Abstract: A defect detection device (100) that detects defects in a semiconductor device (13) comprises ultrasonic speakers (21) that ultrasonically vibrate the semiconductor device (13), a laser source (30) that irradiates the semiconductor device (13) with collimated laser light (32), a camera (40) that has an imaging element (42) which acquires images by imaging the semiconductor device (13) that has been irradiated with the collimated laser light (32), and a detection unit (55) that detects defects in the semiconductor device (13) on the basis of the images picked up by the camera (40), wherein the detection unit (55) detects defects in the semiconductor device (13) on the basis of the deviation between images acquired by the camera (40) of the semiconductor device (13) when static and when ultrasonically vibrated.

Abstract: An acoustic foreign matter removal device includes a stage, an acoustic head, and a movement mechanism. The acoustic head has a plurality of ultrasonic speakers and a casing22. A plurality of ultrasonic waves generated from the plurality of ultrasonic speakers are concentrated in a gap between the casing and a holding surface of the stage to form a low pressure region; and foreign matter adhering to a surface of an electronic component is sucked into the low pressure region to remove the foreign matter from the surface.

Abstract: An ultrasonic cleaning method of the invention includes: a cleaning liquid coating step (S101), coating a cleaning liquid on a front surface of an electronic component held on a cleaning stage; a pealing step (S103), irradiating the front surface of the electronic component coated with the cleaning liquid with ultrasonic waves from ultrasonic speakers installed to an acoustic head and peeling off a foreign matter attached to the front surface from the front surface; and an attracting step (S104), concentrating the ultrasonic waves generated from the ultrasonic speakers at a gap between a casing and a holding surface of the cleaning stage to form a low pressure region whose pressure is lower than atmospheric pressure at a central lower part of the casing, and attracting the foreign matter peeled off from the front surface of the electronic component and the cleaning liquid coated on the front surface.

Abstract: An ultrasound vibrating-type defect detection apparatus (100) for detecting a defect in a semiconductor apparatus (10) is provided with: an ultrasound vibrator (42); a high-frequency power supply (40); a camera (45); and a controller (50) for adjusting the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and for performing detection of a defect in the semiconductor apparatus (10). The controller (50) causes the camera (45) to capture an image of the semiconductor apparatus (10) while varying the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and performs detection of a defect in the semiconductor apparatus (10) on the basis of the captured image.

Abstract: Provided is a transfer apparatus. The transfer apparatus includes, in addition to a non-contact chuck that lifts and holds a workpiece in a non-contact manner, a plurality of ultrasonic vibrators that radiate ultrasonic waves. The plurality of ultrasonic vibrators are configured to radiate the ultrasonic waves to generate a standing wave that attracts the workpiece and are configured for the non-contact chuck to hold the workpiece at a position where forces attracting in a plurality of directions toward outside of the workpiece are balanced when viewed from a direction facing the workpiece.

Abstract: A vibration detection system (100) detects vibration of an ultrasonic horn (12), of which the front surface is a non-specular surface, and of a capillary (13), wherein the vibration detection system (100) includes a laser light source (20) that irradiates the ultrasonic horn (12) and the capillary (13) with parallel laser light beams (21), a camera (30) having an imaging element (31) that captures an image of the ultrasonic horn (12) and the capillary (13) irradiated with the parallel laser light beams (21), and an image processing device (40) that processes the image captured by the camera (30) and displays a location where vibration occurs.

Abstract: The present invention provides a wire non-attachment inspection system (100) of a semiconductor device (10), wherein: the wire non-attachment inspection system (100) comprises an ultrasonic oscillator (40), an ultrasonic transducer (42), a camera (45), a display (48), and a control unit (50); and the control unit (50) calculates the difference in image between one frame of a captured video and a previous frame before the one frame, and displays, on the display, an image of a wire for which the difference exceeds a prescribed threshold value so as to be displayed differently than the image of another wire.