Abstract: A radio frequency (RF) generator includes a RF power source configured to output an RF power signal, and a controller coupled to the RF power source. The controller is configured to generate a pulse to modulate the RF power signal of the RF power source. The pulse includes one or more state transitions. The controller is further configured to receive a sync signal indicative of one or more operating characteristics or parameters of another RF generator, and adjust at least one of the state transitions of the pulse to synchronize the state transition with a defined phase of the received sync signal. Other example RF generators, RF power delivery systems including one or more RF generators, and control methods for adjusting a state transition of a pulse to synchronize the state transition with a defined phase of a sync signal are also disclosed.

Abstract: A varistor is provided having a rectangular configuration defining first and second opposing end surfaces offset in a lengthwise direction. The varistor may include a first terminal adjacent the first opposing end surface and a second terminal adjacent the second opposing end surface. The varistor may include an active electrode layer including a first electrode electrically connected with the first terminal and a second electrode electrically connected with the second terminal. The first electrode may be spaced apart from the second electrode in the lengthwise direction to form an active electrode end gap. The varistor may include a floating electrode layer including a floating electrode. The floating electrode layer may be spaced apart from the active electrode layer in a height-wise direction to form a floating electrode gap. A ratio of the active electrode end gap to the floating electrode gap may be greater than about 2.

Abstract: A radio frequency (RF) generator includes a RF power source configured to output an RF power signal, and a controller coupled to the RF power source. The controller is configured to generate a pulse to modulate the RF power signal of the RF power source. The pulse includes one or more state transitions. The controller is further configured to receive a sync signal indicative of one or more operating characteristics or parameters of another RF generator, and adjust at least one of the state transitions of the pulse to synchronize the state transition with a defined phase of the received sync signal. Other example RF generators, RF power delivery systems including one or more RF generators, and control methods for adjusting a state transition of a pulse to synchronize the state transition with a defined phase of a sync signal are also disclosed.

Abstract: Disclosed are apparatus and a method for providing an integrated multiterminal multilayer ceramic device that has three or more capacitive elements. Two of such capacitive elements may be in series, with a third in parallel. The integrated device may be packaged as an overmolded three leaded component, or can be mounted as SMD (surface mount device). The integrated device may also be combined with a separate varistor in a stacked arrangement of leaded components.

Abstract: A varistor is provided having a rectangular configuration defining first and second opposing end surfaces offset in a lengthwise direction. The varistor may include a first terminal adjacent the first opposing end surface and a second terminal adjacent the second opposing end surface. The varistor may include an active electrode layer including a first electrode electrically connected with the first terminal and a second electrode electrically connected with the second terminal. The first electrode may be spaced apart from the second electrode in the lengthwise direction to form an active electrode end gap. The varistor may include a floating electrode layer including a floating electrode. The floating electrode layer may be spaced apart from the active electrode layer in a height-wise direction to form a floating electrode gap. A ratio of the active electrode end gap to the floating electrode gap may be greater than about 2.

Abstract: A varistor is provided having a rectangular configuration defining first and second opposing end surfaces offset in a lengthwise direction. The varistor may include a first terminal adjacent the first opposing end surface and a second terminal adjacent the second opposing end surface. The varistor may include an active electrode layer including a first electrode electrically connected with the first terminal and a second electrode electrically connected with the second terminal. The first electrode may be spaced apart from the second electrode in the lengthwise direction to form an active electrode end gap. The varistor may include a floating electrode layer including a floating electrode. The floating electrode layer may be spaced apart from the active electrode layer in a height-wise direction to form a floating electrode gap. A ratio of the active electrode end gap to the floating electrode gap may be greater than about 2.

Abstract: A method is disclosed for making a multilayer electronic device. The method includes placing a screen printing mask on a layer of support material and printing a conductive pattern on a layer of support material using the screen printing mask. The conductive pattern includes a plurality of electrode shapes including respective central enlarged portions. The method includes cutting the layer of support material and conductive pattern along a plurality of cutting lines intersecting the central enlarged portions such that at least one of the plurality of electrode shapes is divided into a pair of electrodes along a cutting width. The cutting width is indicative of a cutting accuracy associated with at least one of the cutting lines.

Abstract: Disclosed are apparatus and a method for providing an integrated multiterminal multilayer ceramic device that has three or more capacitive elements. Two of such capacitive elements may be in series, with a third in parallel. The integrated device may be packaged as an overmolded three leaded component, or can be mounted as SMD (surface mount device). The integrated device may also be combined with a separate varistor in a stacked arrangement of leaded components.

Abstract: A inspection system includes an illumination source to generate an illumination beam, focusing elements to direct the illumination beam to a sample, a detector, collection elements configured to direct radiation emanating from the sample to the detector, a detection mode control device to image the sample in two or more detection modes such that the detector generates two or more collection signals based on the two or more detection modes, and a controller. Radiation emanating from the sample includes at least radiation specularly reflected by the sample and radiation scattered by the sample. The controller determines defect scattering characteristics associated with radiation scattered by defects on the sample based on the two or more collection signals. The controller also classifies the one or more particles according to a set of predetermined defect classifications based on the one or more defect scattering characteristics.

Abstract: Disclosed are apparatus and a method for providing an integrated multiterminal multilayer ceramic device that has three or more capacitive elements. Two of such capacitive elements may be in series, with a third in parallel. The integrated device may be packaged as an overmolded three leaded component, or can be mounted as SMD (surface mount device). The integrated device may also be combined with a separate varistor in a stacked arrangement of leaded components.

