Abstract: Separators configured to create and use thin fluid layers, tubes, channels, or streams, multi-port collections, and one or more forces to separate and recover elements, molecules, ions, isotopes, and particles (“entities”). The separators include a support. The support may include inclined surfaces, rotatable cylinders, channels, tubes, streams or sets thereof. The separators may allow for the creation of a thin fluid layer or stream on the surface of the support or on a collection of small tubes, channels, or streams by dispensing a fluid onto the surface or collection of tubes, channels, or streams. Depending on properties of the entities to be separated, the separators can include a force application device configured to subject the entities to a magnetic field, an electrical and/or electrostatic field, a centrifugal field, an electrolytic field, an oscillating field, a hydrophobic gradient, a hydrophilic gradient, or a concentration gradient to facilitate the separations.

Abstract: Preparation and use of specialized nanoparticles containing tetrapods/graphene/metal organic frameworks, which are very effective at separating rare earth elements. Such methods and systems can be used for separating neodymium (Nd), Dysprosium (Dy), Praseodymium (Pr) and other REEs. Such metal organic frameworks may also be useful for separating other metals (e.g., so called critical metals). The metal organic framework (MOF) material is synthesized by solid phase reaction of metal oxide (e.g., ZnO) tetrapod or other nanostructured metal oxides, which are functionalized with nanoplatelet graphene, and a polyfunctional organic acid (e.g., an aromatic polycarboxylic acid). Such a resulting metallic organic framework exhibits high selectivity towards light REEs (e.g., Nd and Py), with lower selectively towards heavy REEs (e.g., Dy), allowing separation of such from one another.

Abstract: Methods of recycling excess semiconductor material removed from an unshaped semiconductor boule are disclosed. Excess semiconductor material is cut from an semiconductor unshaped boule thereby generating a shaped semiconductor boule. The excess semiconductor material is removed in the form of large pieces that can easily be cleaned and retrieved for reuse.