Patents by Inventor Michael Leins

Michael Leins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Identifying high E-field structures
    Patent number: 7149988
    Abstract: Power plane structures that may generate high E-fields can be identified and flagged for additional review by representing a boundary of the structures as a function, and evaluating the second derivative of that function. The result can be compared against a threshold value to determine if further review of the structure is desirable.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: December 12, 2006
    Assignee: Dell Products L.P.
    Inventor: Michael Leins
  • Identifying high E-field structures
    Publication number: 20060190855
    Abstract: Power plane structures that may generate high E-fields can be identified and flagged for additional review by representing a boundary of the structures as a function, and evaluating the second derivative of that function. The result can be compared against a threshold value to determine if further review of the structure is desirable.
    Type: Application
    Filed: January 26, 2005
    Publication date: August 24, 2006
    Applicant: Dell Products L.P.
    Inventor: Michael Leins
  • Method and system for reducing aggregate impedance discontinuity between expansion connectors
    Patent number: 6978333
    Abstract: A method and system are provided for reducing impedance discontinuities which occur when two expansion connectors are located very close to one another on a bus in an information handling system. An interconnect is situated between the two expansion connectors and exhibits an impedance which is selected to be sufficiently low to compensate for the amount by which the impedance of the expansion bus connectors exceeds the impedance of the expansion bus connected thereto.
    Type: Grant
    Filed: February 1, 2005
    Date of Patent: December 20, 2005
    Assignee: Dell Products L.P.
    Inventors: Ian Timmins, Michael Leins, Stuart Hayes, Robert Bassman
  • Method and system for reducing aggregate impedance discontinuity between expansion connectors
    Publication number: 20050130501
    Abstract: A method and system are provided for reducing impedance discontinuities which occur when two expansion connectors are located very close to one another on a bus in an information handling system. An interconnect is situated between the two expansion connectors and exhibits an impedance which is selected to be sufficiently low to compensate for the amount by which the impedance of the expansion bus connectors exceeds the impedance of the expansion bus connected thereto.
    Type: Application
    Filed: February 1, 2005
    Publication date: June 16, 2005
    Applicant: Dell Products L.P.
    Inventors: Ian Timmins, Michael Leins, Stuart Hayes, Robert Bassman
  • Information handling system including a bus in which impedance discontinuities associated with multiple expansion connectors are reduced
    Patent number: 6868467
    Abstract: A method and apparatus are provided for reducing impedance discontinuities which occur when two expansion connectors are located very close to one another on a bus in an information handling system. An interconnect is situated between the two expansion connectors and exhibits an impedance which is selected to be sufficiently low to compensate for the amount by which the impedance of the expansion bus connectors exceeds the impedance of the expansion bus connected thereto.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: March 15, 2005
    Assignee: Dell Products L.P.
    Inventors: Ian Timmins, Michael Leins, Stuart Hayes, Robert Bassman
  • INFORMATION HANDLING SYSTEM INCLUDING A BUS IN WHICH IMPEDANCE DISCONTINUITIES ASSOCIATED WITH MULTIPLE EXPANSION CONNECTORS ARE REDUCED
    Publication number: 20050001649
    Abstract: A method and apparatus are provided for reducing impedance discontinuities which occur when two expansion connectors are located very close to one another on a bus in an information handling system. An interconnect is situated between the two expansion connectors and exhibits an impedance which is selected to be sufficiently low to compensate for the amount by which the impedance of the expansion bus connectors exceeds the impedance of the expansion bus connected thereto.
    Type: Application
    Filed: July 3, 2003
    Publication date: January 6, 2005
    Applicant: Dell Products L.P.
    Inventors: Ian Timmins, Michael Leins, Stuart Hayes, Robert Bassman