Abstract: The invention relates to a circuit arrangement and a switching module, in which an attenuator is, for EMV suppression of a DC motor, connected to the lines of the DC motor. The attenuator comprises a ferrite, particularly a common mode ferrite.

Abstract: The invention relates to a circuit configuration (1) for controlling the operation of a half-bridge (13) by pulse-width modulation, especially in a synchronous rectifier mode. Said circuit configuration comprises a first terminal connection (23, 25) for electrically connecting the circuit configuration (1) to an insulated gate terminal of a bridge valve (15, 17) of the half-bridge (13), a second terminal connection (20, 22) for electrically connecting the circuit configuration (1) to an additional terminal of the bridge valve (15, 17), a lead (16, 18) electrically connecting the first terminal connection (23, 25) to the second terminal connection (20, 22), and an electric valve (43, 45) that can be switched on and off by pulse-width modulated signals. Said electric valve (43, 45) is disposed in the lead (16, 18) so that a flow of current through the lead (16, 18) can be released and blocked.

Abstract: To improve EMC shielding for an electronic unit containing at least one electronic power device operated at high frequency and a metal housing thermally coupled to the device to provide heat dissipation, the power device with a device terminal is thermally and electrically coupled to a first metal plate. The first metal plate is coupled in turn to a second metal plate in a particular manner via a first insulating layer. A metal housing with a heat sink through which a cooling fluid can flow is disposed, on another side of a second insulating layer. The improvement in EMC is based on an internal short-circuiting of an interference current produced by the power device over a very short loop.

Abstract: The invention relates to a circuit arrangement and a switching module, in which an attenuator is, for EMV suppression of a DC motor, connected to the lines of the DC motor. The attenuator comprises a ferrite, particularly a common mode ferrite.

Abstract: To improve EMC shielding for an electronic unit containing at least one electronic power device operated at high frequency and a metal housing thermally coupled to the device to provide heat dissipation, the power device with a device terminal is thermally and electrically coupled to a first metal plate. The first metal plate is coupled in turn to a second metal plate in a particular manner via a first insulating layer. A metal housing with a heat sink through which a cooling fluid can flow is disposed, on another side of a second insulating layer. The improvement in EMC is based on an internal short-circuiting of an interference current produced by the power device over a very short loop.

Abstract: The circuit has a power stage (LE) with heat generating components mounted around at least one component that generates less heat mounted in an inner region. The heat generating components are connected to at least one conducting metal body (K1) that is mounted on a cooling body (KK) in electrically insulated manner to cool the components. The cooling body encloses the inner region.

Abstract: A plastic frame (8) serves for the simple mounting of an electronic heavy-current control unit. It has cutouts (20, 21, 22, 23, 24) for the positionally accurate receiving of busbars (4, 5, 6, 7; 4a; 4b; 4c), metal plates (3) and electrical/electronic components (9; 9a to 9g) and also the potting compound (10) thereof and is provided with integrally formed snap-action elements (11, 12) for connection to a heat sink (1).

Abstract: The circuit has a power stage (LE) with heat generating components mounted around at least one component that generates less heat mounted in an inner region. The heat generating components are connected to at least one conducting metal body (K1) that is mounted on a cooling body (KK) in electrically insulated manner to cool the components. The cooling body encloses the inner region.

Abstract: A mounting configuration of electric and/or electronic components, in particular electrolytic capacitors, on a printed circuit board is described. The printed circuit board is formed by at least two metallic plates insulated electrically from one another by an insulating layer that preferably conducts heat well and has holes for the connecting pins of the electric and/or electronic components. Through which holes the connecting pins are plugged and connected electrically to the respectively associated metallic plate.

Abstract: A plastic frame (8) serves for the simple mounting of an electronic heavy-current control unit. It has cutouts (20, 21, 22, 23, 24) for the positionally accurate receiving of busbars (4, 5, 6, 7; 4a; 4b; 4c), metal plates (3) and electrical/electronic components (9; 9a to 9g) and also the potting compound (10) thereof and is provided with integrally formed snap-action elements (11, 12) for connection to a heat sink (1).

Abstract: A mounting configuration of electric and/or electronic components, in particular electrolytic capacitors, on a printed circuit board is described. The printed circuit board is formed by at least two metallic plates insulated electrically from one another by an insulating layer that preferably conducts heat well and has holes for the connecting pins of the electric and/or electronic components. Through which holes the connecting pins are plugged and connected electrically to the respectively associated metallic plate.