Abstract: A variable-size load port includes a port door defined to cover an effective aperture of the load port. A vertical positioning device is connected to the port door to provide for controlled vertical positioning and movement of the port door without substantial horizontal movement of the port door. A seal plate is disposed above the port door. The seal plate is defined to form a proximity seal with an upper surface of the port door when the port door is vertically positioned in proximity to the seal plate. The seal plate is defined to be adjustable in a vertical direction.

Abstract: The present invention comprises a container transport and loading system. The system generally comprises a load port for presenting articles to a tool and a container transport system. In one embodiment, the load port includes a vertically movable FOUP advance plate assembly that is adapted to load and unload a FOUP from a conveyor that passes by the load port and move the FOUP horizontally. In another embodiment, the load port includes a vertically movable support structure that is adapted to load and unload a container from a shuttle that passes by the load port. The various embodiments of the load port and container transport system are improvements over conventional container transport systems. The present invention also includes a shuttle for simultaneously transporting multiple containers that a load port may load or unload a container from.

Abstract: The present invention is a wafer engine for transporting wafers. The wafer engine includes a linear drive for moving the wafer along an x axis, a rotational drive for rotating the wafer about a theta axis, a linear drive for moving the wafer along a z axis, and a linear drive for moving the wafer along a radial axis. The linear drive for moving the wafer along a z axis is offset from the rotational drive. When the rotational drive rotates about the theta axis, both the z axis and radial axis drives are also rotated about the theta axis. Preferably, the linear drive for moving the wafer along a radial axis is a dual or rapid swap slide body mechanism having an upper and lower end effector. The slide body mechanism preferably also has means to align the wafer and perform various inspection and marking procedures.

Abstract: A variable lot size load port assembly includes a tool interface, an advance plate, and a seal plate. The tool interface extends generally in a vertical dimension and has a front surface, a back surface generally parallel to the front surface, and an aperture. An advance plate is positioned to the front of the tool interface below the aperture. The advance plate extends generally horizontally and is configured to support a front opening unified pod (FOUP). The advance plate translates between a retracted position and an advanced position. The advanced position is proximate the tool interface and the retracted position is spaced from the tool interface. The seal plate has an upper end secured to the tool interface and a lower end covering a portion of the aperture to form a reduced aperture. The seal plate is shaped to form a proximity seal with a front flange of a FOUP of a selected capacity mounted to the advance plate and brought to the advanced position.

Abstract: A variable lot size load port assembly is described having a tool interface, a port door, a latch key, an advance plate, and an elevator. The tool interface extends generally in a vertical dimension and has an aperture. The port door has a closed position wherein the port door at least partially occludes the aperture. The latch key extends from the port door and is configured to mate with a latch key receptacle of a door of a front opening unified pod (FOUP). The advance plate is configured to support a front opening unified pod (FOUP) and translate between a retracted position and an advanced position. The elevator raises and lowers the advance plate to bring the latch key receptacle of the door of the FOUP into alignment with the latch key of the port door.

Abstract: Systems for loading and unloading semiconductor wafers to and from semiconductor processing or storage equipment are disclosed. One system includes a pair of conveyor rails for transporting a container capable of holding semiconductor wafers around a processing facility. The pair of conveyor rails defining a plane on which the container is supported and transported. The system includes a load port positioned adjacent to the conveyor rails. The load port has a support plate for holding a container and an arm coupled to the support plate. The arm is configured to move between a lower position and an upper position, and the lower position is defined between the pair of conveyor rails and below the plane of the conveyor rails. The upper position is in a load/unload position, and the arm has a bend that enables the support plate to be placed over one of the pair of conveyor rails without requiring a notch in the one conveyor rail.

Abstract: A container for supporting substrates for processing is provided. The container includes a base, a top, and side panels connecting the base and the top. A support structure is disposed in the container. The support structure is configured to support the substrates within the container. The support structure has rows of multiple tensile members extending across a width of the container. Each row of the multiple tensile members is configured to support a substrate, wherein one of the side panels includes a moveable flexible membrane enabling access into the container. A support structure for the flexible membrane includes a synchronization mechanism for synchronizing movement of the flexible membrane with a door of a receiving module of a processing tool or a door of the processing tool.

