Abstract: A cathode for a planar magnetron sputtering device has a housing which has a side with adjacent inner and outer surfaces, the outer surface being provided with a target mounting surface partially defined by opposed side edges extending along it. The housing also has an elongated cavity partially defined by the side. Clamps are provided to removably retain a target on the target mounting surface. A row of parallel, spaced apart, elongated magnet wafers are disposed in the cavity. The row is substantially equal in length to the length of the target mounting surface. Each pole of each of the magnets is disposed immediately adjacent the inner surface of the side, so that a substantially uniform magnetic field can extend directly from the row to adjacent to, and parallel with, an exposed surface of a target position on the target mounting surface. Additionally, shields which are normally grounded during operation of the cathode, are provided to minimize parasitic sputtering.