Abstract: A method for forming a semiconductor device is provided. The method includes the following steps. A substrate having a first contact is provided. A layered structure is formed on the substrate. A recess is formed into the layered structure to expose at least a portion of the first contact. A glue layer is formed on the layered structure and the at least a portion of the first contact. The glue layer is removed from the at least a portion of the first contact. A second contact is formed contacting the first contact and the glue layer.

Abstract: A control network has a bus to which is connected a master node and a plurality of slave nodes in a loop configuration. Each of the master node and slave nodes has a transceiver connected to the bus through a shunt circuit. The shunt circuit comprises a switch (such as a relay) in parallel circuit configuration with an impedance element (such as resistor). The switch is operated under control of the node and under normal conditions remains closed, thereby allowing signals to be carried freely over the bus. When a fault occurs, each of the nodes opens its switch, causing the separate portions of the bus to become isolated. The master node then instructs each slave node, starting with the closest slave node, to close its switch. When a slave node fails to respond, the fault location has been detected. The master node repeats the process for the opposite direction of the loop. Operation then continues, with the slave node nearest the fault remaining isolated.