Patents by Inventor Michael Leary
Michael Leary has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230017456Abstract: In some aspects, the disclosure is directed a module for improving mechanical, electrical, or thermal performance. In some embodiments, the module includes a bottom surface, a side surface, a first solder bump disposed on the bottom surface, and a second solder bump disposed on the bottom surface. In some embodiments, the bottom surface extends in a first lateral direction and a second lateral direction perpendicular to the first lateral direction. In some embodiments, the side surface extends in a vertical direction perpendicular to the first lateral direction and the second lateral direction. In some embodiments, the second solder bump is adjacent to the side surface. In some embodiments, the first solder bump has a first length in the first lateral direction. In some embodiments, the second solder bump has a second length in the first lateral direction. In some embodiments, the first length is greater than the second length.Type: ApplicationFiled: November 29, 2021Publication date: January 19, 2023Inventors: Michael LEARY, Ah Ron LEE, Chris CHUNG, YongIk CHOI, Domingo FIGUEREDO
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Publication number: 20220165685Abstract: A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.Type: ApplicationFiled: February 9, 2022Publication date: May 26, 2022Inventors: YongIk Choi, Chris Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi, Sarah Haney, Li Sun
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Patent number: 11276650Abstract: A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.Type: GrantFiled: October 31, 2019Date of Patent: March 15, 2022Assignee: Avago Technologies International Sales Pte. LimitedInventors: YongIk Choi, Chris Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi, Sarah Haney, Li Sun
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Patent number: 11124368Abstract: A post compression carton rejection system for receiving cartons in-line from a carton assembly system having a compression conveying section for compressing folded and glued cartons for delivery to a packing system. The post compression carton rejection system comprise a frame adapted to be supported between the compression conveying section and the packing system. An infeed conveyor is mounted to the frame and has an infeed belt for transporting folded and glued cartons from the compression conveying section and an infeed drive for driving the infeed belt. An outfeed conveyor is mounted to the frame between the infeed conveyor and a conveyor exit proximate the packer, in use, and comprises a nose extension conveyor having an outfeed belt including a dump gate controllably retractable at the conveyor exit to selectively dump folded and glued cartons, an outfeed drive for driving the outfeed belt and a dump gate actuator for opening and returning the dump gate.Type: GrantFiled: March 16, 2020Date of Patent: September 21, 2021Assignee: W. H. Leary Co.Inventors: Andrew Sims, Keith Patrick Clarke, Christopher Michael Leary
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Publication number: 20210134735Abstract: A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.Type: ApplicationFiled: October 31, 2019Publication date: May 6, 2021Inventors: YongIk Choi, Chris Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi, Sarah Haney, Li Sun
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Publication number: 20210016978Abstract: A post compression carton rejection system for receiving cartons in-line from a carton assembly system having a compression conveying section for compressing folded and glued cartons for delivery to a packing system. The post compression carton rejection system comprise a frame adapted to be supported between the compression conveying section and the packing system. An infeed conveyor is mounted to the frame and has an infeed belt for transporting folded and glued cartons from the compression conveying section and an infeed drive for driving the infeed belt. An outfeed conveyor is mounted to the frame between the infeed conveyor and a conveyor exit proximate the packer, in use, and comprises a nose extension conveyor having an outfeed belt including a dump gate controllably retractable at the conveyor exit to selectively dump folded and glued cartons, an outfeed drive for driving the outfeed belt and a dump gate actuator for opening and returning the dump gate.Type: ApplicationFiled: March 16, 2020Publication date: January 21, 2021Inventors: Andrew Sims, Keith Patrick Clarke, Christopher Michael Leary
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Patent number: 9800332Abstract: An acquisition, pointing, and tracking (ATP) apparatus for free space optical (FSO) communications systems incorporates a multi-element detector array positioned at a focal plane of an optical telescope. An optical communications element lies at the center of the detector array. In lieu of traditional beam steering, the apparatus performs pointing and tracking functions internally by first calculating a position of an optical maximum on the detector array, and then translating the detector array within the focal plane of the telescope such that the optical communications element lies at the optical maximum for transmitting and/or receiving optical communications signals.Type: GrantFiled: December 29, 2014Date of Patent: October 24, 2017Assignee: Space Photonics, Inc.Inventors: Charles H. Chalfant, III, Terry Tidwell, Michael Leary, Liam Borsodi
