Patents by Inventor Michael Korwin-Pawlowski

Michael Korwin-Pawlowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mesa semiconductor structure
    Patent number: 5610434
    Abstract: Mesa diodes of improved mechanical properties are formed by providing a central depression in the regions of the chip from which the mesa is formed before the diffusion step that forms the rectifying junction in the mesa. In symmetric diodes, symmetric depressions are formed on both the top and bottom surfaces of the chip.
    Type: Grant
    Filed: November 7, 1995
    Date of Patent: March 11, 1997
    Assignee: General Instrument Corporation of Delaware
    Inventors: James J. Brogle, Harold P. Davis, Jean-Michel Guillot, Michael Korwin-Pawlowski
  • Brazed glass pre-passivated chip rectifier
    Patent number: 4987476
    Abstract: A semiconductor device is fabricated by applying a glass layer of material over a junction area of a semiconductor die. Aluminum metalization layers are applied to the top and bottom of the die at locations spaced from the glass and are used for a high temperature brazing of contact members to the die. Etching of the die, plus unavoidable etching of the contact members, is conducted without contamination of the junction area.
    Type: Grant
    Filed: February 14, 1990
    Date of Patent: January 22, 1991
    Assignee: General Instrument Corporation
    Inventor: Michael Korwin-Pawlowski
  • Method of fabricating a brazed glass pre-passivated chip rectifier
    Patent number: 4942139
    Abstract: A semiconductor device is fabricated by applying a glass layer of material over a junction area of a semiconductor die. Aluminum metalization layers are applied to the top and bottom of the die at locations spaced from the glass and are used for a high temperature brazing of contact members to the die. Etching of the die, plus unavoidable etching of the contact members, is conducted without contamination of the junction area.
    Type: Grant
    Filed: February 1, 1988
    Date of Patent: July 17, 1990
    Assignee: General Instrument Corporation
    Inventor: Michael Korwin-Pawlowski
  • Square body leadless electrical device
    Patent number: 4829406
    Abstract: An electrical device designed for leadless surface mounting on a PC board has molding compound which surrounds the electrical component and is so shaped as to have an outer surface which defines a flat, so that when the device is placed on the board it will remain in proper location and not roll away. An appropriately shaped mold is provided to accommodate the shape the molding compound simultaneously for a plurality of devices.
    Type: Grant
    Filed: March 4, 1988
    Date of Patent: May 9, 1989
    Assignee: General Instrument Corp.
    Inventor: Michael Korwin-Pawlowski