Abstract: A semiconductor substrate has a bond pad. The bond pad includes a layer of an aluminum alloy having a chemical composition including at least 0.3% by weight of at least one of Zn, Mg, Sc, Zr, Ti, Ag and/or Mn, with the balance being at least Al and incidental impurities.

Abstract: A semiconductor substrate has a bond pad. The bond pad includes a layer of an aluminum alloy having a chemical composition including at least 0.3% by weight of at least one of Zn, Mg, Sc, Zr, Ti, Ag and/or Mn, with the balance being at least Al and incidental impurities.

Abstract: A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the printed circuit board; heat sink assembly disposed in the housing assembly in close proximity to the processor; and, one or more compliant compression elements disposed within the housing assembly so as to be preloaded to provide a force on the printed circuit board to force the heat source into thermal engagement with the heat sink assembly. Methods and systems are disclosed for effectively dissipating heat reliably in compact packaging arrangements that are particularly adapted for computing systems including blade servers.

Abstract: A system and method for front service access to a component or subassembly in a computer system is disclosed. In a preferred embodiment of the present invention, a frame having a front face is provided, as well as a plate configured to move into and out of the front face of the frame. The plate includes a first portion and a second portion coupled to one another via a linking element. A component cage is mounted on the first portion of the plate. The first portion of the plate is moved out of the front face of the frame and is rotated downward via the linking element. In this position, the cage is readily accessible.

Abstract: A system and method for front service access to a component or subassembly in a computer system is disclosed. In a preferred embodiment of the present invention, a frame having a front face is provided, as well as a plate configured to move into and out of the front face of the frame. The plate includes a first portion and a second portion coupled to one another via a linking element. A component cage is mounted on the first portion of the plate. The first portion of the plate is moved out of the front face of the frame and is rotated downward via the linking element. In this position, the cage is readily accessible.