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Publication number: 20150188628Abstract: An acquisition, pointing, and tracking (ATP) apparatus for free space optical (FSO) communications systems incorporates a multi-element detector array positioned at a focal plane of an optical telescope. An optical communications element lies at the center of the detector array. In lieu of traditional beam steering, the apparatus performs pointing and tracking functions internally by first calculating a position of an optical maximum on the detector array, and then translating the detector array within the focal plane of the telescope such that the optical communications element lies at the optical maximum for transmitting and/or receiving optical communications signals.Type: ApplicationFiled: December 29, 2014Publication date: July 2, 2015Inventors: Charles H. Chalfant, III, Terry Tidwell, Michael Leary, Liam Borsodi
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Patent number: 8995841Abstract: A system and method in the field of free space optical communications (FSOC) for overcoming atmospheric-induced spatial optical signal variations operates within each of two FSOC terminals that make up a bi-directional FSOC link, with each terminal providing the rapid adaptive beam path method over a much wider field of view than typically used for adaptive optical techniques. Each terminal uses a real-time adaptive beam-steering technique that continuously measures optical power and optical power gradients by the receiver optical detectors; this data is sent to a control system that automatically responds by re-aligning the optical system accordingly by maximizing the optical signal power measured by the optical power receiving detector.Type: GrantFiled: September 12, 2013Date of Patent: March 31, 2015Inventors: Charles H. Chalfant, III, Terry L. Tidwell, Michael Leary
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Publication number: 20060285211Abstract: A distributed Bragg reflector and a method of fabricating the same incorporates a support for supporting the gaps against collapse. The method includes forming a plurality of alternating structure and sacrificial layers on a substrate. The structure and sacrificial layers are etched into at least one mesa protruding from the substrate. A support layer is formed on the at least one mesa leaving a portion of the structure and sacrificial layers exposed. At least a portion of at least one of the exposed sacrificial layers are etched from between the structure layers to form gaps between the structure layers.Type: ApplicationFiled: August 24, 2006Publication date: December 21, 2006Inventors: Scott Corzine, Michael Tan, Chao Lin, Jintian Zhu, Michael Leary
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Publication number: 20060274805Abstract: A light generating device such as a VCSEL includes a light generation layer, a top reflector, a bottom reflector, and a high thermal conductivity (HTC) layer between the light generation layer and the bottom reflector. The light generation layer is adapted to generate light having a first wavelength. Heat produced at the light generation layer is more efficiently dissipated due to the presence of the HTC layer. Alternatively, a light generating device such as a VCSEL includes a light generation layer, a top reflector, and a high thermal conductivity (HTC) bottom reflector. Heat produced at the light generation layer is more efficiently dissipated due to the fact that the bottom reflector is a HTC DBR reflector having lower thermal resistivity than a conventional DBR reflector.Type: ApplicationFiled: August 14, 2006Publication date: December 7, 2006Inventors: Yoon Song, Michael Leary, Michael Tan
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Publication number: 20050271113Abstract: A light generating device such as a VCSEL includes a light generation layer, a top reflector, a bottom reflector, and a high thermal conductivity (HTC) layer between the light generation layer and the bottom reflector. The light generation layer is adapted to generate light having a first wavelength. Heat produced at the light generation layer is more efficiently dissipated due to the presence of the HTC layer. Alternatively, a light generating device such as a VCSEL includes a light generation layer, a top reflector, and a high thermal conductivity (HTC) bottom reflector. Heat produced at the light generation layer is more efficiently dissipated due to the fact that the bottom reflector is a HTC DBR reflector having lower thermal resistivity than a conventional DBR reflector.Type: ApplicationFiled: June 7, 2004Publication date: December 8, 2005Inventors: Yoon Song, Michael Leary, Michael Tan
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Publication number: 20050219703Abstract: A distributed Bragg reflector and a method of fabricating the same incorporates a support for supporting the gaps against collapse. The method includes forming a plurality of alternating structure and sacrificial layers on a substrate. The structure and sacrificial layers are etched into at least one mesa protruding from the substrate. A support layer is formed on the at least one mesa leaving a portion of the structure and sacrificial layers exposed. At least a portion of at least one of the exposed sacrificial layers are etched from between the structure layers to form gaps between the structure layers.Type: ApplicationFiled: May 4, 2005Publication date: October 6, 2005Inventors: Scott Corzine, Michael Tan, Chao Lin, Jintian Zhu, Michael Leary
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Publication number: 20050184303Abstract: A strain compensating structure comprises a strain compensating layer adjacent an oxide-forming layer. The strain compensating layer compensates for the change in the lattice parameter due to oxidation of at least part of the oxide-forming layer.Type: ApplicationFiled: February 25, 2004Publication date: August 25, 2005Inventors: Ashish Tandon, Michael Leary, Michael Tan, Ying-Lan Chang
