Patents by Inventor Michael L. Pawlik

Michael L. Pawlik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD HAVING AN ELECTRODEPOSITED COATING ON A CONDUCTIVE CORE WITHIN A VIA AND METHOD OF MAKING SAME
    Publication number: 20090178838
    Abstract: A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided.
    Type: Application
    Filed: January 11, 2008
    Publication date: July 16, 2009
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Alan E. Wang, Kevin C. Olson, Michael L. Pawlik