Abstract: A connector assembly having a supporting boot and a connector that is retained with the boot and a method for producing the connector assembly. The boot serves as a retention member that includes a through opening sized to receive the connector. The boot includes first and second opposing surfaces. In a preferred embodiment, the opening at the second surface of the boot is sized for an interference fit with the connector. The opening adjacent the first surface of the boot is larger than the opening at the second body surface. The differential sizes of the though hole openings at respective ends of the through-hole provides a flow channel between the connector and the boot. Wells are provided in the first surface of the boot for a binding agent. A liquid binding agent that is injected into the wells flows through the flow channel and securely fixes the connector within the boot.

Abstract: Interconnection apparatus is provided which is especially useful to mount and connect circuit boards having a contact assembly of resilient compressive contacts to a backplane or other mateable board or device. The apparatus includes an enclosure having guide channels for each board to be housed in the enclosure, a contact assembly for providing compressive contact between the contact ends of each board and corresponding contacts of the backplane, and elements for seating each board into engagement with the backplane.

Abstract: Interconnection apparatus is provided which is especially useful to mount and connect circuit boards having a contact assembly of resilient compressive contacts to a backplane or other mateable board or device. The apparatus includes an enclosure having guide channels for each board to be housed in the enclosure, a contact assembly for providing compressive contact between the contact ends of each board and corresponding contacts of the backplane, and elements for seating each board into engagement with the backplane.

Abstract: A dual beam connector with contacts having opposing reverse-bend contact arms and a tab serving as a solder lug carried by the contact pin for increased soldering reliability. The connector housing in which the contacts are mounted includes standoffs which space the connector housing sufficiently above the printed circuit board to which it is mounted to permit visual inspection of the solder bond to the solder lug, to facilitate cleaning of residual flux from between the connector and printed circuit board, and to provide improved heat dissipation by providing an air channel between the connector and printed circuit board. The individual contacts are upwardly inserted, or uploaded, into the connector sockets with tab restraints at the bottom corners of the sockets being hot-pressed over portions of the contact to secure and seal the contact in its respective socket.

Abstract: A low insertion force compliant pin is provided for solderless connection to a printed circuit board in which the pin is provided with an enlarged contact portion, a reduced-diameter shank, and one or more slots through the contact portion and the shank such that when the pin is inserted into a solder plated-through hole in the board, the contact portion is compressed on itself, thereby to provide a spring-biased contact to the interior plated wall of the hole in the board. The compliant pin also provides anti-overstress protection by compressing on itself. The compliant pin is adapted for use with a number of different hole sizes, with spring bias tension being controlled by the elasticity of the pin material and the length of the slot or slots and the diameter of the enlarged contact portion.

Abstract: A socket for a multiple pin electronic component into which the component can be inserted and removed with subtantially no insertion or removal force. The socket comprises a base having an array of spring terminals and a plate slideable with respect to the base and operative to transpose the terminals along the plane of the socket. A camming element is associated with the plate and is movable between open and closed positions. In the open position of the terminals are urged to an open condition to permit easy insertion and removal of the pin terminals of an electronic component. In the closed position, the terminals are in biased engagement with the component pins to provide proper electrical contact.

Abstract: A carrier socket for leadless chip integrated circuit devices. A flat leadless substrate with a circuit chip thereon is positioned within a housing having spring-loaded contacts mounted therein, each such contact adapted to engage a contact pad on the substrate. A resilient cover engages the housing and holds the substrate against the contacts in a positive manner. The contacts are formed to facilitate electrical connection between the integrated circuit chip and a circuit board. The contacts may be secured to the board by various means such as soldering or planar welding.