Abstract: To generate the adhesive distribution pattern of a multi-port layout, a die attach machine is fitted with a single port adhesive dispensing head, and is cycled off-line through a sequence of step and repeat movements in accordance with a given programmed geometry control pattern, so as to sequentially generate a multi-dot adhesive pattern. After refining, as necessary, the geometry and coordinate positions of the respective adhesive dots of the desired pattern, a multi-port dispenser is formed in which the coordinates of the dispensing tubes or nozzles of the tubes of the dispensing head coincide with those of the sequential step and repeat, pick and place pattern used to cycle the single port dispensing head. The adhesive dispensing head also incorporates one or more standoffs, to ensure uniform application of adhesive at each dot location and prevent an unwanted accumulation of adhesive around the distal ends of the dispensing tube ports.

Abstract: A pallet for conveying a plurality of ceramic leadless chip carriers (LCC) through an automated wave soldering machine. The pallet includes recesses formed to receive and contain the LDD's with the lid of the LCC facing into the recess. This results in protecting the lids from the molten solder. Additionally, the recesses are formed in a diamond orientation with a solderable pin placed at the trailing apex of each recess. Both the pin and the diamond orientation prevents solder build up on the trailing conductive pads, resulting in enhancing the coplanarity of the solder on the pads.