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Publication number: 20050169582Abstract: An optical isolator for coupling light from a first waveguide to a second waveguide is disclosed. The optical isolator utilizes a resonator coupled to the first and second optical waveguides. The resonator has a resonance at ? for light traveling from the first optical waveguide to the second optical waveguide; however, the resonator does not have a resonance at ? for light traveling from the second waveguide to the first waveguide. The resonator can use a layer of ferromagnetic material in an applied magnetic field. The magnetic field within the ferromagnetic material varies in strength and/or direction over the layer of ferromagnetic material. The magnetic field can be generated by an external magnetic field that varies over the layer of ferromagnetic material. Alternatively, the resonator can include a layer of ferromagnetic metal that overlies a portion of the layer of ferromagnetic material and a constant external magnetic field.Type: ApplicationFiled: January 29, 2004Publication date: August 4, 2005Inventors: Michael Tan, William Trutna, David Bour, Michael Leary
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Publication number: 20050083979Abstract: A tunnel junction structure comprises an n-type tunnel junction layer of a first semiconductor material, a p-type tunnel junction layer of a second semiconductor material and a tunnel junction between the tunnel junction layers. The first semiconductor material includes gallium (Ga), nitrogen (N), arsenic (As) and is doped with a Group VI dopant. The probability of tunneling is significantly increased, and the voltage drop across the tunnel junction is consequently decreased, by forming the tunnel junction structure of materials having a reduced difference between the valence band energy of the material of the p-type tunnel junction layer and the conduction band energy of the n-type tunnel junction layer. Doping the first semiconductor material n-type with a Group VI dopant maximizes the doping concentration in the first semiconductor material, thus further improving the probability of tunneling.Type: ApplicationFiled: October 17, 2003Publication date: April 21, 2005Inventors: Michael Leary, Danny Mars, Sungwon Roh, Danielle Chamberlin, Ying-Lan Chang
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Publication number: 20050015603Abstract: A system and method for managing parallel SCSI device functionality is presented. A user sends a request to a vendor whereby the request corresponds to the user changing the functionality of one of the user's SCSI devices. The vendor generates and sends a key that includes a password and a functionality value to the user. The user extracts the password, extracts the functionality value, and includes them in a command descriptor block. The user includes the command descriptor block in a SCSI command, and sends the SCSI command to the user's SCSI device whereupon the SCSI device validates the password and reconfigures itself based upon the functionality value. The SCSI device returns a message to the user indicating whether the reconfiguring process was successful. In turn, the user forwards the message to the vendor so the vendor may bill the user accordingly.Type: ApplicationFiled: July 17, 2003Publication date: January 20, 2005Applicant: International Business Machines CorporationInventors: Rafael Cabezas, Thomas Forrer, Michael Leary, Jason Moore
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Patent number: 6091847Abstract: Apparatus for detecting etch defects in an object having a plurality of openings by generating an image signal of the object representing light intensity values of a plurality of pixels, processing the image signal to form data signals representing light intensity values of groups of pixels, filtering the data signals to remove signals representing the ends of the openings, and pairing two data signals when the groups of pixels represented thereby represent an etch defect.Type: GrantFiled: February 20, 1998Date of Patent: July 18, 2000Assignees: Sony Corporation, Sony Electronics, Inc.Inventors: Chinchuan Chiu, Philip Paolella, Michael Leary, Joseph A. Marcanio, Fusao Ishii
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Patent number: 6072900Abstract: Apparatus for detecting etch defects in an object having a plurality of openings by generating an image signal of the object representing light intensity values of a plurality of pixels, processing the image signal to form data signals representing light intensity values of groups of pixels, filtering the data signals to remove signals representing the ends of the openings, and pairing two data signals when the groups of pixels represented thereby represent an etch defect.Type: GrantFiled: November 19, 1998Date of Patent: June 6, 2000Assignees: Sony Corporation, Sony Electronics, Inc.Inventors: Chinchuan Chiu, Philip Paolella, Michael Leary, Joseph A. Marcanio, Fusao Ishii
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Patent number: 6031931Abstract: Apparatus for determining at least one edge of an object having a plurality of openings with respective edges. An imaging device generates an image signal of the object to represent light intensity values of a plurality of pixels, the image signal being processed to estimate a linear relationship derived from the light intensity values of a predetermined number of the pixels. A determining device determines whether the linear relationship includes at least one light intensity value corresponding to an edge.Type: GrantFiled: March 15, 1996Date of Patent: February 29, 2000Assignees: Sony Corporation, Sony Electronics, Inc.Inventors: Chinchuan Chiu, Philip Paolella, Michael Leary, Joseph A. Marcanio, Fusao Ishii