Abstract: Documenting logbook data by one or more first field device, wherein each of the first field devices has a first resource power, wherein a second field device is provided with a second resource power is provided. The second resource power is greater than the first resource powers, wherein each of the first field devices continuously generates corresponding logbook data that contains security-relevant data and/or data relating to the operation of the corresponding first field device, said method comprising: establishing a secure communication link between one or more of the first field devices and the second field device; transmitting the current logbook data from the first field device or each of the first field devices at predetermined times via the communication link; accumulating the current logbook data by the second field device and storing the accumulated logbook data in a memory unit of the second field device, and a corresponding system.

Abstract: A first plant part includes a multitude of field devices and an edge device, which is part of a communication network. The edge device monitors data transmitted by the field devices and a higher-level unit or requests further data. The edge device generates a live list, which contains an identifier of each field device or the higher-level unit and the requested or monitored data. The edge device simulates a multitude of virtual field devices, generates data, and enters identifiers of the virtual field devices and the generated data into the live list. The live list is made available via a first interface. The edge device transmits the live list containing the current requested or monitored data to a cloud-based service platform at regular intervals, and the cloud-based service platform is designed to prepare or present the live list, with the data of the virtual field devices being disregarded.

Abstract: Disclosed is a method for checking the setting of predefined security functions of a field device of process and automation technology, wherein the predefined security functions relate to an access to a function of the field device by an unauthorized person. The method includes: identifying a user; starting by the user a query about the actual setting of the security functions predefined at the measuring point; comparing actual setting of the predefined security functions with a target setting of the predefined security functions defined by the stipulated security level; and outputting an electronic report about the matching or deviation of the actual setting from the target setting of the predefined security functions. Depending on the matching or deviation of the actual setting from the target setting of the predefined security functions, different steps are carried out.

Abstract: A self-testing automation system includes a decentralized distributed ledger-type database comprising a plurality of subscriber nodes, wherein the subscriber nodes exchange data with one another per transaction, and the database stores the transactions in data blocks which are linked together; a regulating mechanism which is implemented into each of the subscriber nodes, said regulating mechanism comprising information on the number and identity of all of the subscriber nodes as well as rules relating to actions, properties, and states of each of the subscriber nodes; and a plurality of automation components which are subscriber nodes of the decentralized database. Each of the subscriber nodes is designed to test or validate transactions between the subscriber nodes at all times using the regulating mechanism, and each of the subscriber nodes is designed to carry out at least one measure if a violation of the regulating mechanism is detected.

Abstract: Disclosed is a method for checking the setting of predefined security functions of a field device of process and automation technology, wherein the predefined security functions relate to an access to a function of the field device by an unauthorized person. The method includes: identifying a user; starting by the user a query about the actual setting of the security functions predefined at the measuring point; comparing actual setting of the predefined security functions with a target setting of the predefined security functions defined by the stipulated security level; and outputting an electronic report about the matching or deviation of the actual setting from the target setting of the predefined security functions. Depending on the matching or deviation of the actual setting from the target setting of the predefined security functions, different steps are carried out.

Abstract: In a method for machining a workpiece, a laser beam (5) is guided across the workpiece surface by means of a beam guide (2, 51), wherein the laser beam guide comprises a first guide (2) effecting a laser beam guide at a first path speed. The laser beam guide comprises a second guide (51) simultaneously operating with the first guide, which effects a laser beam guide at a second path speed, which is higher than the first path speed.

Abstract: The invention relates to a method for producing a swaging in a workpiece, wherein a laser beam is guided through a beam guide over the surface of the workpiece in order to produce said swaging. The focal position of the laser beam is controlled in such a way that it can be varied at least temporarily in depth direction of the swaging. A device for the production of a swaging (6) in a workpiece (5) has a laser light source (1) for producing a laser beam for removing material, a focus adjustment device (3) for adjusting the focal position of the laser beam, a beam guide (4) for guiding the laser beam (20) over the surface of the workpiece and a control device (7) for controlling the focus adjustment device (3) and the beam guide (4). The control device is designed to control the focal position of the laser beam by means of the focus adjustment device (3) at least temporarily to variable values in depth direction of the swaging.

Abstract: The invention relates to a method for machining a workpiece by means of a laser beam, wherein a laser beam is guided by a beam guiding device over the surface of the workpiece within a working window. The beam guiding device and the workpiece are arranged in such a way that they are movable relative to one another in a direction of displacement along a displacement section and that they can occupy a first and a second relative working position to one another. According to the invention, a point on the workpiece can be machined from the second relative working position, said point being located behind the point which is machined from the first relative working position when viewed in the direction of displacement.

