Abstract: A method and apparatus to obtain very accurate measurements of the perimeter of a person's head scanning with an optical device; transmitting the scanned data to one or more processors which translate the measurements as precise three-dimensional data wherein an x-y plane is defined as the beginning or lower edge of the conformal cap from which a z-axis extends orthogonally in a upwardly direction towards the crown of a person's head. The three-dimensional data may be further processed to a suitable format for transmission to a transformation tool that moves one or more actuators to create an accurate three-dimensional mold of the person's head, upon which fabric or foam can be applied to create an accurate conformal cap for subsequent uses.

Abstract: The present invention relates to an opto-electronic system including an opto-electronic module and a cage assembly for electrically connecting and securing the electronic module to a host computer device. Corresponding mechanical features are provided on the module and the cage assembly to prevent modules from being plugged into incompatible cage assemblies.

Abstract: The invention relates to a high density small form factor opto-electronic transceiver system in which the module housing and guide rail from a large form factor transceiver system, e.g. an X2 transceiver, are used to house a plurality of small form factor transceivers. Ideally up to four independently functioning pluggable small form factor transceivers are plugged into the module housing of the larger form factor transceiver, which has been modified to form a shell. The shell houses a printed circuit board, which has a plurality of electrical connectors on one end for receiving the transceivers, and a single electrical connector on the other end for plugging into a host system.

Abstract: The invention relates to an optical transceiver system for use in a host device including an optical transceiver receptacle or cage with a heat dissipating structure mounted thereon. The heat dissipating structure is electronically powered by an external source in the host device, which are electrically connected by insertion of a transceiver module into the transceiver receptacle. The present invention enables optical transceivers to support very high data rates, e.g. >8 Gb/s, while still supporting very high density applications, e.g. SFF/SFP. Actuating features on the transceiver module and cage enable the heat dissipating structure to be turned on when the transceiver module is fully inserted into the cage, and turned off when the transceiver module is removed or at least partially removed from the cage.

Abstract: The invention relates to a bail latching device for an opto-electronic transceiver, including a pivotal latching member and a bail. The bail includes ends extending at an acute angle from a plane defined by the side arms for pivoting the latching member when the bail is rotated from a rest position to a removal position. Ideally, in the rest position, the side arms of the bail extend downwardly on each side of a front end of the transceiver. In the removal position, the bail is parallel to a removal direction, whereby the bail rotates the latching member to an unlatching position and then provides a handle to grasp while removing the transceiver from a standard cage.

Abstract: The invention relates to a bail latching device for an opto-electronic transceiver, including a pivotal latching member and a bail. The bail includes ends extending at an acute angle from a plane defined by the side arms for pivoting the latching member when the bail is rotated from a rest position to a removal position. Ideally, in the rest position, the side arms of the bail extend downwardly on each side of a front end of the transceiver. In the removal position, the bail is parallel to a removal direction, whereby the bail rotates the latching member to an unlatching position and then provides a handle to grasp while removing the transceiver from a standard cage.

Abstract: An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.

Abstract: An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.

Abstract: An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.

Abstract: A new approach to providing thousands of contacts between electronic packages and their next package level by use of small formed spring contact elements (SCE) retained within a interposer structure or soldered directly into a printed circuit board or onto the module is disclosed. Each contact element can be either a signal or power line and, for improved electrical performance, alternate both horizontally and vertically in an orthogonal grid such that no signalling is adjacent to another signal. The spring contact elements (SCE) have multiple cross-sectional shapes and are pre-formed for improved mechanical performance. A retainer contains the multiplicity of SCE while providing a air plenum for improved thermal performance.

Abstract: A method of manufacturing thousands of contacts between electronic packages and their next package level by use of small wires retained within a interposer structure or soldered directly into a printed circuit board or onto the module. Each wire can be either a signal or power connection. The wires may have multiple cross-sectional shapes compared to one another and are preformed before assemble into an array retainer. The retainers contain the multiplicity of wires and are used for additional process steps and as the final housing of the connector assembly.

Abstract: An improved electronic cooling module having thermally optimized and fully integrated vertical water channels located between pistons. The water channels include directed jets matched to the piston localized performance and an inner tube locally attached to the channel hole providing parallel convective surfaces.

Abstract: A thermally optimized piston for use in a liquid cooled module. The thermally optimized piston has three distinctive sections, an upper tapered section, a central cylindrical section, and a lower diverging section. In a preferred embodiment, the thermally optimized piston is provided as part of an improved electronic module. The improved electronic module includes enhanced convective cooling channels disposed between the pistons.

Abstract: A thermally optimized piston for use in a liquid cooled module. The thermally optimized piston has three distinctive sections, an upper tapered section, a central cylindrical section, and a lower diverging section. In a preferred embodiment, the thermally optimized piston is provided as part of an improved electronic module. The improved electronic module includes enhanced convective cooling channels disposed between the pistons.

Abstract: A cold plate and an integrated circuit cooling module embodying a cross-hatch coolant flow distribution scheme. Cross hatch flow distribution is achieved by way of two sets of channels which run perpendicular to each other. The first set of channels is formed on a base plate. The second, perpendicular set is includes a set of inlet channels and a set of interleaved outlet channels formed on a distribution plate. In the preferred embodiment, the base and distribution plates are separated by an interposer plate that has nozzles which cause a liquid coolant to impinge, under pressure, on the floor of the base plate.

Abstract: An otherwise conventional multi-chip circuit module called a thermal conduction module (TCM) is provided with "barrel shaped" pistons that give improved cooling for chips that may be tilted with respect to their pistons. The piston has a cylindrical mid-section and tapered end sections. The barrel shape permits the piston to tilt with the chip even though the mid-section has the desirable close fit of conventional convex face pistons. The length of the mid-section is selected to permit the piston to tilt to the angle of the taper of the ends. Because the piston can tilt with the chip, the end that contacts the chip is flat for good heat transfer. The result is improved heat transfer by a lower combined thermal resistance of the gap between piston and chip and the gap between piston and hat versus conventional pistons.

Abstract: An improved TCM-like circuit module for cooling an array of chips mounted on a substrate. The substrate and the chips are enclosed by components that include a barrier plate that separates the chip space from a coolant such as air or chilled water. A floating plate contacts a heat transfer surface of each chip and forms a local heat sink. Pins conduct heat from the floating plate. In one embodiment, one end of each pin is rigidly attached to the floating plate and the other end is located in a cavity in the barrier plate. In a second embodiment, the cavities are formed in the floating plate and the barrier plate rigidly supports the pins. In the second embodiment, the pins can be extended through the barrier plate to contact the coolant directly.