Abstract: The present invention comprises a conveyor for moving a semiconductor containers throughout a fabrication facility. In one embodiment, the conveyor comprises a plurality of individually controlled conveyor zones. Each conveyor zone includes a first belt, a second belt, a drive assembly for rotating the first belt and the second belt at substantially the same speed. The first belt and the second belt are driven at substantially the same speed and movably support the container's bottom plate as the container moves along the conveyor. In another embodiment, the conveyor includes sensors to determine, among other things, the position of the container.

Abstract: A semiconductor substrate is provided. The substrate includes a first surface and an opposing second surface, wherein the first surface includes a marking in a centroid region of the first surface. The marking indicates a location of a center point on the first surface of the semiconductor substrate or identification data unique to the substrate. A system, methods of transporting and marking, and a device for reading the substrate markings are also provided.

Abstract: The present invention comprises a load port for providing access to an article that is stored in a container having a container door removably coupled to a container shell. The load port preferably loads/unloads a container directly from a container transport system. In one embodiment, the load port includes a plate having an opening, a container support plate, a drive assembly for moving the support plate vertically and a shroud to partially enclose the opening. The shroud, which may be affixed to the mounting plate, has an open top and bottom. The shroud contains a mechanism for retaining the container shell at a controllable height. During operation, a container is raised from the transport system into the shroud until the container shell is retained by the mechanism. After the container shell is uncoupled from the container door, the container support plate is lowered until the article is accessible through the opening. The container shell remains located at the controllable height.

Abstract: The present invention comprises a container transport and loading system. The system generally comprises a load port for presenting articles to a tool and a container transport system. In one embodiment, the load port includes a vertically movable FOUP advance plate assembly that is adapted to load and unload a FOUP from a conveyor that passes by the load port and move the FOUP horizontally. In another embodiment, the load port includes a vertically movable support structure that is adapted to load and unload a container from a shuttle that passes by the load port. The various embodiments of the load port and container transport system are improvements over conventional container transport systems. The present invention also includes a shuttle for simultaneously transporting multiple containers that a load port may load or unload a container from.

Abstract: The present invention comprises a container transport and loading system. The system generally comprises a load port for presenting articles to a tool and a container transport system. In one embodiment, the load port includes a vertically movable FOUP advance plate assembly that is adapted to load and unload a FOUP from a conveyor that passes by the load port and move the FOUP horizontally. In another embodiment, the load port includes a vertically movable support structure that is adapted to load and unload a container from a shuttle that passes by the load port. The various embodiments of the load port and container transport system are improvements over conventional container transport systems. The present invention also includes a shuttle for simultaneously transporting multiple containers that a load port may load or unload a container from.

Abstract: The present invention is a wafer transfer system that transports individual wafers between chambers within an isolated environment. In one embodiment, a wafer is transported by a wafer shuttle that travel within a transport enclosure. The interior of the transport enclosure is isolated from the atmospheric conditions of the surrounding wafer fabrication facility. Thus, an individual wafer may be transported throughout the wafer fabrication facility without having to maintain a clean room environment for the entire facility. The wafer shuttle may be propelled by various technologies, such as, but not limited to, magnetic levitation or air bearings. The wafer shuttle may also transport more than one wafer simultaneously. The interior of the transport enclosure may also be under vacuum, gas-filled, or subject to filtered air.

Abstract: A variable lot size load port assembly includes a tool interface, an advance plate, and a seal plate. The tool interface extends generally in a vertical dimension and has a front surface, a back surface generally parallel to the front surface, and an aperture. An advance plate is positioned to the front of the tool interface below the aperture. The advance plate extends generally horizontally and is configured to support a front opening unified pod (FOUP). The advance plate translates between a retracted position and an advanced position. The advanced position is proximate the tool interface and the retracted position is spaced from the tool interface. The seal plate has an upper end secured to the tool interface and a lower end covering a portion of the aperture to form a reduced aperture. The seal plate is shaped to form a proximity seal with a front flange of a FOUP of a selected capacity mounted to the advance plate and brought to the advanced position.

