Abstract: A method of testing and repairing an integrated circuit having a total number of fuses for effecting repair of the integrated circuit. The method including: testing a memory array with a set of tests and reserving a first number of the total number of fuses for use in repairing the memory array based on results of the first set of tests; and shmoo testing the memory array by incrementing, decrementing or incrementing and decrementing values of a test parameter until a minimum or maximum value of the test parameter is reached that utilizes a second number of the total number of fuses for use in repairing the memory array to operate at the minimum or maximum value of the test parameter.

Abstract: A method for reducing Pin Count Test design and test that allows parametric test patterns for high pin count ASICs to be applied using low pin count testers. The same boundary scan structure used to isolate the test of internal logic to a small number of test I/O is also used to apply parametric external I/O tests to the ASIC's functional I/O. The parametric tests are banked into pin groups and applied on the same low pin count tester used for the internal logic tests.

Abstract: A method and apparatus for testing the chip-to-package connectivity of a common I/O of a semiconductor chip is disclosed which uses reduced pin count testing methods. The method includes driving a test signal transition onto a control pad of a semiconductor chip with a weak driver and comparing the transition rise time with a threshold value. For an I/O with a faulty chip-to-package connection, the rise time is much faster than for an I/O with a completed chip-to-package connection. Additional impedances may also be added to the tester fixturing to increase the sensitivity of the test equipment to the capacitance of the I/O connections.

Abstract: A method and apparatus for testing the chip-to-package connectivity of a common I/O of a semiconductor chip is disclosed which uses reduced pin count testing methods. The method includes driving a test signal transition onto a control pad of a semiconductor chip with a weak driver and comparing the transition rise time with a threshold value. For an I/O with a faulty chip-to-package connection, the rise time is much faster than for an I/O with a completed chip-to-package connection. Additional impedances may also be added to the tester fixturing to increase the sensitivity of the test equipment to the capacitance of the I/O connections.

Abstract: A method and apparatus for testing the chip-to-package connectivity of a common I/O of a semiconductor chip is disclosed which uses reduced pin count testing methods. The method includes driving a test signal transition onto a control pad of a semiconductor chip with a weak driver and comparing the transition rise time with a threshold value. For an I/O with a faulty chip-to-package connection, the rise time is much faster than for an I/O with a completed chip-to-package connection. Additional impedances may also be added to the tester fixturing to increase the sensitivity of the test equipment to the capacitance of the I/O connections.

Abstract: A method for reducing Pin Count Test design and test that allows parametric test patterns for high pin count ASICs to be applied using low pin count testers. The same boundary scan structure used to isolate the test of internal logic to a small number of test I/O is also used to apply parametric external I/O tests to the ASIC's functional I/O. The parametric tests are banked into pin groups and applied on the same low pin count tester used for the internal logic tests.

Abstract: A method and apparatus for testing the chip-to-package connectivity of a common I/O of a semiconductor chip is disclosed which uses reduced pin count testing methods. The method includes driving a test signal transition onto a control pad of a semiconductor chip with a weak driver and comparing the transition rise time with a threshold value. For an I/O with a faulty chip-to-package connection, the rise time is much faster than for an I/O with a completed chip-to-package connection. Additional impedances may also be added to the tester fixturing to increase the sensitivity of the test equipment to the capacitance of the I/O connections.

Abstract: Apparatus and method for controlling an operation of a test pin of a per-pin semiconductor device test system [10]. The apparatus includes pattern storage memory [42] for storing and for outputting information related to a state of the test pin for individual ones of a plurality of consecutive test cycles, pattern processor [14] having an input coupled to the pattern storage memory for generating for each of the test cycles words comprised of M bits, and a test pin control memory [18] having an input coupled to the output of the pattern processor for decoding each of the words into 2.sup.M or less command words. Each of the decoded command words includes a plurality of control bits. Predetermined ones of the plurality of control bits are coupled to pin driver electronics [24,28] for specifying, for each of the test cycles, at least one characteristic of an electrical signal transmitted to the test pin.