Abstract: Disclosed is a laser machining apparatus comprising a workpiece fixture for fastening a workpiece, a first laser removing device for machining a workpiece using first operating parameters, and a second laser removing device which can machine a workpiece using second operating parameters that are different from the first operating parameters, especially regarding the quality and quantity.

Abstract: During the production of a swage in a workpiece in which material is removed in layers by means of a laser beam the side walls of the swage are processed by means of a laser beam and/or a processing means and/or ultrasonic waves.

Abstract: According to a method for a depth measurement the depths of measuring points on a calibration surface are measured and correction values depending on differences between the measured values and known values are used and stored for a later correction. According to a method for the layer-wise production of a hollow the horizontal boundaries (xg, yg) for the removal of a layer (Si+1) depending on the hollow depth (z) were determined from the shape definition of the hollow. The measured values can be continuously stored and used for a later control of the laser processing device.

Abstract: In a method for machining a workpiece, a laser beam (5) is guided across the workpiece surface by means of a beam guide (2, 51), wherein the laser beam guide comprises a first guide (2) effecting a laser beam guide at a first path speed. The laser beam guide comprises a second guide (51) simultaneously operating with the first guide, which effects a laser beam guide at a second path speed, which is higher than the first path speed.

Abstract: The invention relates to a method for machining a workpiece by means of a laser beam, wherein a laser beam is guided by a beam guiding device over the surface of the workpiece within a working window. The beam guiding device and the workpiece are arranged in such a way that they are movable relative to one another in a direction of displacement along a displacement section and that they can occupy a first and a second relative working position to one another. According to the invention, a point on the workpiece can be machined from the second relative working position, said point being located behind the point which is machined from the first relative working position when viewed in the direction of displacement.

Abstract: Disclosed is a laser machining apparatus comprising a workpiece fixture (10) for fastening a workpiece (1), a first laser removing device (11) for machining a workpiece using first operating parameters, and a second laser removing device (12) which can machine a workpiece using second operating parameters that are different from the first operating parameters, especially regarding the quality and quantity.

Abstract: The invention relates to a method for producing a swaging in a workpiece, wherein a laser beam is guided through a beam guide over the surface of the workpiece in order to produce said swaging. The focal position of the laser beam is controlled in such a way that it can be varied at least temporarily in depth direction of the swaging. A device for the production of a swaging (6) in a workpiece (5) has a laser light source (1) for producing a laser beam for removing material, a focus adjustment device (3) for adjusting the focal position of the laser beam, a beam guide (4) for guiding the laser beam (20) over the surface of the workpiece and a control device (7) for controlling the focus adjustment device (3) and the beam guide (4). The control device is designed to control the focal position of the laser beam by means of the focus adjustment device (3) at least temporarily to variable values in depth direction of the swaging.

Abstract: During the production of a swage in a workpiece in which material is removed in layers by means of a laser beam the side walls of the swage are processed by means of a laser beam and/or a processing means and/or ultrasonic waves.

Abstract: According to a method for a depth measurement the depths of measuring points on a calibration surface are measured and correction values depending on differences between the measured values and known values are used and stored for a later correction. According to a method for the layer-wise production of a hollow the horizontal boundaries (xg, yg) for the removal of a layer (Si+1) depending on the hollow depth (z) were determined from the shape definition of the hollow. The measured values can be continuously stored and used for a later control of the laser processing device.

Abstract: According to a method for a depth measurement the depths of measuring points on a calibration surface are measured and correction values depending on differences between the measured values and known values are used and stored for a later correction. According to a method for the layer-wise production of a hollow the horizontal boundaries (xg, yg) for the removal of a layer (Si+1) depending on the hollow depth (z) were determined from the shape definition of the hollow. The measured values can be continuously stored and used for a later control of the laser processing device.

Abstract: A method of removing substance from the surface of a workpiece in which the removal of substance is effected layer-wise by irradiating a working site on the workpiece surface with a laser beam from a working head, the layer-wise removal of substance being carried out with the aid of a laser guidance guiding the laser across the surface of the workpiece within a working area predetermined by the apparatus, comprises positioning steps in which, after the start of the substance removal, the relative position of the workpiece and the working head are changed in accordance with a first and/or second criterion and adjusted so that a boundary of the working area comes to be disposed on different sections of the workpiece surface for identical working sites.

Abstract: The invention relates to a method of producing an aperture in a metallic component, in which the aperture comprises, at least in certain portions, a non-cylindrically formed funnel, extends from a first surface to a second surface of a component wall and is formed by a laser beam. The invention improves the dimensional accuracy and reduces the roughness of the surface of the aperture and/or funnel in that, by appropriate choice of the laser parameters, the metal is predominantly removed by sublimation during the formation of the funnel and the funnel is formed by laser removal of layers of a substantially constant thickness.