Abstract: A circuit includes a half-bridge circuit is configured to provide a switching voltage responsive to respective high-side and low-side drive signals. High-side slew control circuitry is configured to provide a high-side slew-compensated control signal responsive to a high-side enable signal and a slew current signal representative of a slew rate at a switching output. A high-side driver is configured to provide the high-side drive signal responsive to the high-side slew-compensated control signal. Low-side slew control circuitry is configured to provide a low-side slew-compensated drive signal responsive to a low-side enable signal and the slew current signal. A low-side driver is configured to provide the low-side drive signal responsive to the low-side slew-compensated control signal. A capacitor is coupled between the high-side and low-side slew control circuitry and is configured to convert the slew rate to the slew current signal.

Abstract: A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed for cross-conduction detection. An example apparatus includes a cross detector circuit including a first transistor and a second transistor, the first transistor coupled to a load, a third transistor coupled to a first controlled delay circuit and the first transistor, a fourth transistor coupled to a second controlled delay circuit and to the third transistor at a phase node, and a control circuit coupled to the first controlled delay circuit, the second controlled delay circuit, and the load.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed for cross-conduction detection. An example apparatus includes a cross detector circuit including a first transistor and a second transistor, the first transistor coupled to a load, a third transistor coupled to a first controlled delay circuit and the first transistor, a fourth transistor coupled to a second controlled delay circuit and to the third transistor at a phase node, and a control circuit coupled to the first controlled delay circuit, the second controlled delay circuit, and the load.

Abstract: A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.

Abstract: A startup circuit adapted to be coupled to an input voltage supply and operable to supply an output voltage at an output terminal, the startup circuit including: a first transistor having a first control terminal, a first current terminal and a second current terminal, the first current terminal adapted to be coupled to the input voltage supply and the second current terminal coupled to the output terminal; a precharge circuit having a first terminal, a second terminal and a third terminal, the second terminal adapted to be coupled to the input voltage supply and the third terminal coupled to the first control terminal; a current limiter coupled to the precharge circuit, the first control terminal and the second current terminal; a second transistor having a second control terminal, a third current terminal and a fourth current terminal, the third current terminal coupled to the precharge circuit and the second control terminal adapted to be coupled to a control signal; and a third transistor having a third c

Abstract: Described embodiments include a rectifier circuit comprising a first resistor with first and second resistor terminals, and a second resistor with third and fourth resistor terminals. The first and third resistor terminals are coupled to an auxiliary power terminal. A current source is coupled between the second resistor terminal and a ground terminal. An amplifier has a first amplifier input coupled to the second resistor terminal, and a second amplifier input coupled to the fourth resistor terminal. A first transistor is coupled between the fourth resistor terminal and a damping terminal, and has a first control terminal coupled to the first amplifier output. A gate drive circuit has an input coupled to the damping terminal. A second transistor is coupled between the damping terminal and a bootstrap supply terminal, and has a second control terminal coupled to an output of the gate drive circuit.

Abstract: A depletion-mode current source having a saturation current of sufficient accuracy for use as a pre-charge circuit in a start-up circuit of an AC-to-DC power converter is fabricated using an enhancement-mode-only process. The depletion-mode current source can be fabricated on the same integrated circuit (IC) as a gallium nitride field-effect transistor (FET) and resistive and capacitive components used in the start-up circuit, without affecting the enhancement-mode-only fabrication process by requiring additional masks or materials, as would be required to fabricate a depletion-mode FET on the same IC as an enhancement-mode FET. The current source includes a resistive patterned two-dimensional electron gas (2DEG) or two-dimensional hole gas (2DHG) channel coupled between two terminals and one or more metal field plates extending from one of the terminals and overlying the patterned area of the channel, the field plates being separated from the channel and from each other by dielectric layers.

Abstract: Reference voltage generation circuits and related methods are disclosed. An example reference voltage generation circuit includes a voltage generating circuit including an enhancement mode (E-mode) gallium nitride (GaN) transistor, the voltage generating circuit to, in response to a first clock signal having a first phase, generate a first voltage associated with the E-mode GaN transistor, and, in response to a second clock signal having a second phase different from the first phase, generate a second voltage associated with the E-mode GaN transistor, and a switching capacitor circuit coupled to the voltage generating circuit, the switching capacitor circuit to generate a reference voltage based on a difference between the first voltage and the second voltage.

Abstract: An IC, comprising a first rail supply, a second rail supply, an external pad coupled to one of the first rail supply and the second rail supply, and an ESD protection circuit coupled to the external pad. The ESD protection circuit includes a slew rate detector coupled to the external pad, an amplifier coupled to an output of the slew rate detector, a one-shot coupled to an output of the amplifier, and a clamp circuit coupled an output of the one-shot.

