Abstract: A filter housing assembly for fluid filtration which may be attached to, and removed from, a filter base by a push-actuated release. The filter housing assembly has a top portion with an ingress port and egress port extending therefrom, and a protrusion extending from the filter housing longitudinally axial center. The ingress and egress port are formed in an hourglass shape. A filter key having a base with a groove for mating with said projection, at least one finger extending from said base, and an electronic circuit component housing attached thereto for receiving a printed circuit board, is connected to the filter housing top portion by mating said top portion protrusion with the filter key groove. Both of said ingress and egress port have at least one cavity for the passage of fluid therethrough, where each cavity is exposed in a direction facing away from the printed circuit board.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: A method, system and program product for communicating part data between an enterprise and a particular supplier of a plurality of suppliers to the enterprise are disclosed. In one embodiment, the invention provides a part number library database at the enterprise including part number detail data regarding a plurality of parts to be procured from the plurality of suppliers. The part number library database is used to generate a part number detail document file including all part number detail documents for the particular supplier, and a part number detail document add/change file including any new part number detail documents and any changed part number detail documents compared to a last generation of the part number detail document file for the particular supplier. The two files are then communicated to the particular supplier. Hence, the invention reduces duplicative work at the enterprise and ensures that the enterprise and the supplier are up-to-date on part information.