Patents by Inventor Michael LaBree

Michael LaBree has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070226976
    Abstract: An improved ultrasound transducer assembly, e.g. a thickness-mode transducer assembly includes a plurality of elements comprising piezoelectric material, and a backing material disposed adjacent to a back surface of the plurality of elements. The piezoelectric material and backing material define at least a portion of a side surface, wherein an electrically conductive material is disposed upon and in contact with at least a portion of the side surface. The elements may comprise one or a plurality of front electrodes, and one or a plurality of back electrodes, wherein the front electrode(s) is electrically interconnected to the electrically conductive material disposed on the side surface portion. In a mass processing method, a plurality of thickness-mode ultrasound probe transducer assemblies may be produced, wherein a plurality of interconnected transducer subassemblies comprising a mass backing are processed in tandem.
    Type: Application
    Filed: June 11, 2007
    Publication date: October 4, 2007
    Inventors: Michael Zipparo, Monica Johnson, Clyde Oakley, Dennis Dietz, Michael LaBree, Mark Donhowe
  • Publication number: 20070046149
    Abstract: An improved ultrasound transducer assembly, e.g. a thickness-mode transducer assembly includes a plurality of elements comprising piezoelectric material, and a backing material disposed adjacent to a back surface of the plurality of elements. The piezoelectric material and backing material define at least a portion of a side surface, wherein an electrically conductive material is disposed upon and in contact with at least a portion of the side surface. The elements may comprise one or a plurality of front electrodes, and one or a plurality of back electrodes, wherein the front electrode(s) is electrically interconnected to the electrically conductive material disposed on the side surface portion. In a mass processing method, a plurality of thickness-mode ultrasound probe transducer assemblies may be produced, wherein a plurality of interconnected transducer subassemblies comprising a mass backing are processed in tandem.
    Type: Application
    Filed: August 23, 2005
    Publication date: March 1, 2007
    Inventors: Michael Zipparo, Monica Johnson, Clyde Oakley, Dennis Dietz, Michael LaBree, Mark Donhowe
  • Patent number: 5497214
    Abstract: A camera mount wherein a support boss is arranged for selective engagement of an available support post, and the support boss includes an articulated linkage arm system, including first and second levers secured to the support boss, with the second lever secured to a first rotative member, and the first rotative member is secured to a second rotative member that in turn is secured to a third rotative member spaced from the second rotative member, and the third rotative member has extending therefrom a support plate for supporting a camera thereon.
    Type: Grant
    Filed: July 11, 1994
    Date of Patent: March 5, 1996
    Inventor: Michael A. Labree
  • Patent number: D363945
    Type: Grant
    Filed: March 31, 1994
    Date of Patent: November 7, 1995
    Inventor: Michael A. LaBree