Patents by Inventor Michael L. Bixenman
Michael L. Bixenman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230236240Abstract: A system for testing an electronic circuit board test coupon, including a test chamber. The test chamber can have at least one port through which a port extension member holding a test coupon can be inserted, minimizing air flow between the interior space of the test chamber and the surrounding area to adequately maintain elevated heat and humidity conditions within the test chamber.Type: ApplicationFiled: January 23, 2023Publication date: July 27, 2023Inventors: Michael L. Bixenman, Thomas M. Forsythe, Mark McMeen, Colin Langley, James Perigen, Bobby Glidwell
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Patent number: 11073548Abstract: Disclosed is a system and method for monitoring a characteristic of an environment of an electronic device. The electronic device may include a printed circuit board and a component. A sensor is placed on the printed circuit board, and may be between the component and the board, and connects to a monitor, or detector. An end user device may be used to store, assess, display and understand the data received from the sensor through the monitor.Type: GrantFiled: May 4, 2020Date of Patent: July 27, 2021Assignee: MAGNALYTIX, LLCInventors: Mark Taylor McMeen, Jason Edward Tynes, Michael L. Bixenman, David T. Lober
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Publication number: 20200264226Abstract: Disclosed is a system and method for monitoring a characteristic of an environment of an electronic device. The electronic device may include a printed circuit board and a component. A sensor is placed on the printed circuit board, and may be between the component and the board, and connects to a monitor, or detector. An end user device may be used to store, assess, display and understand the data received from the sensor through the monitor.Type: ApplicationFiled: May 4, 2020Publication date: August 20, 2020Applicant: Kyzen CorporationInventors: Mark Taylor McMeen, Jason Edward Tynes, Michael L. Bixenman, David T. Lober
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Patent number: 10677837Abstract: Disclosed is a system and method for monitoring a characteristic of an environment of an electronic device. The electronic device may include a printed circuit board and a component. A sensor is placed on the printed circuit board, and may be between the component and the board, and connects to a monitor, or detector. An end user device may be used to store, assess, display and understand the data received from the sensor through the monitor.Type: GrantFiled: June 1, 2016Date of Patent: June 9, 2020Assignee: Kyzen CorporationInventors: Mark Taylor McMeen, Jason Edward Tynes, Michael L. Bixenman, David T. Lober
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Publication number: 20190136159Abstract: A composition effective for removing contaminates from an electronic device either as a concentrated material or when diluted with water. The composition designed for effective removal of undesirable contaminates from an electronic device, including but not limited to, solder flux and polymeric residues. The composition contains butylpyrrolidone and an alkali and has a pH of greater than 7.1 and a pKa less than 12. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.Type: ApplicationFiled: September 14, 2018Publication date: May 9, 2019Applicant: Kyzen CorporationInventors: Kyle J Doyel, Michael L Bixenman, Kevin Soucy, Haley Jones
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Publication number: 20180298310Abstract: A composition effective for removing solder fluxes either as a concentrated material or when diluted with water. The composition is effective in removing all types of solder fluxes including rosin type, resin type, no-clean, low residue, lead-free, organic acid and water soluble soldering fluxes. The composition comprises isopropylidene glycerol and an alkali and has a pH of greater than 7.5. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.Type: ApplicationFiled: November 13, 2015Publication date: October 18, 2018Applicant: Kyzen CorporationInventors: Kyle J. Doyel, Michael L. Bixenman, David T. Lober, Kevin Soucy
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Publication number: 20170350936Abstract: Disclosed is a system and method for monitoring a characteristic of an environment of an electronic device. The electronic device may include a printed circuit board and a component. A sensor is placed on the printed circuit board, and may be between the component and the board, and connects to a monitor, or detector. An end user device may be used to store, assess, display and understand the data received from the sensor through the monitor.Type: ApplicationFiled: June 1, 2016Publication date: December 7, 2017Applicant: Kyzen CorporationInventors: Mark Taylor McMeen, Jason Edward Tynes, Michael L. Bixenman, David T. Lober
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Publication number: 20160047741Abstract: A method of accurately measuring the concentration of at least one of an aqueous cleaning agent and soil in an aqueous cleaning process which includes providing a source of near infrared light emitting useful amounts of light with wavelengths between approximately 0.8 ?m and 2.5 ?m, transmitting the near infrared light from the light source to a probe, contacting the probe with a cleaning bath sample such that one of the absorption and the reflection of the light at one or more wavelengths can be measured, transmitting the light that has interacted with the sample to a detector, measuring the change in light intensity at one or more wavelengths in the near infrared region using a near infrared detector, generating an electronic signal that is representative of the change in intensity, applying chemometric techniques to quantitatively determine the concentration of the cleaning agent and or soil, and outputting the measured cleaning agent or soil concentration.Type: ApplicationFiled: September 30, 2014Publication date: February 18, 2016Inventors: David T. Lober, Haley Nicole Jones, Jonathon Afugu, Kyle J. Doyel, Ram Wissel, Michael L. Bixenman