Abstract: In described examples, a device includes an interconnect substrate that has an aperture through the interconnect substrate. An integrated circuit (IC) die that has an on-chip element is mounted on the interconnect substrate with the on-chip element aligned with and facing the aperture. The IC die is over-molded with mold compound only on one side of the interconnect substrate so that the aperture remains free of mold compound to allow the on-chip element to have access to the environment.

Abstract: A permanent resist, such as TMMF, is used when patterning conductive material on a substrate, enabling lines that have a higher line-to-space ratio (L/S) or a higher aspect ratio (T/L) or both. Pattern density can thus be increased, allowing for improved performance (e.g., greater efficiency, in the case of transformer coil patterning) and greater heat dissipation. As examples, the permanent-resist-based patterning fabrication methods can be used to create transformer coils within an integrated circuit (IC) module, or a routable lead frame for one or more IC dies.

Abstract: Methods, apparatus, and systems are disclosed to drive a transistor. An example apparatus includes a regulator including a first input terminal adapted to be coupled to a control terminal of a transistor, a first output terminal, and a second output terminal, a first stage including a first input terminal coupled to the first output terminal of the regulator and an output terminal adapted to be coupled to the control terminal of the transistor, and a second stage including an input terminal coupled to the second output terminal of the regulator, and an output terminal adapted to be coupled to the control terminal of the transistor.

Abstract: Gate drivers and auto-zero comparators are disclosed. An example integrated circuit includes a transistor comprising a gate terminal and a current terminal, a gallium nitride (GaN) gate driver coupled to the gate terminal, the GaN gate driver configured to adjust operation of the transistor, and an enhancement mode GaN comparator coupled to at least one of the transistor the GaN gate driver, the enhancement mode GaN comparator configured to compare a voltage to a reference voltage, the voltage based on current from the current terminal, the GaN gate driver configured to adjust the operation of the transistor based on the comparison.

Abstract: The present invention provides a capacitor having a first structure made of a metal layer and a second structure made of the same metal layer and a dielectric layer between the first and the second metal structure, wherein the dielectric layer has a relative permittivity greater than 4, in particular greater than 6. It also provides a monolithically integrated circuit including such a capacitor and optionally other components. A method of manufacturing such a capacitor is also provided.

Abstract: Reference voltage generation circuits and related methods are disclosed. An example reference voltage generation circuit includes a voltage generating circuit including an enhancement mode (E-mode) gallium nitride (GaN) transistor, the voltage generating circuit to, in response to a first clock signal having a first phase, generate a first voltage associated with the E-mode GaN transistor, and, in response to a second clock signal having a second phase different from the first phase, generate a second voltage associated with the E-mode GaN transistor, and a switching capacitor circuit coupled to the voltage generating circuit, the switching capacitor circuit to generate a reference voltage based on a difference between the first voltage and the second voltage.

Abstract: Methods, systems, and apparatus to facilitate high side control of a switching power converter are disclosed. An example apparatus includes a latch including a first node coupled to a first source of a first switch and an output coupled to a first gate of the first switch; a first diode coupled to the first node and a second node; a second diode coupled to the second node and ground; a second switch coupled to a voltage source and the second node; and a third switch including a third gate coupled to the second switch, a third source coupled to the second node, and a third drain coupled to the latch.

Abstract: Methods, apparatus, and systems are disclosed to drive a transistor. An example apparatus includes a regulator including a first input terminal adapted to be coupled to a control terminal of a transistor, a first output terminal, and a second output terminal, a first stage including a first input terminal coupled to the first output terminal of the regulator and an output terminal adapted to be coupled to the control terminal of the transistor, and a second stage including an input terminal coupled to the second output terminal of the regulator, and an output terminal adapted to be coupled to the control terminal of the transistor.

Abstract: A startup circuit adapted to be coupled to an input voltage supply and operable to supply an output voltage at an output terminal, the startup circuit including: a first transistor having a first control terminal, a first current terminal and a second current terminal, the first current terminal adapted to be coupled to the input voltage supply and the second current terminal coupled to the output terminal; a precharge circuit having a first terminal, a second terminal and a third terminal, the second terminal adapted to be coupled to the input voltage supply and the third terminal coupled to the first control terminal; a current limiter coupled to the precharge circuit, the first control terminal and the second current terminal; a second transistor having a second control terminal, a third current terminal and a fourth current terminal, the third current terminal coupled to the precharge circuit and the second control terminal adapted to be coupled to a control signal; and a third transistor having a third c

Abstract: A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.