Michael Koch, Volker Taschenberger, Jens Bellmann, Dietmar Aust, Jörg Reber, Volker Kessler, Tino Morgenstern, Steffen Piesch
  • Publication number: 20200189035
    Abstract: A method and a device for fusion welding one or more steel sheets made of press-hardenable steel, preferably manganese-boron steel; are disclosed. In the method, the fusion welding is performed by supplying filler wire into a molten bath generated a laser beam. In order to improve the hardenability of the weld seam, regardless of whether the steel sheets to be welded to one another are steel sheets of identical or different material quality, the filler wire is coated with graphite particles prior to fusion welding and the filler wire coated in this manner is introduced directly into the molten bath in such a way that the tip of the filler wire melts in the molten bath, the graphite particles are mixed with a waxy or liquid carrier medium to be applied to the filler wire, and the mixture is applied in the form of a coating to the filler wire. The method and the corresponding device are distinguished by a high productivity and a relatively low energy consumption.
    Type: Application
    Filed: August 9, 2018
    Publication date: June 18, 2020
    Inventors: Jana von der Heydt, Christian Both, Michael Kessler
  • Patent number: 10678006
    Abstract: An example method of manufacturing an optical interface. An optical socket may be provided that has an alignment feature that is to engage an optical connector, and first solder attachment pads. A printed circuit board may be provided that has an active optical device and second solder attachment pads. The optical socket may be connected to the printed circuit board by reflowing solder between the first and second solder attachment pads. The first and second solder attachment pads, the alignment feature, and the active optical device are positioned such that, while reflowing the solder, the solder automatically forces the optical socket into an aligned position.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: June 9, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Paul Kessler Rosenberg, Michael Renne Ty Tan, Kevin Leigh
  • Publication number: 20200172803
    Abstract: Luminescent materials that include a luminescent phosphor compound, articles including a security feature, and methods for producing the luminescent phosphor compounds are provided herein. In an embodiment, a luminescent material includes a medium and luminescent particles. The luminescent particles include a luminescent benzothiazole having a ureido linkage. The luminescent benzothiazole has a peak intensity within a wavelength of from about 555 to about 630 nm in response to excitation with electromagnetic radiation at a wavelength of about 366 nm.
    Type: Application
    Filed: November 26, 2019
    Publication date: June 4, 2020
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Thomas Potrawa, Michael Kessler
  • Publication number: 20200150729
    Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.
    Type: Application
    Filed: January 18, 2020
    Publication date: May 14, 2020
    Inventors: Eugene A. Whang, Christopher J. Stringer, Brett W. Degner, David H. Narajowski, Patrick Kessler, Eric R. Prather, Caitlin Elizabeth Kalinowski, Adam T. Stagnaro, Daniel L. McBroom, Matthew P. Casebolt, Michael D. McBroom
  • Publication number: 20200132953
    Abstract: Optoelectronic devices with a support member and methods of manufacturing or assembling the same are provided. An example of an optoelectronic device according to the present disclosure includes a substrate and an optical component and an electronic component disposed thereon or therein. The optoelectronic device further includes a ferrule coupled to the optical fiber and an optical socket receiving the ferrule therein. The optoelectronic device includes a support member disposed between the substrate and the optical socket such that the optical socket is spaced from the substrate by the support member.
    Type: Application
    Filed: October 30, 2018
    Publication date: April 30, 2020
    Inventors: Paul Kessler Rosenberg, Sagi Mathai, Michael Renne Ty Tan
  • Publication number: 20200084993
    Abstract: A mushroom culture of Agaricus bisporus, comprising at least one set of chromosomes as a culture of line J14756-s3, includes a representative culture of the line, which has been deposited under NRRL Accession No. 67317. A method of producing a hybrid mushroom culture of Agaricus bisporus comprising: mating a culture comprising at least one set of chromosomes as a culture of line J14756-s3 with a second homokaryotic line culture. Additionally, mushrooms, parts of the culture and products incorporating the culture of the invention are provided.
    Type: Application
    Filed: November 28, 2017
    Publication date: March 19, 2020
    Inventors: Richard KERRIGAN, Mark WACH, Michelle SCHULTZ, Mark G. LOFTUS, Michael A. KESSLER, William P. SWANIK, Anne RODIER, Anica AMINI, Sylvie DELBECQUE, Richard RUCKLIDGE
  • Publication number: 20200088947
    Abstract: In example implementations, an optical connector is provided. The optical connector includes a jumper holder, a base bracket, and an optical ferrule. The jumper holder holds a plurality of ribbon fibers. The base bracket is coupled to an electrical substrate to mate with the jumper holder. The optical ferrule is coupled to an end of each one of the plurality of ribbon fibers. The optical ferrule is laterally inserted into a corresponding orthogonal socket that is coupled to a silicon interposer on the electrical substrate to optically mate the optical ferrule to the orthogonal socket.
    Type: Application
    Filed: November 25, 2019
    Publication date: March 19, 2020
    Inventors: Kevin B. Leigh, Paul Kessler Rosenberg, Sagi Mathai, Mir Ashkan Seyedi, Michael Renne Ty Tan, Wayne Victor Sorin, Marco Fiorentino
  • Patent number: 10564335
    Abstract: In the examples provided herein, an apparatus has an optically transparent block having a filter surface. The apparatus also has two or more filters, where each of the filters has thin films fabricated on an optically transparent substrate, and further wherein the thin films of the filters are coupled to the filter surface. Additionally, the apparatus has an optically transparent overmold material encasing the two or more filters, where the overmold material fills a volume between and above neighboring ones of the two or more filters.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: February 18, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Varghese Mathai, Paul Kessler Rosenberg, Michael Renne Ty Tan
  • Publication number: 20200047410
    Abstract: The present invention relates to a method for producing an object, comprising the step of producing the object according to an additive production process from a construction material, wherein the construction material comprises a mixture of a plurality of powdery thermoplastic materials which are different from one another due to at least one mechanical property and at least one thermoplastic material is a thermoplastic polyurethane material. The invention also relates to an object obtained according to said method.
    Type: Application
    Filed: April 23, 2018
    Publication date: February 13, 2020
    Inventors: Dirk ACHTEN, Thomas BÜSGEN, Bettina METTMANN, Michael KESSLER, Peter REICHERT, Roland WAGNER
  • Publication number: 20200049909
    Abstract: In some examples a silicon photonic (SiPh) solder reflowable assembly may comprise a silicon interposer bonded to an organic substrate, the silicon interposer having an optical grating disposed on the interposer to couple an optical signal, a lens array chip, the lens array comprising one or more lenses on a wafer, the lens array chip flip chip reflowed to the silicon interposer by a bonding agent and the one or more lenses having a predetermined shape that expands, collimates, and tilts a beam of the optical signal exiting the grating. The wafer has a coefficient of thermal expansion (CTE) that matches silicon and the one or more lenses and the grating are aligned in such a way the optical signal enters the grating at a desired angle.
    Type: Application
    Filed: January 30, 2017
    Publication date: February 13, 2020
    Inventors: Sagi Mathai, Michael Rene Ty Tan, Marco Fiorentino, Paul Kessler Rosenberg, David Kielpinski, Wayne Victor Sorin
  • Patent number: 10539984
    Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: January 21, 2020
    Assignee: Apple Inc.
    Inventors: Eugene A. Whang, Christopher J. Stringer, Brett W. Degner, David H. Narajowski, Patrick Kessler, Eric R. Prather, Caitlin Elizabeth Kalinowski, Adam T. Stagnaro, Daniel L. McBroom, Matthew P. Casebolt, Michael D. McBroom