Patents by Inventor Michael La Bouff

Michael La Bouff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Accounting for the effects of dummy metal patterns in integrated circuits
    Patent number: 7254792
    Abstract: In one embodiment, a level in a process technology for an integrated circuit that has dummy metal patterns is represented as a level in a process model. The level of the process model may comprise a high-k dielectric to represent the dummy metal patterns. In the level of the process model, each metal line may be surrounded by a normal dielectric. If the process technology has voids or pockets of air in between the metal lines, then each void or air pocket may be placed in a normal dielectric in the process model. Among other advantages, this allows the process model to take into account the effects of the dummy metal patterns.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: August 7, 2007
    Assignee: Cypress Semiconductor Corporation
    Inventors: Sanjay Rekhi, Michael La Bouff