Patents by Inventor Michael L. Steigerwald
Michael L. Steigerwald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230192724Abstract: The present subject matter relates to photomechanical compounds and methods for producing such photomechanical materials. The compound can include a solid-state compound having a formula including [Cluster1][Cluster2]. Cluster 1 can include copper and azobenzene, and Cluster 2 can include a counterion.Type: ApplicationFiled: December 22, 2022Publication date: June 22, 2023Applicant: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORKInventors: Michael L. Steigerwald, Xavier Roy, Amymarie K. Bartholomew, Ilana B. Stone
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Patent number: 10566539Abstract: Organic perylene diimide-based compounds are provided. Methods of producing the organic compounds is also provided as well as methods of their use including, among other things, their use as organic semiconductor materials.Type: GrantFiled: May 5, 2015Date of Patent: February 18, 2020Assignee: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORKInventors: Colin Nuckolls, Yu Zhong, Rongsheng Chen, Bharat Kumar, Tuan M. Trinh, Wei Wang, Michael L. Steigerwald, Xiaoyang Zhu, Shenxiong Xiao, Fay Ng, Boyuan Zhang
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Publication number: 20170186961Abstract: Organic perylene diimide-based compounds are provided. Methods of producing the organic compounds is also provided as well as methods of their use including, among other things, their use as organic semiconductor materials.Type: ApplicationFiled: May 5, 2015Publication date: June 29, 2017Applicant: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORKInventors: Colin Nuckolls, Yu Zhong, Rongshen Chen, Bharat Kumar, Tuan M. Trinh, Wei Wang, Michael L. Steigerwald, Xiaoyang Zhu, Shenxiong Xiao, Fay Ng, Boyuan Zhang
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Patent number: 8273525Abstract: Systems and methods are disclosed herein for forming defects on graphitic materials. The methods for forming defects include applying a radiation reactive material on a graphitic material, irradiating the applied radiation reactive material to produce a reactive species, and permitting the reactive species to react with the graphitic material to form defects. Additionally, disclosed are methods for removing defects on graphitic materials.Type: GrantFiled: April 29, 2010Date of Patent: September 25, 2012Assignee: The Trustees of Columbia University in the City of New YorkInventors: Sunmin Ryu, Louis E. Brus, Michael L. Steigerwald, Haitao Liu
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Publication number: 20110062422Abstract: Systems and methods are disclosed herein for forming defects on graphitic materials. The methods for forming defects include applying a radiation reactive material on a graphitic material, irradiating the applied radiation reactive material to produce a reactive species, and permitting the reactive species to react with the graphitic material to form defects. Additionally, disclosed are methods for removing defects on graphitic materials.Type: ApplicationFiled: April 29, 2010Publication date: March 17, 2011Applicant: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORKInventors: Sunmin Ryu, Louis E. Brus, Michael L. Steigerwald, Haitao Liu
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Patent number: 7021518Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that-includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.Type: GrantFiled: March 13, 2003Date of Patent: April 4, 2006Assignee: Agere Systems Inc.Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
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Patent number: 6696744Abstract: A method of manufacturing an integrated circuit and an integrated circuit employing the same. In one embodiment, the method of manufacturing the integrated circuit includes (1) conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor, (2) depositing an adhesive over an insulator coupled to a substrate of the integrated circuit and (3) forming the ferromagnetic core of the appropriate dimensions over the adhesive.Type: GrantFiled: October 15, 2001Date of Patent: February 24, 2004Assignee: Agere Systems, Inc.Inventors: Anatoly Feygenson, Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
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Patent number: 6649422Abstract: An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.Type: GrantFiled: June 21, 2001Date of Patent: November 18, 2003Assignee: Agere Systems Inc.Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
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Publication number: 20030150898Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that-includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.Type: ApplicationFiled: March 13, 2003Publication date: August 14, 2003Applicant: Agere Systems Inc.Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
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Publication number: 20020119622Abstract: The present invention provides a method of manufacturing a capacitor on a semiconductor wafer. The method comprises placing a metal nitride film, such as a tantalum nitride film, on a substrate of a semiconductor wafer. A first electrode and a dielectric layer are created from the metal nitride film by subjecting the metal nitride film to a plasma oxidation process, which forms a blended interface between the first electrode and the dielectric layer. To complete the capacitor, a second electrode is formed over the dielectric. Interconnections with other semiconductor devices may also be formed on the wafer to create an operative integrated circuit.Type: ApplicationFiled: February 27, 2001Publication date: August 29, 2002Inventors: Michael L. Steigerwald, Yiu-Huen Wong, Susan M. Zahurak
