Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract: Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.

Abstract: Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract: A retention mechanism which may include a pair of flexible tabs. The flexible tabs may be pressed into opposing side edges of a substrate which supports an integrated circuit package. The substrate may be part of an electronic cartridge which has a cover. The flexible tab may extend through a space between the substrate and the cover such that the retention mechanism has a profile that is no greater than the cartridge. The retention mechanism may be mounted to a motherboard. The motherboard may have a connector that receives the substrate. An insertion tool can be used to plug the cartridge into the connector and couple the flexible tab to the substrate. An extraction tool can be used to pull the cartridge out of the connector and separate the substrate from the flexible tabs.

Abstract: An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a “shield” about the integrated circuit package so that any electromagnetic field that flows from the package is grounded to the substrate.

Abstract: A simplified method and apparatus for creating counterfeit-resistant labels is described. A laser is used to mark a retro-reflective material such that light only from specific directions are reflected back towards the source. During authentication of the labels, the label is tilted to verify that only light from the specific directions are reflected back towards the source.

Abstract: A simplified method and apparatus for creating counterfeit-resistant labels is described. A laser is used to mark a retro-reflective material such that light only from specific directions are reflected back towards the source. During authentication of the labels, the label is tilted to verify that only light from the specific directions are reflected back towards the source.

Abstract: An electrical connector for establishing an interconnection between the contact pads of a printed circuit board and an electrical device. The connector includes a flexible circuit that is capable of being electrically coupled to a tester, driver, or some other external electrical device. The flexible circuit has a first side and an opposite second side and includes at least one metal layer and a plurality of electrically conductive contact bumps that are attached to and protrude from the metal layer along the first side. An expandable bladder is positioned adjacent the flexible circuit and exerts a force against the second side of the flexible circuit to cause the contact bumps to physically engage with the contact pads of the printed circuit board. A gas cylinder, pump, air compressor or other fluid pressure source is operatively coupled to the bladder for causing expansion of the bladder to effect the engagement of the contact bumps of the flexible circuit with the contact pads of the printed circuit board.

Abstract: An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a "shield" about the integrated circuit package so that any electro-magnetic field that flows from the package is grounded to the substrate.

Abstract: An electrical connector for establishing an interconnection between the contact pads of a printed circuit board and an electrical device. The connector includes a flexible circuit that is capable of being electrically coupled to a tester, driver, or some other external electrical device. The flexible circuit has a first side and an opposite second side and includes at least one metal layer and a plurality of electrically conductive contact bumps that are attached to and protrude from the metal layer along the first side. An expandable bladder is positioned adjacent the flexible circuit and exerts a force against the second side of the flexible circuit to cause the contact bumps to physically engage with the contact pads of the printed circuit board. A gas cylinder, pump, air compressor or other fluid pressure source is operatively coupled to the bladder for causing expansion of the bladder to effect the engagement of the contact bumps of the flexible circuit with the contact pads of the printed circuit board.