Patents by Inventor Michael Laughner
Michael Laughner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11545597Abstract: A light emitting device includes an LED having a (e.g., top) light output surface, a ceramic phosphor, and an adhesive layer positioned to attach the top of the LED to the ceramic phosphor. In one embodiment the adhesive layer is composed of multiple separate patches (regions) that define at least one channel therebetween, with the channel being open to an environment to permit oxygen permeation. The adhesive layer can be applied by a patternable dispensing system.Type: GrantFiled: September 26, 2019Date of Patent: January 3, 2023Assignee: Lumileds LLCInventors: Daniel Bernardo Roitman, Michael Laughner
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Patent number: 11233175Abstract: Devices and techniques are disclosed herein which include a first LED device layer, a second LED device layer, and an adhesive bondline disposed between the first LED device layer and the second LED device layer. The adhesive bondline includes a bondline thickness, a plurality of spacers disposed within the adhesive bondline, and a silicone matrix. The plurality of spacers may have a diameter or a shortest axis between 0.5 and 10 micrometers and the coefficient of variation is 10% or less. The plurality of spacers may be include SiO2, alumina, soda lime glass, may be inorganic, or polymeric.Type: GrantFiled: February 19, 2020Date of Patent: January 25, 2022Assignee: LUMILEDS LLCInventors: Daniel Bernardo Roitman, Sujan-Ehsan Wadud, Michael Laughner, William David Collins, III, Darren Dunphy, Prashant Kumar Singh
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Publication number: 20200194629Abstract: Devices and techniques are disclosed herein which include a first LED device layer, a second LED device layer, and an adhesive bondline disposed between the first LED device layer and the second LED device layer. The adhesive bondline includes a bondline thickness, a plurality of spacers disposed within the adhesive bondline, and a silicone matrix. The plurality of spacers may have a diameter or a shortest axis between 0.5 and 10 micrometers and the coefficient of variation is 10% or less. The plurality of spacers may be include SiO2, alumina, soda lime glass, may be inorganic, or polymeric.Type: ApplicationFiled: February 19, 2020Publication date: June 18, 2020Applicant: LUMILEDS HOLDING B.V.Inventors: Daniel Bernardo ROITMAN, Sujan-Ehsan WADUD, Michael LAUGHNER, William COLLINS, Darren DUNPHY, Prashant Kumar SINGH
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Publication number: 20200105979Abstract: A light emitting device includes an LED having a (e.g., top) light output surface, a ceramic phosphor, and an adhesive layer positioned to attach the top of the LED to the ceramic phosphor. In one embodiment the adhesive layer is composed of multiple separate patches (regions) that define at least one channel therebetween, with the channel being open to an environment to permit oxygen permeation. The adhesive layer can be applied by a patternable dispensing system.Type: ApplicationFiled: September 26, 2019Publication date: April 2, 2020Inventors: Daniel Bernardo ROITMAN, Michael LAUGHNER
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Patent number: 10600937Abstract: Devices and techniques are disclosed herein which include a first LED device layer, a second LED device layer, and an adhesive bondline disposed between the first LED device layer and the second LED device layer. The adhesive bondline includes a bondline thickness, a plurality of spacers disposed within the adhesive bondline, and a silicone matrix. The plurality of spacers may have a diameter or a shortest axis between 0.5 and 10 micrometers and the coefficient of variation is 10% or less. The plurality of spacers may be include SiO2, alumina, soda lime glass, may be inorganic, or polymeric.Type: GrantFiled: September 17, 2018Date of Patent: March 24, 2020Assignee: LUMILEDS HOLDING B.V.Inventors: Daniel Bernardo Roitman, Sujan-Ehsan Wadud, Michael Laughner, William Collins, Darren Dunphy, Prashant Kumar Singh
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Publication number: 20200091377Abstract: Devices and techniques are disclosed herein which include a first LED device layer, a second LED device layer, and an adhesive bondline disposed between the first LED device layer and the second LED device layer. The adhesive bondline includes a bondline thickness, a plurality of spacers disposed within the adhesive bondline, and a silicone matrix. The plurality of spacers may have a diameter or a shortest axis between 0.5 and 10 micrometers and the coefficient of variation is 10% or less. The plurality of spacers may be include SiO2, alumina, soda lime glass, may be inorganic, or polymeric.Type: ApplicationFiled: September 17, 2018Publication date: March 19, 2020Applicant: Lumileds Holding B.V.Inventors: Daniel Bernardo Roitman, Sujan-Ehsan Wadud, Michael Laughner, William Collins, Darren Dunphy, Prashant Kumar Singh