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Patent number: 6440750Abstract: A method of manufacturing an integrated circuit and an integrated circuit employing the same. In one embodiment, the method of manufacturing the integrated circuit includes (1) conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor, (2) depositing an adhesive over an insulator coupled to a substrate of the integrated circuit and (3) forming the ferromagnetic core of the appropriate dimensions over the adhesive.Type: GrantFiled: February 23, 2000Date of Patent: August 27, 2002Assignee: Agere Systems Guardian CorporationInventors: Anatoly Feygenson, Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
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Publication number: 20020037434Abstract: A method of manufacturing an integrated circuit and an integrated circuit employing the same. In one embodiment, the method of manufacturing the integrated circuit includes (1) conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor, (2) depositing an adhesive over an insulator coupled to a substrate of the integrated circuit and (3) forming the ferromagnetic core of the appropriate dimensions over the adhesive.Type: ApplicationFiled: October 15, 2001Publication date: March 28, 2002Inventors: Anatoly Feygenson, Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
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Publication number: 20010036702Abstract: An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.Type: ApplicationFiled: June 21, 2001Publication date: November 1, 2001Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
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Patent number: 6255714Abstract: An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.Type: GrantFiled: June 22, 1999Date of Patent: July 3, 2001Assignee: Agere Systems Guardian CorporationInventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
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Patent number: 6191495Abstract: For use with an integrated circuit having a substrate and an insulator coupled to the substrate, a micromagnetic device and method of manufacturing therefor. In one embodiment, the micromagnetic device includes an adhesive coupled to the insulator and a ferromagnetic core, coupled to the adhesive that forms a bond between the insulator and the ferromagnetic core, having an anisotropic property.Type: GrantFiled: April 16, 1999Date of Patent: February 20, 2001Assignee: Lucent Technologies Inc.Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
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Patent number: 6163234Abstract: A data transmission micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a data transmission circuit employing the same. In one embodiment, the micromagnetic integrated circuit includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.Type: GrantFiled: July 2, 1998Date of Patent: December 19, 2000Assignee: Lucent Technologies Inc.Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
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Patent number: 6160721Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.Type: GrantFiled: January 24, 2000Date of Patent: December 12, 2000Assignee: Lucent Technologies Inc.Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
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Patent number: 6118351Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.Type: GrantFiled: June 10, 1997Date of Patent: September 12, 2000Assignee: Lucent Technologies Inc.Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
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Patent number: 5570212Abstract: A black matrix structure suitable for use in an active matrix liquid crystal display is described. The novel antireflective black matrix comprises successive layers of zinc oxide, molybdenum, a second layer of zinc oxide and a molybdenum mirror, all of which are deposited upon the front surface of a glass substrate member. An alternative structure includes the same sequence of layering on the back surface of the molybdenum mirror. The described black matrixes reduce reflectance of incident light to less than 0.5%. A technique for the preparation of the described structure involving cathodic sputtering is also described.Type: GrantFiled: March 24, 1995Date of Patent: October 29, 1996Assignee: Lucent Technologies Inc.Inventor: Michael L. Steigerwald
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Patent number: 5566011Abstract: A black matrix structure suitable for use in an active matrix liquid crystal display is described. The novel antireflective black matrix comprises successive layers of chromium oxide, a metal selected from among chromium, tungsten, molybdenum, vanadium, iron and niobium, a second layer of chromium oxide and a chromium mirror, all of which are deposited upon the front surface of a glass substrate member. An alternate structure includes the same sequence of layering on the back surface of the chromium mirror. The described black matrixes reduce reflectance of incident light to less than 0.5%.Type: GrantFiled: December 8, 1994Date of Patent: October 15, 1996Assignee: Luncent Technologies Inc.Inventor: Michael L. Steigerwald