Abstract: A situational awareness analysis and fatigue management system including a processor that receives input data from a user, generates a set of algorithms from the input data, calculates outputs of each of the set of algorithms, and generates and displays a dynamic assessment situational awareness (DASA) diagram of the user as a function of situational awareness performance and wakefulness hours of the user from the calculated output. Using the DASA diagram, the processor identifies situational awareness longevity conditions of the user to perform a task, forecasts advanced fatigue conditions of the user based on the identified situational awareness longevity conditions and identifies improvements of situational awareness performance of the user to perform the task. The processor displays the identified situational awareness longevity conditions, the forecast of advanced fatigue conditions and the improvements of situational awareness performance of the user to perform the task to one or more second users.

Abstract: An electronic alerting device may include an earpiece adapted to be worn at the driver ear. The earpiece may include a microchip and a sensor located at an outer surface of the earpiece. The sensor may be capable of detecting when the driver eyelid closes and opens by generating and transmitting eyelid detection signals to the microchip when the driver eyelid closes and opens respectively. A transducer may be attached to the earpiece and adapted to be placed in the driver ear. A communication interface may be used to enable the microchip to communicate with the transducer. The microchip may determine a number of continuous occurrences of the eyelid detection signals and thereby generates and transmits control signals to the transducer when the number of continuous occurrences of the eyelid detection signals is above and below a threshold number of continuous occurrences within a unit of time.

Abstract: A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240° C. and in the case of the conduction adhesive, will cure below about 240° C. The preform with the filled through holes is interposed between the module and the substrate with the material in the holes in contact with the solder balls or columns and the contact pads.

Abstract: A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240° C. and in the case of the conduction adhesive, will cure below about 240° C. The preform with the filled through holes is interposed between the module and the substrate with the material in the holes in contact with the solder balls or columns and the contact pads.

Abstract: A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240° C. and in the case of the conduction adhesive, will cure below about 240° C. The preform with the filled through holes is interposed between the module and the substrate with the material in the holes in contact with the solder balls or columns and the contact pads.

Abstract: A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240.degree. C. and in the case of the conduction adhesive, will cure below about 240.degree. C. In the case of solid solder, thin films of flux material can be applied to opposite faces of the preform to prevent the solder from dislodging therefrom and to act as a flux when the solder is reflowed.