Abstract: A variable lot size load port assembly includes a tool interface, a port door, an advance plate, and first and second latch keys. The tool interface extends generally in a vertical dimension and has an aperture. The port door has a closed position wherein the port door at least partially occludes the aperture. The advance plate is configured to support a front opening unified pod (FOUP) and translate between a retracted position and an advanced position. The first latch key is disposed on the port door at a first elevation configured to selectively engage a corresponding latch key receptacle of a FOUP having a first selected FOUP capacity and the second latch key is disposed on the port door at a second elevation configured to selectively engage a corresponding latch key receptacle of another FOUP having a second selected FOUP capacity.

Abstract: A substrate support and transport system for substrates to be processed is provided. The system includes a container supporting a plurality of substrates in a substantially vertical orientation, where the container has an access door surrounded by a flange defined on a top surface. The system includes a conveying system supporting a bottom surface of the container opposing the top surface. The conveying system is configured to enable removal of the container from the conveying system to a processing tool while the plurality of substrates is in the substantially vertical orientation. The system further includes a receiving module for a processing tool configured to accept the container from the conveying system. The receiving module is configured to move the container in a two dimensional plane defined within the receiving module. A container holding the substrates in a substantially vertical orientation and a method for transporting and storing substrates is provided.

Abstract: A variable lot size load port assembly is described having a tool interface, a port door, a latch key, an advance plate, and an elevator. The tool interface extends generally in a vertical dimension and has an aperture. The port door has a closed position wherein the port door at least partially occludes the aperture. The latch key extends from the port door and is configured to mate with a latch key receptacle of a door of a front opening unified pod (FOUP). The advance plate is configured to support a front opening unified pod (FOUP) and translate between a retracted position and an advanced position. The elevator raises and lowers the advance plate to bring the latch key receptacle of the door of the FOUP into alignment with the latch key of the port door.

Abstract: The present invention is a wafer transfer system that transports individual wafers between chambers within an isolated environment. In one embodiment, a wafer is transported by a wafer shuttle that travel within a transport enclosure. The interior of the transport enclosure is isolated from the atmospheric conditions of the surrounding wafer fabrication facility. Thus, an individual wafer may be transported throughout the wafer fabrication facility without having to maintain a clean room environment for the entire facility. The wafer shuttle may be propelled by various technologies, such as, but not limited to, magnetic levitation or air bearings. The wafer shuttle may also transport more than one wafer simultaneously. The interior of the transport enclosure may also be under vacuum, gas-filled, or subject to filtered air.

Abstract: The present invention generally comprises an apparatus for transporting containers between a first transport system and a second transport system. In one embodiment, the first transport system comprises a ceiling-based conveyor and the second transport system comprises a floor-based conveyor. The present invention may further include storage shelves, preferably substantially horizontally aligned about a common vertical plane with a section of one of the transport systems. The transport system may be located either directly above the uppermost storage shelf or beneath the lowermost storage shelf in order to add storage capacity within the fab. A vertical module transports containers between the transport systems and the at least one storage shelf.

Abstract: The semiconductor material handling system is an EFEM that may either mount to the front end of a processing tool or be integrated into the processing tool. The EFEM is built from a unified frame that the EFEM components, such as a wafer engine and a SMIF pod advance plate, may mount to. The frame serves as a common mounting structure that the EFEM components may use as a reference for alignment purposes. Since the EFEM components do not have to align with respect to the position of each other, the calibration, if any is required, is greatly simplified. The EFEM also has a reduced footprint, allowing the EFEM to mount to the front end of a processing tool and not extend to the fab floor. Thus, space is freed up between the EFEM and the fab floor. By way of example only, this space may be used as a maintenance access area to the processing tool without having to first remove the EFEM.