Patents by Inventor Michael Kuchar
Michael Kuchar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230151497Abstract: A method includes machining a raw surface of a metal component to remove first native oxide from a metal base of the metal component to generate an as-machined surface of the metal component. A second native oxide is formed on the metal base of the as-machined surface of the metal component subsequent to the machining. The method further includes, subsequent to the machining, performing operations to generate a finished surface of the metal component. The operations include a surface machining of the as-machined surface of the metal component to remove the second native oxide.Type: ApplicationFiled: January 13, 2023Publication date: May 18, 2023Inventors: Yuanhong Guo, Sheng Michael Guo, Marek W. Radko, Steven Victor Sansoni, Nagendra Madiwal, Matvey Farber, Pingping Gou, Song-Moon Suh, Jeffrey C. Hudgens, Yuji Murayama, Anurag Bansal, Shaofeng Chen, Michael Kuchar
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Patent number: 11555250Abstract: A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.Type: GrantFiled: April 27, 2021Date of Patent: January 17, 2023Assignee: Applied Materials, Inc.Inventors: Yuanhong Guo, Sheng Michael Guo, Marek W Radko, Steven Victor Sansoni, Nagendra Madiwal, Matvey Farber, Pingping Gou, Song-Moon Suh, Jeffrey C. Hudgens, Yuji Murayama, Anurag Bansal, Shaofeng Chen, Michael Kuchar
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Patent number: 11328943Abstract: Disclosed is a wafer processing system, a dual gate system, and methods for operating these systems. The dual gate system may have a first gate, a second gate, a gate connector coupled to the first gate and to the second gate, and actuator coupled to the gate connector. The actuator is configured to seal the first gate against a first slot or open the first slot via vertical motion. The actuator is also configured to seal the second gate against a second slot or open the second slot via a combination of vertical motion and horizontal motion.Type: GrantFiled: April 3, 2020Date of Patent: May 10, 2022Assignee: Applied Materials, Inc.Inventors: Kumaresan Kuppannan, Ofer Amir, Michael Kuchar
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Publication number: 20210339354Abstract: A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.Type: ApplicationFiled: April 27, 2021Publication date: November 4, 2021Inventors: Yuanhong Guo, Sheng Michael Guo, Marek W. Radko, Steven Victor Sansoni, Nagendra Madiwal, Matvey Farber, Pingping Gou, Song-Moon Suh, Jeffrey C. Hudgens, Yuji Murayama, Anurag Bansal, Shaofeng Chen, Michael Kuchar
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Publication number: 20210313204Abstract: Disclosed is a wafer processing system, a dual gate system, and methods for operating these systems. The dual gate system may have a first gate, a second gate, a gate connector coupled to the first gate and to the second gate, and actuator coupled to the gate connector. The actuator is configured to seal the first gate against a first slot or open the first slot via vertical motion. The actuator is also configured to seal the second gate against a second slot or open the second slot via a combination of vertical motion and horizontal motion.Type: ApplicationFiled: April 3, 2020Publication date: October 7, 2021Inventors: Kumaresan Kuppannan, Ofer Amir, Michael Kuchar
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Patent number: 11087998Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.Type: GrantFiled: March 20, 2019Date of Patent: August 10, 2021Assignee: Applied Materials, Inc.Inventors: Michael Robert Rice, Michael Meyers, John J. Mazzocco, Dean C. Hruzek, Michael Kuchar, Sushant S. Koshti, Penchala N. Kankanala, Eric A. Englhardt
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Publication number: 20210143034Abstract: A substrate processing system includes a factory interface, a transfer chamber, and a robot. The transfer chamber includes four first facets adapted for attachment to one or more first processing chambers and three second facets, wherein each of the three second facets has a width that is narrower than that of each of the four first facets. The system includes a second processing chamber having a first interface attached to a first of the three second facets and a load lock attached to a second of the three second facets and to the factory interface. The system also includes a robot attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the one or more first processing chambers, the second processing chamber, and the load lock.Type: ApplicationFiled: January 22, 2021Publication date: May 13, 2021Inventors: Michael Robert Rice, Michael Meyers, John J. Mazzocco, Dean C. Hruzek, Michael Kuchar, Sushant S. Koshti, Penchala N. Kankanala, Eric A. Englhardt
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Patent number: 10971381Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.Type: GrantFiled: November 3, 2014Date of Patent: April 6, 2021Assignee: Applied Materials, Inc.Inventors: Michael Robert Rice, Michael Meyers, John J. Mazzocco, Dean C. Hruzek, Michael Kuchar, Sushant S. Koshti, Penchala N. Kankanala, Eric A. Englhardt
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Patent number: 10381247Abstract: An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.Type: GrantFiled: August 16, 2016Date of Patent: August 13, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Nagendra V. Madiwal, Robert Irwin Decottignies, Andrew Nguyen, Paul B. Reuter, Angela R. Sico, Michael Kuchar, Travis Morey, Mitchell DiSanto
