Patents by Inventor Michael Kleinle

Michael Kleinle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PROCESS FOR THE ELECTROLESS COPPER PLATING OF METALLIC SUBSTRATES
    Publication number: 20130143071
    Abstract: The invention relates to a process for treating a metallic surface of an object with an aqueous copper-plating solution, with which a first copper-plating solution, which is free of cyanide and free of strong reducing agent, is electrolessly applied to clean metallic surfaces of the object, or after pretreatment to cleaned metallic surfaces, to form a first copper layer or copper alloy layer as a barrier layer and/or as a conductive layer, and also to the use of the objects produced by the process according to the invention.
    Type: Application
    Filed: August 10, 2011
    Publication date: June 6, 2013
    Applicant: CHEMETALL GMBH
    Inventor: Michael Kleinle