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Patent number: 9142663Abstract: Methods of forming silicon carbide power devices are provided. An n? silicon carbide layer is provided on a silicon carbide substrate. A p-type silicon carbide well region is provided on the n? silicon carbide layer. A buried region of p+ silicon carbide is provided on the p-type silicon carbide well region. An n+ region of silicon carbide is provided on the buried region of p+ silicon carbide. A channel region of the power device is adjacent the buried region of p+ silicon carbide and the n+ region of silicon carbide. An n? region is provided on the channel region and a portion of the n? region is removed from the channel region so that a portion of the n? region remains on the channel region to provide a reduction in a surface roughness of the channel region.Type: GrantFiled: September 10, 2014Date of Patent: September 22, 2015Assignee: Cree, Inc.Inventors: Mrinal K. Das, Michael Laughner
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Publication number: 20150028354Abstract: Methods of forming silicon carbide power devices are provided. An n? silicon carbide layer is provided on a silicon carbide substrate. A p-type silicon carbide well region is provided on the n? silicon carbide layer. A buried region of p+ silicon carbide is provided on the p-type silicon carbide well region. An n+ region of silicon carbide is provided on the buried region of p+ silicon carbide. A channel region of the power device is adjacent the buried region of p+ silicon carbide and the n+ region of silicon carbide. An n? region is provided on the channel region and a portion of the n? region is removed from the channel region so that a portion of the n? region remains on the channel region to provide a reduction in a surface roughness of the channel region.Type: ApplicationFiled: September 10, 2014Publication date: January 29, 2015Inventors: Mrinal K. Das, Michael Laughner
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Patent number: 8859366Abstract: Methods of forming silicon carbide power devices are provided. An n? silicon carbide layer is provided on a silicon carbide substrate. A p-type silicon carbide well region is provided on the n? silicon carbide layer. A buried region of p+ silicon carbide is provided on the p-type silicon carbide well region. An n+ region of silicon carbide is provided on the buried region of p+ silicon carbide. A channel region of the power device is adjacent the buried region of p+ silicon carbide and the n+ region of silicon carbide. An n? region is provided on the channel region and a portion of the n? region is removed from the channel region so that a portion of the n? region remains on the channel region to provide a reduction in a surface roughness of the channel region.Type: GrantFiled: May 14, 2012Date of Patent: October 14, 2014Assignee: Cree, Inc.Inventors: Mrinal K. Das, Michael Laughner
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Publication number: 20120228638Abstract: Methods of forming silicon carbide power devices are provided. An n? silicon carbide layer is provided on a silicon carbide substrate. A p-type silicon carbide well region is provided on the n? silicon carbide layer. A buried region of p+ silicon carbide is provided on the p-type silicon carbide well region. An n+ region of silicon carbide is provided on the buried region of p+ silicon carbide. A channel region of the power device is adjacent the buried region of p+ silicon carbide and the n+ region of silicon carbide. An n? region is provided on the channel region and a portion of the n? region is removed from the channel region so that a portion of the n? region remains on the channel region to provide a reduction in a surface roughness of the channel region.Type: ApplicationFiled: May 14, 2012Publication date: September 13, 2012Inventors: Mrinal K. Das, Michael Laughner
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Patent number: 8188483Abstract: Power devices are provided including a p-type conductivity well region and a buried p+ conductivity region in the p-type conductivity well region. An n+ conductivity region is provided on the buried p+ conductivity region. A channel region of the power device is provided adjacent the buried p+ conductivity region and n+ conductivity region, the channel region of the power device having a root mean square (RMS) surface roughness of less than about 1.0 ?.Type: GrantFiled: April 16, 2009Date of Patent: May 29, 2012Assignee: Cree, Inc.Inventors: Mrinal K. Das, Michael Laughner
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Patent number: 7943952Abstract: Methods for fabricating LED packages comprising providing an LED chip and covering at least part of it with a liquid medium. An optical element is provided and placed on the liquid medium. The optical element is allowed to settle to a desired level and the liquid medium is cured. LED packages are also disclosed that are fabricated using the disclosed methods.Type: GrantFiled: July 27, 2007Date of Patent: May 17, 2011Assignee: Cree, Inc.Inventors: Ban P. Loh, Nicholas W. Medendorp, Jr., Peter Andrews, Yankun Fu, Michael Laughner, Ronan Letoquin
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Publication number: 20090261351Abstract: Power devices are provided including a p-type conductivity well region and a buried p+ conductivity region in the p-type conductivity well region. An n+ conductivity region is provided on the buried p+ conductivity region. A channel region of the power device is provided adjacent the buried p+ conductivity region and n+ conductivity region, the channel region of the power device having a root mean square (RMS) surface roughness of less than about 1.0 ?.Type: ApplicationFiled: April 16, 2009Publication date: October 22, 2009Inventors: Mrinal K. Das, Michael Laughner