Abstract: A low aspect ratio varistor is disclosed. The varistor may have a rectangular configuration defining first and second opposing side surfaces offset in a widthwise direction and first and second opposing end surfaces offset in a lengthwise direction. The varistor may include a first electrode layer including a first electrode having an electrode length in the lengthwise direction and an electrode width in the widthwise direction. The varistor may also include a second electrode layer including a second electrode having an electrode length in the lengthwise direction and an electrode width in the widthwise direction. The varistor may also include first and second terminals adjacent and connected with the first and second opposing end surfaces, respectively. At least one of the first or second electrodes may have an electrode aspect ratio less than about 1.

Abstract: A varistor is provided having a rectangular configuration defining first and second opposing end surfaces offset in a lengthwise direction. The varistor may include a first terminal adjacent the first opposing end surface and a second terminal adjacent the second opposing end surface. The varistor may include an active electrode layer including a first electrode electrically connected with the first terminal and a second electrode electrically connected with the second terminal. The first electrode may be spaced apart from the second electrode in the lengthwise direction to form an active electrode end gap. The varistor may include a floating electrode layer including a floating electrode. The floating electrode layer may be spaced apart from the active electrode layer in a height-wise direction to form a floating electrode gap. A ratio of the active electrode end gap to the floating electrode gap may be greater than about 2.

Abstract: A inspection system includes an illumination source to generate an illumination beam, focusing elements to direct the illumination beam to a sample, a detector, collection elements configured to direct radiation emanating from the sample to the detector, a detection mode control device to image the sample in two or more detection modes such that the detector generates two or more collection signals based on the two or more detection modes, and a controller. Radiation emanating from the sample includes at least radiation specularly reflected by the sample and radiation scattered by the sample. The controller determines defect scattering characteristics associated with radiation scattered by defects on the sample based on the two or more collection signals. The controller also classifies the one or more particles according to a set of predetermined defect classifications based on the one or more defect scattering characteristics.

Abstract: A low aspect ratio varistor is disclosed. The varistor may have a rectangular configuration defining first and second opposing side surfaces offset in a widthwise direction and first and second opposing end surfaces offset in a lengthwise direction. The varistor may include a first electrode layer including a first electrode having an electrode length in the lengthwise direction and an electrode width in the widthwise direction. The varistor may also include a second electrode layer including a second electrode having an electrode length in the lengthwise direction and an electrode width in the widthwise direction. The varistor may also include first and second terminals adjacent and connected with the first and second opposing end surfaces, respectively. At least one of the first or second electrodes may have an electrode aspect ratio less than about 1.

Abstract: A method is disclosed for making a multilayer electronic device. The method includes placing a screen printing mask on a layer of support material and printing a conductive pattern on a layer of support material using the screen printing mask. The conductive pattern includes a plurality of electrode shapes including respective central enlarged portions. The method includes cutting the layer of support material and conductive pattern along a plurality of cutting lines intersecting the central enlarged portions such that at least one of the plurality of electrode shapes is divided into a pair of electrodes along a cutting width. The cutting width is indicative of a cutting accuracy associated with at least one of the cutting lines.

Abstract: A inspection system includes an illumination source to generate an illumination beam, focusing elements to direct the illumination beam to a sample, a detector, collection elements configured to direct radiation emanating from the sample to the detector, a detection mode control device to image the sample in two or more detection modes such that the detector generates two or more collection signals based on the two or more detection modes, and a controller. Radiation emanating from the sample includes at least radiation specularly reflected by the sample and radiation scattered by the sample. The controller determines defect scattering characteristics associated with radiation scattered by defects on the sample based on the two or more collection signals. The controller also classifies the one or more particles according to a set of predetermined defect classifications based on the one or more defect scattering characteristics.

Abstract: Disclosed are apparatus and a method for providing an integrated multi-terminal multilayer ceramic device that has three or more capacitive elements. Two of such capacitive elements may be in series, with a third in parallel. The integrated device may be packaged as an overmolded three leaded component, or can be mounted as SMD (surface mount device). The integrated device may also be combined with a separate varistor in a stacked arrangement of leaded components.

Abstract: Systems and methods for prediction of in-plane distortions (IPD) due to wafer shape in semiconductor wafer chucking process is disclosed. A series of Zernike basis wafer shapes process to emulate the non-linear finite element (FE) contact mechanics model based IPD prediction is utilized in accordance with one embodiment of the present disclosure. The emulated FE model based prediction process is substantially more efficient and provides accuracy comparable to the FE model based IPD prediction that utilizes full-scale 3-D wafer and chuck geometry information and requires computation intensive simulations. Furthermore, an enhanced HOS IPD/OPD prediction process based on a series of Zernike basis wafer shape images is also disclosed.

Abstract: A inspection system includes an illumination source to generate an illumination beam, focusing elements to direct the illumination beam to a sample, a detector, collection elements configured to direct radiation emanating from the sample to the detector, a detection mode control device to image the sample in two or more detection modes such that the detector generates two or more collection signals based on the two or more detection modes, and a controller. Radiation emanating from the sample includes at least radiation specularly reflected by the sample and radiation scattered by the sample. The controller determines defect scattering characteristics associated with radiation scattered by defects on the sample based on the two or more collection signals. The controller also classifies the one or more particles according to a set of predetermined defect classifications based on the one or more defect scattering characteristics.

Abstract: Systems and methods for prediction of in-plane distortions (IPD) due to wafer shape in semiconductor wafer chucking process is disclosed. A series of Zernike basis wafer shapes process to emulate the non-linear finite element (FE) contact mechanics model based IPD prediction is utilized in accordance with one embodiment of the present disclosure. The emulated FE model based prediction process is substantially more efficient and provides accuracy comparable to the FE model based IPD prediction that utilizes full-scale 3-D wafer and chuck geometry information and requires computation intensive simulations. Furthermore, an enhanced HOS IPD/OPD prediction process based on a series of Zernike basis wafer shape images is also disclosed.