Abstract: A binder for building materials comprising cement and mineral grinding additives, said grinding additives containing ash of burned refuse. Relative to the binder, the ash of burned refuse has a weight percent of 0.005 to 0.4 and a Blaine specific surface area of 1500 cm2/g to 6000 cm2/g.

Abstract: An adapter tool configured to be attached to a loadport of a wafer handling system includes a support member and first and second guiding elements attached to the support member and being juxtaposed to each other. The first guiding element is arranged for placing a first wafer magazine, and the second guiding element is arranged for placing a second wafer magazine. The adapter tool further includes a housing supported by the support member and configured to house the first and the second wafer magazines, respectively, and first and second openings in the housing, respectively. The first and second openings are aligned with the first and second guiding elements.

Abstract: One aspect of the invention relates to a semiconductor module with an outer housing having four side walls, and a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side. A semiconductor chip is arranged on the upper side and in the outer housing. A first gripping socket, which is formed as an indentation, extends from the outer side of the outer housing into a first of the side walls.

Abstract: An adapter tool configured to be attached to a loadport of a wafer handling system includes a support member and first and second guiding elements attached to the support member and being juxtaposed to each other. The first guiding element is arranged for placing a first wafer magazine, and the second guiding element is arranged for placing a second wafer magazine. The adapter tool further includes a housing supported by the support member and configured to house the first and the second wafer magazines, respectively, and first and second openings in the housing, respectively. The first and second openings are aligned with the first and second guiding elements.

Abstract: An adapter tool that is configured to be attached to a loadport of a wafer handling system includes a support member, and first and second guiding elements supported by the support member. The first and second guiding elements are arranged for placing a first wafer magazine and a second wafer magazine, respectively. The adapter tool further includes a housing supported by the support member that is configured to house the first and the second wafer magazines, respectively, and first and second openings in the housing, respectively. The first and second openings are aligned with the first and second guiding elements.

Abstract: A measuring device for accommodating and electrically contacting a device under test to be tested in cooperation with a test apparatus, the measuring device comprising a casing comprising a first interface member being electrically couplable to the test apparatus when the test apparatus is connected to a test plug of the casing, and an exchangeable connector configured to be exchangeably assembled with the casing and comprising a second interface member being electrically couplable to a device under test when located at a device under test receptacle of the connector, wherein the first interface member and the second interface member are configured for establishing an electrically conductive connection from the device under test receptacle to the test plug upon assembling the connector with the casing.

Abstract: An etching device is provided, the etching device including a process chamber including an etchant, a structure configured to provide a laminar flow of the etchant, and a workpiece handler configured to move a workpiece through the laminar flow of the etchant along a predefined track.

Abstract: An adapter tool that is configured to be attached to a loadport of a wafer handling system includes a support member, and first and second guiding elements supported by the support member. The first and second guiding elements are arranged for placing a first wafer magazine and a second wafer magazine, respectively. The adapter tool further includes a housing supported by the support member that is configured to house the first and the second wafer magazines, respectively, and first and second openings in the housing, respectively. The first and second openings are aligned with the first and second guiding elements.

Abstract: One aspect of the invention relates to a semiconductor module with an outer housing having four side walls, and a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side. A semiconductor chip is arranged on the upper side and in the outer housing. A first gripping socket, which is formed as an indentation, extends from the outer side of the outer housing into a first of the side walls.

Abstract: An etching device is provided, the etching device including a process chamber including an etchant, a structure configured to provide a laminar flow of the etchant, and a workpiece handler configured to move a workpiece through the laminar flow of the etchant along a predefined track.