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Patent number: 7528040Abstract: Methods of forming silicon carbide power devices are provided. An n? silicon carbide layer is provided on a silicon carbide substrate. A p-type silicon carbide well region is provided on the n? silicon carbide layer. A buried region of p+ silicon carbide is provided on the p-type silicon carbide well region. An n+ region of silicon carbide is provided on the buried region of p+ silicon carbide. A channel region of the power device is adjacent the buried region of p+ silicon carbide and the n+ region of silicon carbide. An n? region is provided on the channel region and a portion of the n? region is removed from the channel region so that a portion of the n? region remains on the channel region to provide a reduction in a surface roughness of the channel region.Type: GrantFiled: May 24, 2005Date of Patent: May 5, 2009Assignee: Cree, Inc.Inventors: Mrinal K. Das, Michael Laughner
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Patent number: 7422634Abstract: A high quality single crystal wafer of SiC is disclosed. The wafer has a diameter of at least about 3 inches, a warp of less than about 5 ?m, a bow less than about 5 ?m, and a total thickness variation of less than about 2.0 ?m.Type: GrantFiled: April 7, 2005Date of Patent: September 9, 2008Assignee: Cree, Inc.Inventors: Adrian Powell, William H. Brixius, Robert Tyler Leonard, Davis Andrew McClure, Michael Laughner
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Publication number: 20070219321Abstract: Olefinic interpolymer compositions comprising the olefinic interpolymer, residuals from a transition metal catalyst and boron containing activator package, and a charge dissipation modifier and methods for making them. The compositions have dissipation factors that are at least 50% less than the corresponding olefinic interpolymer compositions which have not been treated with charge dissipation modifiers. The compositions are useful in wire and cable applications.Type: ApplicationFiled: May 22, 2007Publication date: September 20, 2007Applicant: Dow Global Technologies Inc.Inventors: Carlos Ortiz, Peter Fox, Raymond Laakso, Gary Marchand, Steven Oriani, Walter Schmiegel, Michael Laughner, Deepak Parikh
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Publication number: 20070203314Abstract: Shear-thinning ethylene/?-olefin and ethylene/?-olefin/diene monomer interpolymers that do not include a traditional branch-inducing monomer such as norbornadiene are prepared at an elevated temperature in an atmosphere that has little or no hydrogen using a constrained geometry complex catalyst and an activating cocatalyst.Type: ApplicationFiled: February 20, 2007Publication date: August 30, 2007Inventors: Larry Cady, Morgan Hughes, Michael Laughner, Larry Meiske, Deepak Parikh
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Publication number: 20060287415Abstract: Olefinic interpolymer compositions comprising the olefinic interpolymer, residuals from a transition metal catalyst and boron containing activator package, and a charge dissipation modifier and methods for making them. The compositions have dissipation factors that are at least 50% less than the corresponding olefinic interpolymer compositions which have not been treated with charge dissipation modifiers. The compositions are useful in wire and cable applications.Type: ApplicationFiled: August 23, 2006Publication date: December 21, 2006Applicant: Dow Global Technologies Inc.Inventors: Carlos Ortiz, Peter Fox, Raymond Laakso, Gary Marchand, Steven Oriani, Walter Schmiegel, Michael Laughner, Deepak Parikh
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Publication number: 20060270103Abstract: Methods of forming silicon carbide power devices are provided. An n? silicon carbide layer is provided on a silicon carbide substrate. A p-type silicon carbide well region is provided on the n? silicon carbide layer. A buried region of p+ silicon carbide is provided on the p-type silicon carbide well region. An n+ region of silicon carbide is provided on the buried region of p+ silicon carbide. A channel region of the power device is adjacent the buried region of p+ silicon carbide and the n+ region of silicon carbide. An n? region is provided on the channel region and a portion of the n? region is removed from the channel region so that a portion of the n? region remains on the channel region to provide a reduction in a surface roughness of the channel region.Type: ApplicationFiled: May 24, 2005Publication date: November 30, 2006Inventors: Mrinal Das, Michael Laughner
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Publication number: 20060225645Abstract: A high quality single crystal wafer of SiC is disclosed. The wafer has a diameter of at least about 3 inches, a warp of less than about 5 ?m, a bow less than about 5 ?m, and a total thickness variation of less than about 2.0 ?m.Type: ApplicationFiled: April 7, 2005Publication date: October 12, 2006Inventors: Adrian Powell, William Brixius, Robert Leonard, Davis McClure, Michael Laughner