Abstract: A bonding pad layer system is deposited on a semiconductor chip as a base, for example, a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane made up of dielectric layers, a platinum conductor track and a heater made of platinum is integrated. In the process, the deposition of a tantalum layer takes place first, upon that the deposition of a first platinum layer, upon that the deposition of a tantalum nitride layer, upon that the deposition of a second platinum layer and upon that the deposition of a gold layer, at least one bonding pad for connecting with a bonding wire being formed in the gold layer. The bonding pad is situated in the area of the contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact and/or is connected outside this area.

Abstract: A micromechanical pressure sensor system, including: a substrate; a pressure sensor component connected to the substrate; and an essentially hollow frustum-shaped sleeve structure, which is connected to the substrate, which surrounds the pressure sensor component at least laterally and which has an opening at a side of the sleeve structure facing away from the substrate.

Abstract: A device is described for protecting components, housings and the like against liquids and for ventilating the same, including at least one first layer, the first layer being configured as a diaphragm and this has a first area in such a way that the first area is configured as gas-permeable and liquid-tight below a first liquid pressure, and at least one second layer, the second layer being connected pressure-tight at least in part to the first layer, and having a second area that is configured in such a way that the first area and the second area interact for sealing against a liquid at a liquid pressure greater than or equal to the first liquid pressure.

Abstract: A method for producing a plurality of sensor devices. The method includes: furnishing a substrate having contact points in a plurality of predetermined regions for sensor chips; disposing the sensor chips in the predetermined regions on the substrate, and electrically contacting the sensor chips to the contact points; attaching a frame structure with an adhesive material on the substrate and between the sensor chips, the frame structure proceeding laterally around the sensor chips, the frame structure extending, after attachment, vertically beyond the sensor chips and forming a respective cavity for at least one of the sensor chips, and a membrane spanning at least one of the cavities for the sensor chips so as to cover it; and singulating the substrate, or the frame structure and the substrate, around the respective cavities into several sensor devices.

Abstract: A micromechanical pressure sensor system, including: a substrate; a pressure sensor component connected to the substrate; and an essentially hollow frustum-shaped sleeve structure, which is connected to the substrate, which surrounds the pressure sensor component at least laterally and which has an opening at a side of the sleeve structure facing away from the substrate.

Abstract: A sensor and/or sound detection device having a sensing device having a sensitive surface, an access channel being designed in such a way that air and/or a gas is transferable through the open access channel between a spatial surroundings of the sensor/detection device and the sensitive surface, and an at least partially water-impermeable membrane having respectively an inner side of the membrane facing the associated access channel being designed in such a way that a contact surface on the respective inner side of the respective membrane is pressed against an associated membrane contact surface on the associated access channel in such a way that the associated access channel is sealed in a liquid-tight manner when an outer side of the respective membrane or a covering layer on the respective outer side of the membrane is wetted with at least a minimum quantity of liquid and the respective membrane is deformed.

Abstract: A bonding pad layer system is deposited on a semiconductor chip as a base, for example, a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane made up of dielectric layers, a platinum conductor track and a heater made of platinum is integrated. In the process, the deposition of a tantalum layer takes place first, upon that the deposition of a first platinum layer, upon that the deposition of a tantalum nitride layer, upon that the deposition of a second platinum layer and upon that the deposition of a gold layer, at least one bonding pad for connecting with a bonding wire being formed in the gold layer. The bonding pad is situated in the area of the contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact and/or is connected outside this area.

Abstract: A device is described for protecting components, housings and the like against liquids and for ventilating the same, including at least one first layer, the first layer being configured as a diaphragm and this has a first area in such a way that the first area is configured as gas-permeable and liquid-tight below a first liquid pressure, and at least one second layer, the second layer being connected pressure-tight at least in part to the first layer, and having a second area that is configured in such a way that the first area and the second area interact for sealing against a liquid at a liquid pressure greater than or equal to the first liquid pressure.

Abstract: A sensor and/or sound detection device having a sensing device having a sensitive surface, an access channel being designed in such a way that air and/or a gas is transferable through the open access channel between a spatial surroundings of the sensor/detection device and the sensitive surface, and an at least partially water-impermeable membrane having respectively an inner side of the membrane facing the associated access channel being designed in such a way that a contact surface on the respective inner side of the respective membrane is pressed against an associated membrane contact surface on the associated access channel in such a way that the associated access channel is sealed in a liquid-tight manner when an outer side of the respective membrane or a covering layer on the respective outer side of the membrane is wetted with at least a minimum quantity of liquid and the respective membrane is deformed.

Abstract: A method for the micro-structured application of a fluid or paste onto a surface, including providing a substrate having a surface, coating the surface with a non-stick layer, at least partially removing the non-stick layer and producing a coating area, and applying at least one fluid droplet or paste droplet onto the surface in the coating area.

Abstract: A System and method to provide a cost-effective implementation of a microphone package, very good microphone performance being achieved even with a high degree of miniaturization. A microphone package includes a MEMS microphone component having a microphone diaphragm, and a housing having a housing base and a housing cover, the housing enclosing the back-side volume of the microphone component, and an acoustic access channel to the microphone diaphragm being provided in the housing which is closed off with respect to the back-side volume and which connects at least one sound opening in the housing to one side of the microphone diaphragm. An interposer is mounted inside the housing which defines the acoustic access channel to the microphone diaphragm in that the interposer is coupled to the sound opening in the housing, and has at least one exit opening above which the microphone component together with the microphone diaphragm is mounted.

Abstract: A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.

Abstract: A micromechanical system having at least one micromechanical device, in particular a sensor device and/or an actuator device, the micromechanical system having a substrate on which at least one micromechanical device is provided, the micromechanical device having at least one structured or unstructured film adhesive on at least one side.

Abstract: A System and method to provide a cost-effective implementation of a microphone package, very good microphone performance being achieved even with a high degree of miniaturization. A microphone package includes a MEMS microphone component having a microphone diaphragm, and a housing having a housing base and a housing cover, the housing enclosing the back-side volume of the microphone component, and an acoustic access channel to the microphone diaphragm being provided in the housing which is closed off with respect to the back-side volume and which connects at least one sound opening in the housing to one side of the microphone diaphragm. An interposer is mounted inside the housing which defines the acoustic access channel to the microphone diaphragm in that the interposer is coupled to the sound opening in the housing, and has at least one exit opening above which the microphone component together with the microphone diaphragm is mounted.

Abstract: A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.

Abstract: A micromechanical system having at least one micromechanical device, in particular a sensor device and/or an actuator device, the micromechanical system having a substrate on which at least one micromechanical device is provided, the micromechanical device having at least one structured or unstructured film adhesive on at least one side.

Abstract: A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.

Abstract: A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.

Abstract: A method and a system for detecting the spatial movement state of moving objects, e.g., vehicles. Due to a, for example, non-cartesian arrangement of four rotational rate sensors and/or acceleration sensors, it is also possible to obtain a redundant signal in addition to the desired useful signal indicating the spatial movement state, e.g., the rotational movement and/or acceleration in space; if this redundant signal is large enough in comparison with the rotational rate actually applied, it may be used for detection of the size of the error and the defective sensor. The four sensors are mounted, for example, on a sensor platform forming a three-sided truncated pyramid so that all possible three-way combinations of sensors are mutually linearly independent. The accuracy about the vertical axis is defined by the angle of inclination of the side faces of the truncated pyramid.

Abstract: A device for measuring a force, for example a pressure in a predefined direction, wherein a substrate is provided with a main substrate plane, and the direction is parallel to the main substrate plane.