Patents by Inventor Michael Koken

Michael Koken has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7324344
    Abstract: A heatsink attachment assembly includes a first anchor, a second anchor and a heatsink clip. The first anchor is configured to insert into a first hole in a circuit board in an upward direction from an underside of the circuit board toward a topside of the circuit board. Similarly, the second anchor is configured to insert into a second hole in the circuit board in the upward direction. The heatsink clip has (i) a first end configured to fasten to the first anchor when the first anchor is inserted into the first hole in the circuit board, (ii) a second end configured to fasten to the second anchor when the second anchor is inserted into the second hole in the circuit board, and (iii) a middle section configured to provide force on a heatsink in a downward direction which is substantially opposite the upward direction.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: January 29, 2008
    Assignee: Cisco Technology, Inc.
    Inventors: George Sya, Hong Huynh, Michael Koken
  • Patent number: 7321493
    Abstract: An improved heatsink attachment assembly includes a first anchor configured to secure to a first location of the circuit board, and a second anchor configured to secure to a second location of the circuit board. Each anchor includes legs having looped end portions configured to contact the circuit board. The heatsink attachment assembly further includes a heatsink clip configured to concurrently (i) fasten to the anchors when the anchors secure to the circuit board, and (ii) hold a heatsink to against a circuit board component of the circuit board. The looped end portions of the legs prevent the legs from completely passing through holes defined in the circuit board. In some situations, the looped end portions define extended coils (e.g., double loops) for a robust interference fit with the circuit board as well as for enhanced strength and stability.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: January 22, 2008
    Assignee: Cisco Technology, Inc.
    Inventors: Hsing-Sheng Liang, George Sya, Hong Huynh, Michael Koken, Michael Chern, Yuan-Cheng Fang
  • Patent number: 7088586
    Abstract: A dimpled heat spreader includes a central portion configured to couple to the circuit board component, an outer portion coupled to the central portion, and dimpled portions disposed within the outer portion. The outer portion is configured to extend from the central portion and support the dimpled portions beyond a footprint of the circuit board component when the central portion couples to the circuit board component. The dimpled portions of such a heat spreader provides more exposed surface area (e.g., per square inch) than conventional heat spreaders with flat end portions for improved and enhanced heat dissipation via natural convection into the ambient air. Moreover, a heat spreader with such dimpled portions is relatively easy and cost effective to make vis-à-vis more complex structures such as fins or posts thus enabling a manufacturer to produce dimpled heat spreaders using a high volume, low cost assembly process.
    Type: Grant
    Filed: November 15, 2004
    Date of Patent: August 8, 2006
    Assignee: Cisco Technology, Inc.
    Inventors: Hong Huynh, Susheela Narasimhan, Michael Koken
  • Publication number: 20060114659
    Abstract: An improved heatsink attachment assembly includes a first anchor configured to secure to a first location of the circuit board, and a second anchor configured to secure to a second location of the circuit board. Each anchor includes legs having looped end portions configured to contact the circuit board. The heatsink attachment assembly further includes a heatsink clip configured to concurrently (i) fasten to the anchors when the anchors secure to the circuit board, and (ii) hold a heatsink to against a circuit board component of the circuit board. The looped end portions of the legs prevent the legs from completely passing through holes defined in the circuit board. In some situations, the looped end portions define extended coils (e.g., double loops) for a robust interference fit with the circuit board as well as for enhanced strength and stability.
    Type: Application
    Filed: March 14, 2005
    Publication date: June 1, 2006
    Applicant: Cisco Technology, Inc.
    Inventors: Hsing-Sheng Liang, George Sya, Hong Huynh, Michael Koken, Michael Chern, Yuan-Cheng Fang
  • Publication number: 20060114658
    Abstract: A heatsink attachment assembly includes a first anchor, a second anchor and a heatsink clip. The first anchor is configured to insert into a first hole in a circuit board in an upward direction from an underside of the circuit board toward a topside of the circuit board. Similarly, the second anchor is configured to insert into a second hole in the circuit board in the upward direction. The heatsink clip has (i) a first end configured to fasten to the first anchor when the first anchor is inserted into the first hole in the circuit board, (ii) a second end configured to fasten to the second anchor when the second anchor is inserted into the second hole in the circuit board, and (iii) a middle section configured to provide force on a heatsink in a downward direction which is substantially opposite the upward direction.
