Abstract: An optical system can include a mirror that reflects incoming light to a sensor for detection. The position and/or orientation of the mirror can be controlled to reflect incoming light from different locations and/or directions. Position and/or orientation of the mirror may be tracked and/or detected by an optical position sensor. The position sensor can transmit a beam to a reflector on the mirror, and the reflected beam can be received by the position sensor. Characteristics of the reflected beam can be measured to determine the position and/or orientation of the mirror. For example, the beam can be used for interferometric and/or intensity measurements, which can then be correlated with a position and/or orientation of the mirror.

Abstract: Provided herein are various improvements to optical-inertial stabilization systems, such as those employed on electro-optical systems that receive or emit optical energy. In one example, a system includes an optical reference element rigidly coupled to a primary mirror. The optical reference element propagates a reference signal through optic elements that form at least a portion of an optical path corresponding to the primary mirror. A measurement of the reference signal is made after propagation through the optic elements to determine errors associated with the optical path. The system can also include inertial sensors rigidly coupled to the primary mirror and optical reference element to form an assembly. The inertial sensors are configured to measure inertial rotation of the assembly. Rotational adjustments about two axes can be produced for the assembly based at least on the inertial rotation properties to correct for disturbance or drift.

Abstract: An optical system can include a mirror that reflects incoming light to a sensor for detection. The position and/or orientation of the mirror can be controlled to reflect incoming light from different locations and/or directions. Position and/or orientation of the mirror may be tracked and/or detected by an optical position sensor. The position sensor can transmit a beam to a reflector on the mirror, and the reflected beam can be received by the position sensor. Characteristics of the reflected beam can be measured to determine the position and/or orientation of the mirror. For example, the beam can be used for interferometric and/or intensity measurements, which can then be correlated with a position and/or orientation of the mirror.

Abstract: A planar waveguide laser crystal assembly includes an optical bench and a laser crystal mount mounted on the optical bench. The laser crystal mount includes an upper housing having an interior horizontal surface and an exterior horizontal, a lower housing coupled to the upper housing and having an interior horizontal surface and an exterior horizontal surface, and a cavity defined between the interior horizontal surfaces of the upper and lower housings. A laser crystal is mounted in the cavity of the laser crystal mount. Each of the exterior horizontal surfaces of the upper and lower housings is oriented parallel to a length of the laser crystal. The laser crystal assembly further includes a heat dissipating structure thermally coupled to at least one of the exterior horizontal surfaces of the upper and lower housings to dissipate heat transferred from the laser crystal mount.

Abstract: A micro-optics assembly and a method for assembling the micro-optics assembly are provided. The micro-optics assembly may include an optical bench having an opening, a cylindrical body disposed in the opening and having a solder well, a heating element thermally coupled to the solder well, and an optical element. The optical element may include a frame having a post and a micro-optic mounted in the frame. The post may be secured in a solid solder material disposed within the solder well in the cylindrical body. The solder may be reflowable such that the micro-optics assembly is reconfigurable without the need for optical realignment components permanently mounted to the optical bench.

Abstract: A method and apparatus for coupling light from an array of optoelectronic devices to a corresponding array of fibers contained in a fiber optic ferrule is disclosed. The fibers may be single-mode or multi-mode optical fibers. The method includes fixing the fiber optic ferrule to the optical subassembly (OSA) base upon which the array of optoelectronic devices will be affixed, aligning the array of optoelectronic devices to the corresponding array of fibers, then securing the array of optoelectronic devices to the OSA base. In one embodiment, the module includes an optical subassembly module housing a linear array of 1300 nm VCSELs or photodetectors, spaced apart at a 250 micron pitch to correspond to the spacing of optical fibers in a conventional MT ferrule. The array of optoelectronic devices is mounted on a substrate assembly that includes a weldable surface and one or more photodetectors for automatic power control.

Abstract: A method and apparatus for encapsulating optoelectronic devices provides for accurately positioning and shaping an encapsulant by actively referencing the device die upon which the optoelectronic devices are formed. A molding tool is accurately aligned to the optoelectronic devices in the x, y and &thgr; directions using mechanical guides and is aligned in the z direction by actively referencing the device die. The shaped encapsulant is preferably an angled wedge having a minimum thickness over the optoelectronic devices to provide a high coupling efficiency and an increased thickness in other portions to fully encapsulate wire bond connections, for example. The method also provides for using the mechanical guides to align and couple optical fibers to the optoelectronic devices. In one exemplary embodiment, the end face of the optical fiber forms a conterminous interface with the top surface of the encapsulant, and the interface is obliquely angled with respect to the surface of the device die.

Abstract: A method and apparatus for encapsulating optoelectronic devices provides for accurately positioning and shaping an encapsulant by actively referencing the device die upon which the optoelectronic devices are formed. A molding tool is accurately aligned to the optoelectronic devices in the x, y and &thgr; directions using mechanical guides and is aligned in the z direction by actively referencing the device die. The shaped encapsulant is preferably an angled wedge having a minimum thickness over the optoelectronic devices to provide a high coupling efficiency and an increased thickness in other portions to fully encapsulate wire bond connections, for example. The method also provides for using the mechanical guides to align and couple optical fibers to the optoelectronic devices. In one exemplary embodiment, the end face of the optical fiber forms a conterminous interface with the top surface of the encapsulant, and the interface is obliquely angled with respect to the surface of the device die.