Abstract: Described herein are an antenna for a transponder, in particular a near field communication (NFC) or radio frequency identification (RFID) device transponder, a transponder comprising the antenna and a flat panel or poster comprising the transponder, and methods of manufacturing the antenna, the transponder and/or the flat panel or poster.

Abstract: Described herein is a label roll comprising a liner and a plurality of labels affixed to the liner, wherein each edge of a first label that neighbors another label in a release direction of the label roll comprises (i) at least one protuberance that engages with a recess in an edge of the other label or (ii) at least one recess that is engaged by a protuberance in an edge of the other label.

Abstract: Described are antenna assemblies and methods for forming antenna assemblies. An antenna assembly includes a dual polarized far-field antenna and a near-field loop antenna. The near-field loop antenna is electromagnetically coupled to the dual polarized far-field antenna. The near-field loop antenna includes two contacts for electrically connecting to a chip.

Abstract: Methods and apparatuses are described herein for providing continued operation of NFC-enabled mobile devices and NFC-enabled tags. The techniques described herein relate to methods and systems using a short-range frequency-enabled tag that can be applied to a short-range frequency-enabled mobile device, resulting in the reduction of interference between the internal short-range frequency circuitry of the mobile device and the short-range frequency receiver and transmitter circuitry of the tag—particularly when communicating with other short-range frequency devices. The techniques provide the advantage of enabling use of both the internal short-range frequency capabilities of the mobile device and the short-range frequency capabilities of the tag, leading to flexible and dynamic applications that leverage both sets of features, as well as access to a wider variety of current and future applications.

Abstract: An apparatus for screening the magnetic field of a transponder is described, which apparatus comprises, in a first area section, at least one flat antenna structure which comprises conductor tracks for conducting current in a direction of current flow and has an application-specific extent, wherein the apparatus comprises a second area section or carrier to which strips of a highly permeable screening material are applied such that they are oriented with respect to one another in a predetermined manner, wherein the second area section is arranged parallel to the first area section.

Abstract: An apparatus for screening the magnetic field of a transponder is described, which apparatus comprises, in a first area section, at least one flat antenna structure which comprises conductor tracks for conducting current in a direction of current flow and has an application-specific extent, wherein the apparatus comprises a second area section or carrier to which strips of a highly permeable screening material are applied such that they are oriented with respect to one another in a predetermined manner, wherein the second area section is arranged parallel to the first area section.

Abstract: Permanent physical and electrical attachment of electrically conductive contacts of a first component in a RFID device, such as a smart card or smart inlay, is made to the electrically conductive contacts of a second component of the device, for example, a conductive area, such as an antenna. Attachment is achieved by co-depositing metal and electrically conductive hard particles upon the conductive contacts of either the first or second components and then using a non-conductive adhesive to provide permanent bond between the components and their conductive contacts.

Abstract: An optical device module, for example, an LED array module or photosensor module, includes a plurality of optical devices electrically attached to contact lands on a substrate by a plurality of electrically conductive hard particles and mechanically attached by a non-electrically conductive bonding adhesive. The optical device module may further include a cover that is transparent to the light emitted or detected by the optical devices and that has electrically conductive contact pads on an inner surface thereof, which are bonded to bond pads on a face surface of the optical devices. A process for fabricating an optical device module includes electrically connecting the optical device to the electrical contact land on the substrate by attaching a plurality of electrically conductive hard particles to either the base surface of the optical device or to the electrical contact lands.

Abstract: The invention provides a method for permanently physically and electrically attaching the electrically conductive contacts of a first component in a RFID device, such as a smart card or smart inlay, to the electrically conductive contacts of a second component of the device. Attachment is made between the first and second components of the device by co-depositing metal and electrically conductive hard particles upon the conductive contacts of either the first or second components and using a non-conductive adhesive to provide permanent bond between the components and their conductive contacts. Components of an RFID device may include, for example, a memory chip, a microprocessor chip, a transceiver, or other discrete or integrated circuit device, a chip carrier, a chip module, and a conductive area, e.g., an antenna.