Abstract: An electronic package assembly that has a clip which attaches a heat sink to an electronic package and can be rotated to separate the package from a socket. The assembly includes a socket that is mounted to a printed circuit board and attached to a lower frame. The electronic package is attached to an upper frame that is pivotally connected to the lower frame. The package can be plugged and unplugged from the socket by rotating the upper frame relative to the lower frame. The clip has a first end with an aperture that is connected to a corresponding tab of the lower frame, and a second opposite end that has an aperture which is connected to a corresponding tab of the upper frame. The clip has a spring portion that extends across the heat sink and which presses the heat sink onto the package. The second clip end has a handle portion which allows the end user to pull the clip and rotate the upper frame away from the lower frame to detach the package from the socket.