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Publication number: 20190214284Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.Type: ApplicationFiled: March 20, 2019Publication date: July 11, 2019Inventors: Michael Robert Rice, Michael Meyers, John J. Mazzocco, Dean C. Hruzek, Michael Kuchar, Sushant S. Koshti, Penchala N. Kankanala, Eric A. Englhardt
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Patent number: 10159169Abstract: An equipment front end module interface of an equipment front end module including environmental controls. The equipment front end module interface includes a first mounting member configured to couple to a load lock assembly, and a flexible seal coupled to the first mounting member. The flexible seal provides sealing between the equipment front end module and the load lock assembly and also accommodates axial and other misalignment between the load lock assembly and the equipment front end module during assembly. Equipment front end modules including the equipment front end module interface and methods of assembling a load lock assembly to the equipment front end module using the equipment front end module interface are provided, as are other aspects.Type: GrantFiled: October 27, 2016Date of Patent: December 18, 2018Assignee: Applied Materials, Inc.Inventors: Joseph Vincent, Michael Kuchar, Dean C. Hruzek, Vijayabaskar Soundarrajan, Pandu Maddherla, Adam J. Wyatt, Robert M. McAndrew
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Publication number: 20180124960Abstract: An equipment front end module interface of an equipment front end module including environmental controls. The equipment front end module interface includes a first mounting member configured to couple to a load lock assembly, and a flexible seal coupled to the first mounting member. The flexible seal provides sealing between the equipment front end module and the load lock assembly and also accommodates axial and other misalignment between the load lock assembly and the equipment front end module during assembly. Equipment front end modules including the equipment front end module interface and methods of assembling a load lock assembly to the equipment front end module using the equipment front end module interface are provided, as are other aspects.Type: ApplicationFiled: October 27, 2016Publication date: May 3, 2018Inventors: Joseph Vincent, Michael Kuchar, Dean C. Hruzek, Vijayabaskar Soundarrajan, Pandu Maddherla, Adam J. Wyatt, Robert M. McAndrew
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Publication number: 20160358792Abstract: An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.Type: ApplicationFiled: August 16, 2016Publication date: December 8, 2016Inventors: Nagendra V. Madiwal, Robert Irwin Decottignies, Andrew Nguyen, Paul B. Reuter, Angela R. Sico, Michael Kuchar, Travis Morey, Mitchell DiSanto
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Patent number: 9435025Abstract: An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.Type: GrantFiled: September 25, 2013Date of Patent: September 6, 2016Assignee: Applied Materials, Inc.Inventors: Nagendra V. Madiwal, Robert Irwin Decottignies, Andrew Nguyen, Paul B. Reuter, Angela R. Sico, Michael Kuchar, Travis Morey, Mitchell Disanto
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Publication number: 20160225646Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.Type: ApplicationFiled: November 3, 2014Publication date: August 4, 2016Inventors: Michael Robert RICE, Michael MEYERS, John J. MAZZOCCO, Dean C. HRUZEK, Michael KUCHAR, Sushant S. KOSHTI, Penchala N. KANKANALA, Eric A. ENGLHARDT
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Patent number: 9091491Abstract: A cooling plate includes a channel to transmit a fluid, wherein the channel is disposed within a base and the channel has a first portion and a second portion. The first portion is disposed substantially along a peripheral edge of the base, and the second portion is coupled to the first portion and is disposed further away from the peripheral edge of the base than the first portion. The second portion has a length that is at least about 35% as long as the length of the first portion. The cooling plate also includes a lid disposed over the base and the channel, wherein the lid provides support for a substrate.Type: GrantFiled: October 6, 2008Date of Patent: July 28, 2015Assignee: Applied Materials, Inc.Inventors: Helder Lee, Miriam Schwartz, Michael Kuchar, Aaron Webb, Theodoss Costuros
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Publication number: 20150098773Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.Type: ApplicationFiled: December 15, 2014Publication date: April 9, 2015Applicant: APPLIED MATERIALS, INC.Inventors: Mike RICE, Jeffrey HUDGENS, Charles CARLSON, William Tyler WEAVER, Robert LOWRANCE, Eric ENGLHARDT, Dean C. HRUZEK, Dave SILVETTI, Michael KUCHAR, Kirk VAN KATWYK, Van HOSKINS, Vinay SHAH
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Publication number: 20150083330Abstract: An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.Type: ApplicationFiled: September 25, 2013Publication date: March 26, 2015Inventors: Nagendra V. Madiwal, Robert Irwin Decottignies, Andrew Nguyen, Paul B. Reuter, Angela R. Sico, Michael Kuchar, Travis Morey, Mitchell Disanto
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Patent number: 8911193Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.Type: GrantFiled: November 28, 2011Date of Patent: December 16, 2014Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Publication number: 20120141237Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.Type: ApplicationFiled: November 28, 2011Publication date: June 7, 2012Inventors: Mike RICE, Jeffrey HUDGENS, Charles CARLSON, William Tyler WEAVER, Robert LOWRANCE, Eric ENGLHARDT, Dean C. HRUZEK, Dave SILVETTI, Michael KUCHAR, Kirk Van KATWYK, Van HOSKINS, Vinay SHAH