    Type: Application
    Filed: December 1, 2004
    Publication date: June 1, 2006
    Inventors: George Sya, Hong Huynh, Michael Koken
  • Publication number: 20060103013
    Abstract: A dimpled heat spreader includes a central portion configured to couple to the circuit board component, an outer portion coupled to the central portion, and dimpled portions disposed within the outer portion. The outer portion is configured to extend from the central portion and support the dimpled portions beyond a footprint of the circuit board component when the central portion couples to the circuit board component. The dimpled portions of such a heat spreader provides more exposed surface area (e.g., per square inch) than conventional heat spreaders with flat end portions for improved and enhanced heat dissipation via natural convection into the ambient air. Moreover, a heat spreader with such dimpled portions is relatively easy and cost effective to make vis-à-vis more complex structures such as fins or posts thus enabling a manufacturer to produce dimpled heat spreaders using a high volume, low cost assembly process.
    Type: Application
    Filed: November 15, 2004
    Publication date: May 18, 2006
    Inventors: Hong Huynh, Susheela Narasimhan, Michael Koken
  • Patent number: 5967825
    Abstract: An integral actuator mounts to a printed circuit board and effects connection of the printed circuit board to an external device, such as a motherboard, from a remote position outside of the printed circuit board. The actuator includes a platform affixed to the printed circuit board, a plunger (with a handle) slidably attached to the platform, and a cam slidably and rotatably attached to the plunger. When a customer pushes the plunger handle (which extends outside the bulkhead assembly of the printed circuit board) the plunger slides inward, causing the cam to rotate. This rotation of the cam pushes connector pins into the motherboard (for an electrical connection) and attaches the printed circuit board to the motherboard. The printed circuit board can also be unattached from the motherboard if the customer pulls the plunger handle, where the cam and the plunger move in a reversed manner. In a preferred embodiment, an actuator structure is provided that attaches to the back of the printed circuit board.
    Type: Grant
    Filed: August 15, 1997
    Date of Patent: October 19, 1999
    Assignee: Silicon Graphics, Inc.
    Inventors: David J. Lima, Mark J. Glusker, Michael A. Koken, Sung Kim, Bruno Lucien Andre Richet
  • Patent number: 5730605
    Abstract: A compression connector including a cam which securely attaches the compression connector to the backplate hook is disclosed. Specifically, in one embodiment, a backplate hook including pins located inside the receptacle is disclosed. The connector may be securely attached to the backplate hook by engaging the handle of the cam such that the cam and a second cam rotate so as to engage the pins. The movement of the cam handle compresses the connector against the surface to which the backplate hook is mounted, thus achieving a connection which is positive and which locks the connector into a position of uniform compression.
    Type: Grant
    Filed: September 12, 1996
    Date of Patent: March 24, 1998
    Assignee: Silicon Graphics, Inc.
    Inventors: Mark J. Glusker, David J. Lima, Michael A. Koken, Sung Kim, Bruno Lucien Andre Richet
  • Patent number: D444461
    Type: Grant
    Filed: August 8, 2000
    Date of Patent: July 3, 2001
    Assignee: Silicon Graphics, Inc.
    Inventors: Michael A. Koken, Stephen D. Smithson, Chris L. Whittall, Erik A. Jensen, Max G. Chen
  • Patent number: D444471
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: July 3, 2001
    Assignee: Silicon Graphics, Inc.
    Inventors: Michael A. Koken, Chris L. Whittall, Erik A. Jensen, Max G. Chen
  • Patent number: D444474
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: July 3, 2001
    Assignee: Silicon Graphics, Inc.
    Inventors: Michael A. Koken, Chris L. Whittall, Erik A. Jensen, Max G. Chen
  • Patent number: D445112
    Type: Grant
    Filed: August 8, 2000
    Date of Patent: July 17, 2001
    Assignee: Silicon Graphics, Inc.
    Inventors: Michael A. Koken, Stephen D. Smithson, Chris L. Whittall, Erik A. Jensen, Max G. Chen
  • Patent number: D445425
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: July 24, 2001
    Assignee: Silicon Graphics
    Inventors: Michael A. Koken, Chris L. Whittall, Erik A. Jensen, Max G. Chen