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Publication number: 20160008855Abstract: A method for cleaning a precision component which includes the steps of immersing the component in a heated solvating agent disposed in a pre-clean module tank to thereby remove an adherent contaminant; treating the component with a rinsing solvent to remove any remaining contaminants and residual solvating agent in a separate rinse degreaser whereby contaminants removed from the component collect in the rinse degreaser; and removing contaminated solvent from the rinse degreaser to a micro-still to separate the contaminants from the rinse solvent and direct the purified rinse solvent to the rinse degreaser. An apparatus is also provided for cleaning contaminants from a precision component including a pre-clean module tank containing a heated solvating agent, a degreaser containing a rinsing solvent, and a micro-still which separates the contaminants from the rinsing solvent and directs the purified rinsing solvent to the rinse degreaser.Type: ApplicationFiled: March 2, 2015Publication date: January 14, 2016Inventors: Kyle J. Doyel, Michael L. Bixenman, Ram Wissel, Alan William McCready, Robert Eugene Scheidegger, Eddie Joe McChesney, Kent Dwayne Tedder
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Publication number: 20140311526Abstract: A method for cleaning a precision component by immersing the component in a heated solvating agent disposed in a pre-clean module tank to thereby remove an adherent contaminant; treating the component with a rinsing solvent to remove any remaining contaminants and residual solvating agent in a separate rinse degreaser whereby contaminants removed from the component collect in the rinse degreaser; and removing contaminated rinsing solvent from the rinse degreaser to a micro-still to separate the contaminants from the rinsing solvent and direct the rinsing solvent to the rinse degreaser. The solvent system exhibits complete miscibility of the cleaning solvent with the rinse solvent to allow for (a) complete rinsing of the cleaning solvent by the rinse solvent, and (b) the complete separation of the cleaning solvent and the rinse solvent by simple distillation.Type: ApplicationFiled: February 18, 2014Publication date: October 23, 2014Inventors: Kyle J. Doyel, Michael L. Bixenman, Ram Wissel, David T. Lober, Alan William McCready
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Publication number: 20140102486Abstract: A composition effective for removing contaminates from a manufactured product either as a concentrated material or when diluted with water. The composition designed for effective removal of all types of undesirable contaminates from a manufactured product, including but not limited to, solder flux, oils, greases, soil, and particulate matter. Depending on the nature of the process the cleaning composition maybe used in a multistep process. The composition contains propylene glycol phenyl ether and an alkali and has a pH of greater than 7.5. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.Type: ApplicationFiled: February 28, 2013Publication date: April 17, 2014Inventors: Kyle J. Doyel, Michael L. Bixenman, David T. Lober, Wayne Raney, Kevin Soucy, Ram Wissel
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Publication number: 20140048103Abstract: A method for cleaning a precision component which includes the steps of immersing the component in a heated solvating agent disposed in a pre-clean module tank to thereby remove an adherent contaminant; treating the component with a rinsing solvent to remove any remaining contaminants and residual solvating agent in a separate rinse degreaser whereby contaminants removed from the component collect in the rinse degreaser; and removing contaminated solvent from the rinse degreaser to a micro-still to separate the contaminants from the rinse solvent and direct the purified rinse solvent to the rinse degreaser. An apparatus is also provided for cleaning contaminants from a precision component including a pre-clean module tank containing a heated solvating agent, a degreaser containing a rinsing solvent, and a micro-still which separates the contaminants from the rinsing solvent and directs the purified rinsing solvent to the rinse degreaser.Type: ApplicationFiled: February 22, 2013Publication date: February 20, 2014Inventors: Kyle J. Doyel, Michael L. Bixenman, Ram Wissel, Alan William McCready, Robert Eugene Scheidegger, Eddie Joe McChesney, Kent Dwayne Tedder
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Publication number: 20130165364Abstract: A composition effective for removing solder fluxes either as a concentrated material or when diluted with water. The composition is effective in removing all types of solder fluxes including rosin type, resin type, no-clean, low residue, lead-free, organic acid and water soluble soldering fluxes. The composition comprises tripropylene glycol butyl ether and an alkali and has a pH of greater than 7.5. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.Type: ApplicationFiled: February 22, 2013Publication date: June 27, 2013Inventors: Kyle J. Doyel, Michael L. Bixenman, David T. Lober, Wayne Raney, Kevin Soucy
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Publication number: 20120152286Abstract: A composition effective for removing solder fluxes either as a concentrated material or when diluted with water. The composition is effective in removing all types of solder fluxes including rosin type, resin type, no-clean, low residue, lead-free, organic acid and water soluble soldering fluxes. The composition comprises tripropylene glycol butyl ether and an alkali and has a pH of greater than 7.5. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.Type: ApplicationFiled: December 9, 2011Publication date: June 21, 2012Applicant: Kyzen CorporationInventors: Kyle J. Doyel, Michael L. Bixenman, David T. Lober, Wayne Raney, Kevin Soucy
