Patents by Inventor Michael L. Kottke

Michael L. Kottke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of forming an electronic device including a barrier layer
    Patent number: 7595257
    Abstract: An electronic device can include a substrate (12) having a primary surface (14), a second surface (16, 22) opposite the primary surface (14), and an electrode (50). In one embodiment, the electrode (50) can lie adjacent to the second surface (22) and include, a barrier layer (54) lying between a conductive layer (56) and a metal-containing layer (52), wherein the metal-containing layer (52) includes a first metallic element and not a second metal element, and the barrier layer (54) includes the second metal element and not the first metallic element. In another embodiment, an adhesion layer (52) and a conductive layer (56) can each include a metallic element, and lie immediately adjacent to a barrier layer (54). In still another embodiment, a process for forming an electronic device can include removing a portion of the substrate (12) opposite a primary surface (14).
    Type: Grant
    Filed: August 22, 2006
    Date of Patent: September 29, 2009
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Brant D. Besser, David C. Burdeaux, Michael L. Kottke, Jean B. Martin
  • Electronic device including a barrier layer and a process for forming the electronic device
    Publication number: 20080048177
    Abstract: An electronic device can include a substrate (12) having a primary surface (14), a second surface (16, 22) opposite the primary surface (14), and an electrode (50). In one embodiment, the electrode (50) can lie adjacent to the second surface (22) and include, a barrier layer (54) lying between a conductive layer (56) and a metal-containing layer (52), wherein the metal-containing layer (52) includes a first metallic element and not a second metal element, and the barrier layer (54) includes the second metal element and not the first metallic element. In another embodiment, an adhesion layer (52) and a conductive layer (56) can each include a metallic element, and lie immediately adjacent to a barrier layer (54). In still another embodiment, a process for forming an electronic device can include removing a portion of the substrate (12) opposite a primary surface (14).
    Type: Application
    Filed: August 22, 2006
    Publication date: February 28, 2008
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Brant D. Besser, David C. Burdeaux, Michael L. Kottke, Jean B. Martin