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Patent number: 6689734Abstract: Chemical solvating, degreasing, stripping and cleaning agents. The agents are cleaning and solvating mixtures of mono brominated compounds with highly fluorinated compounds and/or other agents that improve and enhance the properties of the original mixture. The addition of these agents to the composition will modify the physical and/or cleaning characteristics of the monobrominated compound and/or monobrominated compound-fluorinated compound mixture to accomplish is desired cleaning or solvating task. These other agents are one or more of the following materials: alcohols, esters, ethers, cyclic ethers, ketones, alkanes, terpenes, dibasic esters, glycol ethers, pyrollidones, or low or non ozone depleting chlorinated and chlorinated/fluorinated hydrocarbons.Type: GrantFiled: July 10, 2002Date of Patent: February 10, 2004Assignee: Kyzen CorporationInventors: Kyle J. Doyel, Michael L. Bixenman, Scotty S. Sengsavang, Arthur J. Thompson, Valerie G. Porter, Patricia D. Overstreet, Kristie L. Gholson
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Patent number: 6130195Abstract: Compositions and methods for cleaning, degreasing, stripping, solvating and/or removing residues and contaminants such as oils, grease, dirt, flux, inks, coatings, photoresists, resins and polymers from manufactured articles and hard surfaces such as, but not limited to metals, plastics, textiles, electronic devices, silicon wafers, mechanical devices or manufacturing equipment. The compositions contain at least one 4 carbon cyclic ether solvent mixtures with at least one 3-alkoxy 3-methyl butanol, as well as other optional alkaline materials as well as other optional solvents and additives. The compositions can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.Type: GrantFiled: November 3, 1997Date of Patent: October 10, 2000Assignee: Kyzen CorporationInventors: Kyle J. Doyel, Michael L. Bixenman, Scotty S. Sengsavang, Kristie L. Gholson, Patricia D. Overstreet, Arthur J. Thompson, Valerie G. Porter
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Patent number: 6060439Abstract: Compositions and methods for cleaning, solvating, and/or removing plastic resins and polymers or other contaminants from manufactured articles or manufacturing equipment, particularly in the production of optical lenses. The compositions contain at least one nitrogen containing compound as well as other optional solvents and additives. The compositions can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.Type: GrantFiled: September 29, 1997Date of Patent: May 9, 2000Assignee: Kyzen CorporationInventors: Kyle J. Doyel, Michael L. Bixenman, Scotty S. Sengsavang, Kristie L. Gholson, Patricia D. Overstreet, Arthur J. Thompson, Valerie G. Porter
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Patent number: 6017862Abstract: Compositions and methods for cleaning, solvating, and/or removing plastic resins and polymers or other contaminants from manufactured articles or manufacturing equipment, particularly in the production of optical lenses. The compositions contain at least one nitrogen containing compound as well as other optional solvents and additives. The compositions can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.Type: GrantFiled: September 3, 1998Date of Patent: January 25, 2000Assignee: Kyzen CorporationInventors: Kyle J. Doyel, Michael L. Bixenman, Scotty S. Sengsavang, Kristie L. Gholson, Patricia D. Overstreet, Arthur J. Thompson, Valerie G. Porter
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Patent number: 5962383Abstract: Compositions and methods for cleaning, solvating, and/or removing plastic resins and polymers or other contaminants from manufactured articles or manufacturing equipment, particularly in the production of optical lenses. The compositions contain at least one nitrogen containing compound as well as other optional solvents and additives. The compositions can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.Type: GrantFiled: September 3, 1998Date of Patent: October 5, 1999Assignee: Kyzen CorporationInventors: Kyle J. Doyel, Michael L. Bixenman, Scotty S. Sengsavang, Kristie L. Gholson, Patricia D. Overstreet, Arthur J. Thompson, Valerie G. Porter
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Patent number: 5308402Abstract: A method for removing flux residue from an electronic component using a solution having tetrahydrofurfuryl alcohol (THFA) and an activator. As activators, compounds of the formula ##STR1## are used, wherein R.sub.1, R.sub.2 and R.sub.3 are independently hydrogen, C.sub.1 -C.sub.7 alkyl, C.sub.5 -C.sub.6 cycloalkyl, furanyl which can be substituted by C.sub.1 -C.sub.7 alkyl, tetrahydrofuranyl which can be substituted by C.sub.1 -C.sub.7 alkyl, pyrrolyl, pyrrolidinyl, benzyl which can be substituted by C.sub.1 -C.sub.7 alkyl, phenyl which can be substituted by C.sub.1 -C.sub.7 alkyl, C.sub.1 -C.sub.7 alkenyl, C.sub.1 -C.sub.7 alkenyl, furfuryl which can be substituted by C.sub.1 -C.sub.7 alkyl, or tetrahydrofurfuryl which can be substituted by C.sub.1 -C.sub.7 alkyl, wherein R.sub.1, R.sub.2 and R.sub.3 can be hydroxy groups, where R.sub.1, R.sub.2 and R.sub.3 are not simultaneously hydrogen, R.sub.4 is hydrogen, C.sub.1 -C.sub.6 alkyl, C.sub.5 -C.sub.6 cycloalkyl, furanyl which can be substituted by C.sub.Type: GrantFiled: March 26, 1993Date of Patent: May 3, 1994Assignees: Kyzen Corporation, Delco Electronics CorporationInventors: Michael L. Bixenman, George C. Wolf